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Progress of the Forward Calorimeter R&D

This presentation outlines the progress of the Forward Calorimeter R&D, including LCAL and LAT status updates, results from various research groups, sensor technologies, facilities at DESY Zeuthen, and measurement techniques. Highlights include diamond and heavy crystal versions, silicon sensors, laser displacement measurements, and alternative readout methods. Detailed sensor structures, testing procedures, and collaborations with various companies/institutions are discussed.

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Progress of the Forward Calorimeter R&D

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  1. Progress of the Forward Calorimeter R&D Presented by: Igor Emeliantchik

  2. Progress of the Forward Calorimeter R&D • LCAL Status • Diamond-Tungsten Version • Results of Zeuthen Group • First Results of Minsk Group • Heavy Crystal Version • LAT Status • Silicon Sensors • Results of Prague Group • Zeuthen Silicon Facilities • Laser measurement of the LATdetector displacement

  3. Diamond Measurements by Minsk Group

  4. Test Setup Heavy Crystal Version of LCAL Cosmic Telescope Alternative: Ru-Source

  5. Lightyield fiber readout direct readout ~ 25 %

  6. Cross Talk fiber painted with black paint How much light do fibers see from other crystals

  7. Cross Talk cosmics ? but ….

  8. Preprototype Silicon Sensors (Prague) Sensor Structure Cross section Bottom view Active area cca 0.25 cm2

  9. I-V curves: Vbreak-down  Vop Ileak @ Vop < cca 30 nA/cm2 nornalized for temperature 20 C

  10. used frequency 10 kHz Vfull-depletion: substrate resistivity calculation

  11. Zeuthen Silicon Facilities • At DESYZeuthen we are able to perform (class 10k clean room): • Ultrasonic wire bonding (Au, Al, down to 17.5 µm wires) • Glueing with high mechanical precision and/or special hardening procedures (silver epoxies) • Measurements of single and double sided sensors on different probe stations • long term measurements (darkness, special atmosphere: N2 or similar) • chip testing (delivered probe cards can be adapted) • additional: electronics workshop with automatic SMD placement and soldering tools • mechanical workshop with NC machining/milling • at DESY Hamburg a ‘state of the art’ programmable wire bonder • Companies / Institutions we are used to work with: • - Sensors: CiS Erfurt (D), Micron Ltd. (UK), SINTEF Oslo (N), Hamamatsu (J) • chip design: IDE AS, Oslo (N) and ASIC Laboratory of University of Heidelberg (D) • probe cards: Wentworth Deutschland GmbH, München (D) • high precision printed circuit boards: Würth GmbH, Roth am See (D), Optiprint (CH) • thick film hybrids: Elbau GmbH, Berlin (D) Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  12. Position Measurement with Laser and CCD Camera (Cracow)

  13. Position measurement

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