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SMG facility – 24k Square Feet

SMG facility – 24k Square Feet. We have 7 fully automated Excellon Drilling/ Routing machines. The drilling program is generated from the customer Gerber files. Drilling.

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SMG facility – 24k Square Feet

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  1. SMG facility – 24k Square Feet

  2. We have 7 fully automated Excellon Drilling/ Routing machines. The drilling program is generated from the customer Gerber files. Drilling

  3. The Shadow process is the process of coating a conductive material inside the drilled holes. The coating leaves a thin film of electrically charged material in the holes that aids in electrico-plating. Shadow Process

  4. The process of applying the dry photo-resist film over the copper laminate surface in order to facilitate the the printing of the circuit on the boards. Film Lamination

  5. Films are made from your Gerber files. Trace patterns and pads are then transferred to the panels in the image machines you see to your left. Imaging

  6. At this stage we are developing the film we adhered to the panels in the previous process. During this process the circuit pattern is developed and excess film is also removed. Developing

  7. The next step is copper plating, where additional copper is electroplated on to the exposed circuits & inside the holes. This is done by migrating the copper from the copper anodes in the tank onto the boards using a very heavy DC Current. Copper Plating

  8. This process plates tin over the copper we just put on the board. The purpose of this is to protect the circuit during the etching process. Tin Plating

  9. First we remove the excess film from the panel to reveal the circuit pattern. Then we etch the excess copper off of the panel. Etching Process

  10. Here we remove the protective tin coating from the copper circuits. Tin Strip

  11. We inspect the boards for defects before putting on the LPI (Liquid Photoimageable Ink). Visual Inspection #1

  12. The LPI is imaged in the same way the circuit pattern was imaged earlier. LPI – Liquid Photo Imaging

  13. Now we develop the soldier mask. The Excess LPI is removed from the imaged areas. Soldier will only adhere to the exposed holes and pads as needed. These same steps are repeated for the legend. LPI - Developing

  14. Here you see one of our HASL machines. This step coats all the exposed copper holes and areas with either leaded or lead free soldier (ROHS). HASL – Hot Air Solder Leveling

  15. As an alternate to soldier we have ENIG (Electroless Nickel Immersion Gold) and Immersion Silver finishes. During this process we plate the holes and pads with a very thin layer of silver or gold. Immersion Silver & Gold Plating

  16. After the boards are visually inspected for a second time we offer several types of electrical testing for opens and shorts. Here you see the bed-of-nails tester. Electrical Testing – Bed of nails

  17. For testing dense boards, we use the flying probe tester pictured on your left. Electrical Testing – Flying probe

  18. Here is our automated Optical Inspection machine. This is ideal for very tight density boards that the human eye cannot inspect well visually. Automated Optical Inspection

  19. The plant is equipped with a complete waste water treatment facility. Strict guidelines are followed to protect the environment, heath and safety. SMG complies with all EPA standards and is inspected regularly. Waste Water Treatment

  20. Here is our Multilayer Press, we can do up to 10 layer printed circuit boards. After the inner layer are done, we laminate the panels and then follow the same process we just described for the double sided boards to produce the top and bottom layers. Multi-Layer Press

  21. We hold inventory product for blanket orders for our customers, so that their boards are ready for JIT delivery on a moment’s notice. In house stock room

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