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Introduction to Hardware/Architecture

Introduction to Hardware/Architecture. David A. Patterson. http://cs.berkeley.edu/~patterson/talks patterson@cs.berkeley.edu EECS, University of California Berkeley, CA 94720-1776. Technology Trends: Microprocessor Capacity. Alpha 21264: 15 million Pentium Pro: 5.5 million

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Introduction to Hardware/Architecture

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  1. Introduction to Hardware/Architecture David A. Patterson http://cs.berkeley.edu/~patterson/talks patterson@cs.berkeley.edu EECS, University of California Berkeley, CA 94720-1776

  2. Technology Trends: Microprocessor Capacity Alpha 21264: 15 million Pentium Pro: 5.5 million PowerPC 620: 6.9 million Alpha 21164: 9.3 million Sparc Ultra: 5.2 million Moore’s Law 2X transistors/Chip Every 1.5 years Called “Moore’s Law”:

  3. Technology Trends: Processor Performance 1.54X/yr Processor performance increase/yr mistakenly referred to as Moore’s Law (transistors/chip)

  4. 5 components of any Computer Keyboard, Mouse Computer Processor (active) Devices Memory (passive) (where programs, data live when running) Input Control (“brain”) Disk, Network Output Datapath (“brawn”) Display, Printer

  5. Computer Technology=>Dramatic Change • Processor • 2X in speed every 1.5 years; 1000X performance in last 15 years • Memory • DRAM capacity: 2x / 1.5 years; 1000X size in last 15 years • Cost per bit: improves about 25% per year • Disk • capacity: > 2X in size every 1.5 years • Cost per bit: improves about 60% per year • 120X size in last decade • State-of-the-art PC “when you graduate” (1997-2001) • Processor clock speed: 1500 MegaHertz (1.5 GigaHertz) • Memory capacity: 500 MegaByte (0.5 GigaBytes) • Disk capacity: 100 GigaBytes (0.1 TeraBytes) • New units! Mega => Giga, Giga => Tera

  6. Integrated Circuit Costs Die cost = Wafer cost Dies per Wafer * Die yield Dies Flaws Die Cost is goes roughly with the cube of the area: fewer dies per wafer * yield worse with die area

  7. Die Yield (1993 data) • Raw Dices Per Wafer • wafer diameter die area (mm2)100 144 196 256 324 400 • 6”/15cm 139 90 62 44 32 23 • 8”/20cm 265 177 124 90 68 52 • 10”/25cm 431 290 206 153 116 90 • die yield 23% 19% 16% 12% 11% 10% • typical CMOS process:  =2, wafer yield=90%, defect density=2/cm2, 4 test sites/wafer • Good Dices Per Wafer (Before Testing!) • 6”/15cm 31 16 9 5 3 2 • 8”/20cm 59 32 19 11 7 5 • 10”/25cm 96 53 32 20 13 9 • typical cost of an 8”, 4 metal layers, 0.5um CMOS wafer: ~$2000

  8. 1993 Real World Examples Chip Metal Line Wafer Defect Area Dies/ Yield Die Cost layers width cost /cm2 mm2 wafer 386DX 2 0.90 $900 1.0 43 360 71% $4 486DX2 3 0.80 $1200 1.0 81 181 54% $12 PowerPC 601 4 0.80 $1700 1.3 121 115 28% $53 HP PA 7100 3 0.80 $1300 1.0 196 66 27% $73 DEC Alpha 3 0.70 $1500 1.2 234 53 19% $149 SuperSPARC 3 0.70 $1700 1.6 256 48 13% $272 Pentium 3 0.80 $1500 1.5 296 40 9% $417 From "Estimating IC Manufacturing Costs,” by Linley Gwennap, Microprocessor Report, August 2, 1993, p. 15

  9. Processor Trends/ History • History of innovations to 2X / 1.5 yr • Pipelining (helps seconds / clock, or clock rate) • Out-of-Order Execution (helps clocks / instruction) • Superscalar (helps clocks / instruction)

  10. Pipelining is Natural! A B C D • Laundry Example • Ann, Brian, Cathy, Dave each have one load of clothes to wash, dry, fold, and put away • Washer takes 30 minutes • Dryer takes 30 minutes • “Folder” takes 30 minutes • “Stasher” takes 30 minutesto put clothes into drawers

  11. Sequential Laundry 2 AM 12 6 PM 1 8 7 11 10 9 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 T a s k O r d e r Sequential laundry takes 8 hours for 4 loads Time A B C D

  12. Pipelined Laundry: Start work ASAP 2 AM 12 6 PM 1 8 7 11 10 9 Time Pipelined laundry takes 3.5 hours for 4 loads! 30 30 30 30 30 30 30 T a s k O r d e r A B C D

  13. 30 30 30 30 30 30 30 bubble D Pipeline Hazard: Stall 2 AM 12 6 PM 1 8 7 11 10 9 Time A depends on D; stall since folder tied up T a s k O r d e r A B C E F

  14. bubble Out-of-Order Laundry: Don’t Wait 2 AM 12 6 PM 1 8 7 11 10 9 Time A depends on D; rest continue; need more resources to allow out-of-order 30 30 30 30 30 30 30 T a s k O r d e r A B C D E F

