1 / 7

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [ mmWave OFDM Physical Layer Proposal (Previously TensorCom Physical Layer Proposal)] Date Submitted: [ September 19, 2007 ]

niabi
Download Presentation

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [mmWave OFDM Physical Layer Proposal (Previously TensorCom Physical Layer Proposal)] Date Submitted: [ September 19, 2007] Source:[Ismail Lakkis(1), BeomJin (Paul) Jeon(2), Hiroshi Ohue(3) , Yasuhisa (Jim) Nakajimi(4) , Ali Sadri (5) , Pascal Pagani(6) , Ekhard Grass (7) , Shuzo Kato(8) , Gary Baldwin3, Dengwei Fu3, James P. K. Gilb3, Jeff Gilbert3, Ricky Ho3, Seeongsoo Kim2, Edwin Kwon2, John Marshall3, Chiu Ngo2, Jisung Oh2, Steve Pope3, Bernard Shung3, Karim Toussi3] Company [ (1) Tensorcom, (2) LG Electronics Inc., (3) Matsushita Electric Industrial Co. (Panasonic), (4) Sony, (5) Intel, (6) France Telecom, (7) IHP, (8) NICT,(2)Samsung Electronics, Co., Ltd, (3)SiBEAM, Inc.] Address [See Next Page for Contact Info.] Voice:[], FAX: [], E-Mail:[] Re: [This submission is in response to the TG3C call for Proposals (IEEE P802.15-07-0586-02-003c)] Abstract: [Physical layer proposal for IEEE 802.15 TG3C.] Purpose: [For considereation and discussion by IEEE 802.15 TG3C.] Notice: This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P802.15. Various Authors, TG3c Proposal

  2. Contact Information • Ismail Lakkis • Tensorcom Corporation • Voice: 858-231-9753 • Email: ilakkis@tensorcom.com • Beomjin (Paul) Jeon, & YongHoon Kim • LG Electronics Inc. • Voice : 82-2-526-4065 • Email : bjjeon@lge.com , yonghkim2002@empal.com • Hiroshi Ohue • Matsushita Electric Industrial Co., Ltd. • Voice : 81-6-6905-4758 • Email : ohue.hiroshi@jp.panasonic.com • Jim Nakajima • Company: Sony Corporation • E-mail: Jim.Nakajima@jp.sony.com • Ali Sadri • Intel Corporation • Voice: 858-774-6202 • Email: ali.s.sadri@intel.com • Echard Grass • IHP • Email: grass@ihp-microelectronics.com • Pascal Pagani and Wei Li • France Telecome • Voice:+33-2-99-12-48-72 • Email: pascal.pagani@orange-ftgroup.com • Shuza Kato • NICT • Voice: +81-46-847-5083 • Shu.kato@nict.go.jp Various Authors, TG3c Proposal

  3. Contact Information • Seeongsoo Kim, Edwin Kwon, Chiu Ngo, and Jisung Oh – Samsung Electronics Co., Ltd • 416 Maetan-3Dong, Youngtong-Gu, Suwon-Shi, Gyungki-Do 443-742, Korea • seongsoo1.kim at samsung dot com, cy dot kwon at samsung dot com, chiu.ngo at samsung dot com, jisung0714.oh at samsung.com • Gary Baldwin, Dengwei Fu, James P. K. Gilb, Jeff Gilbert, Ricky Ho, John Marshall, Steve Pope, Bernard Shung, Karim Toussi – SiBEAM, Inc. • 555 N Mathilda Ave Ste 100, Sunnyvale, CA 94085, +1 408 245 3120 • gbaldwin at sibeam dot com, dfu at sibeam dot com, gilb at ieee dot org, jgilbert at sibeam dot com, kpho at sibeam dot com, spope at sibeam dot com, bshung at sibeam dot com, kntoussi at sibeam dot com • Yasuhisa Nakajima – Sony Corporation • TV Business Group, Sony Corporation • jim dot nakajima at jp dot sony dot com Various Authors, TG3c Proposal

  4. Compromise statement • Proposers agree to merge and compromise for a single OFDM proposal based on the following goals • Provide solution for CE and PC, mobile and fixed usage models within consumer and enterprise environment • Common Mode communications • Common channelization worldwide • Common set of FECs • Common set of MCSs • Intend to converge with COMPA proposal Various Authors, TG3c Proposal

  5. Appendix IPhysical Layer ProposalOFDM With Common Mode Support IEEE P802.15-07-760-01-003c Various Authors, TG3c Proposal

  6. Appendix IIProposal for HD AV and data support IEEE P802.15-07-0702-06-003c Various Authors, TG3c Proposal

  7. Appendix IIIFrance Telecom - IHP Joint Physical Layer Proposal for IEEE802.15 Task Group 3c IEEE P802.15-07-0688-01-003c (PowerPoint) IEEE P802.15-07-0689-00-003c (Word Document) Various Authors, TG3c Proposal

More Related