  15. 30 30 30 30 30 (light clothing) A (dark clothing) B (very dirty clothing) C (light clothing) (dark clothing) (very dirty clothing) Superscalar Laundry: Parallel per stage 2 AM 12 6 PM 1 8 7 11 10 9 Time More resources, HW match mix of parallel tasks? T a s k O r d e r D E F

  16. (light clothing) A D B C Superscalar Laundry: Mismatch Mix 2 AM 12 6 PM 1 8 7 11 10 9 Time Task mix underutilizes extra resources 30 30 30 30 30 30 30 T a s k O r d e r (light clothing) (dark clothing) (light clothing)

  17. State of the Art: Alpha 21264 • 15M transistors • 2 64KB caches on chip; 16MB L2 cache off chip • Clock <1.7 nsec, or >600 MHz • 90 watts • Superscalar: fetch up to 6 instructions/clock cycle, retires up to 4 instruction/clock cycle • Execution out-of-order

  18. Other example: Sony Playstation 2 • Emotion Engine: 6.2 GFLOPS, 75 million polygons per second (Microprocessor Report, 13:5) • Superscalar MIPS core + vector coprocessor + graphics/DRAM • Claim: “Toy Story” realism brought to games

  19. The Goal: Illusion of large, fast, cheap memory • Fact: Large memories are slow, fast memories are small • How do we create a memory that is large, cheap and fast (most of the time)? • Hierarchy of Levels • Similar to Principle of Abstraction: hide details of multiple levels

  20. Hierarchy Analogy: Term Paper • Working on paper in library at a desk • Option 1: Every time need a book • Leave desk to go to shelves (or stacks) • Find the book • Bring one book back to desk • Read section interested in • When done with section, leave desk and go to shelves carrying book • Put the book back on shelf • Return to desk to work • Next time need a book, go to first step

  21. Hierarchy Analogy: Library • Option 2: Every time need a book • Leave some books on desk after fetching them • Only go to shelves when need a new book • When go to shelves, bring back related books in case you need them; sometimes you’ll need to return books not used recently to make space for new books on desk • Return to desk to work • When done, replace books on shelves, carrying as many as you can per trip • Illusion: whole library on your desktop • Buzzword “cache” from French for hidden treasure

  22. Probability of reference 0 2^n - 1 Address Space Why Hierarchy works: Natural Locality • The Principle of Locality: • Program access a relatively small portion of the address space at any instant of time. • What programming constructs lead to Principle of Locality?

  23. Memory Hierarchy: How Does it Work? • Temporal Locality (Locality in Time):  Keep most recently accessed data items closer to the processor • Library Analogy: Recently read books are kept on desk • Block is unit of transfer (like book) • Spatial Locality (Locality in Space):  Move blocks consists of contiguous words to the upper levels • Library Analogy: Bring back nearby books on shelves when fetch a book; hope that you might need it later for your paper

  24. Central Processor Unit (CPU) Increasing Distance from CPU,Decreasing cost / MB “Upper” Level 1 Level 2 Level 3 “Lower” . . . Size of memory at each level Memory Hierarchy Pyramid Levels in memory hierarchy Level n (data cannot be in level i unless also in i+1)

  25. Big Idea of Memory Hierarchy • Temporal locality: keep recently accessed data items closer to processor • Spatial locality: moving contiguous words in memory to upper levels of hierarchy • Uses smaller and faster memory technologies close to the processor • Fast hit time in highest level of hierarchy • Cheap, slow memory furthest from processor • If hit rate is high enough, hierarchy has access time close to the highest (and fastest) level and size equal to the lowest (and largest) level

  26. Disk Description / History Track Embed. Proc. (ECC, SCSI) Sector Track Buffer Arm Head Platter 1973: 1. 7 Mbit/sq. in 140 MBytes 1979: 7. 7 Mbit/sq. in 2,300 MBytes Cylinder source: New York Times, 2/23/98, page C3, “Makers of disk drives crowd even more data into even smaller spaces”

  27. Disk History 2000: 10,100 Mb/s. i. 25,000 MBytes 2000: 11,000 Mb/s. i. 73,400 MBytes 1989: 63 Mbit/sq. in 60,000 MBytes 1997: 1450 Mbit/sq. in 2300 Mbytes (2.5” diameter) 1997: 3090 Mbit/s. i. 8100 Mbytes (3.5” diameter) source: N.Y. Times, 2/23/98, page C3

  28. Latency = Queuing Time + Controller time + Seek Time + Rotation Time + Size / Bandwidth { per access + per byte State of the Art: Ultrastar 72ZX Embed. Proc. Track • 73.4 GB, 3.5 inch disk • 2¢/MB • 16 MB track buffer • 11 platters, 22 surfaces • 15,110 cylinders • 7 Gbit/sq. in. areal density • 17 watts (idle) • 0.1 ms controller time • 5.3 ms avg. seek (seek 1 track => 0.6 ms) • 3 ms = 1/2 rotation • 37 to 22 MB/s to media Sector Cylinder Track Buffer Arm Platter Head source: www.ibm.com; www.pricewatch.com; 2/14/00

  29. A glimpse into the future? • IBM microdrive for digital cameras • 340 Mbytes • Disk target in 5-7 years?

  30. Questions? Contact us if you’re interested:email: patterson@cs.berkeley.eduhttp://iram.cs.berkeley.edu/

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