1 / 15

ECB 6 Jun. 2014

ECB 6 Jun. 2014. Agenda. IBM & TSMC contracts Production of the GBT chipset and of the versatile link devices ECFA workshop on HL- LHC A.O.B Tour de table. IBM & TSMC Contracts. IBM Contract. In February IBM announced their wish to sell the foundries Visit of IBM 2 weeks ago

nydia
Download Presentation

ECB 6 Jun. 2014

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. ECB6 Jun. 2014

  2. Agenda • IBM & TSMC contracts • Production of the GBT chipset and of the versatile link devices • ECFA workshop on HL-LHC • A.O.B • Tour de table

  3. IBM & TSMC Contracts

  4. IBM Contract • In February IBM announced their wish to sell the foundries • Visit of IBM 2 weeks ago • Nigel Stoneman, Bleumicro Ltd. UK -> his company handles the CERN account and all POs are handled by him • Rich Busch Director, EMEA Semiconductor Sales, Stockholm • Gordon Farley, EMEA Semiconductor Sales,CH office • DavideTesta, CH office -> he prepares the IBM-CERN contract and handles all amendments • Explained the announcement of the sale was a rumour... • They lost profit in µelectronics but it was expected due to changes in video games • Then they said they would like the contract we have with them bemoved to MOSIS • No direct link with IBM anymore • We clearly said that from our side long term availability (up to 2020 at least) is a must • Change of contract on going (FC of September)

  5. TSMC Contract • After years of discussion, an agreement on the NDA to be signed by CERN and participating institutes was reached • Printed version of the contract signed by CERN, then sent to IMEC and signed by IMEC • May 6 • Since then with TSMC and no news... • Design kit for the 130 nm: on going • Radiation testing of the 130 nm: test chip submission this summer

  6. GBT Chipset & Versatile Link Production

  7. GBT Chipset & Versatile Link Production • Estimated quantity today probably incomplete • GBTx 41000, GBT-SCA 10000, GBLD 41000, GBTIA 15000 • VTTX 18000, VTRX 12000 • Procurement process difficult if several budget codes to be used • PH kindly agreed that we order on a PH account which should come back to zero after a while

  8. GBT Chipset • Submission of an engineering run with the 4 ASICs beginning of July • Expected to be back in November • MS and IT for crystals and packaging • MS in July, IT in September, Order in October/November • Final validation of the designs January/February • “Reasonable” quantity available for the users • Large order to follow • ~140 wafers • Large quantity available during the fall of 2015

  9. Versatile Link Components • Procurement process of the optical components has started • Note that the GBLD and the GBTIA are needed to get the VTXX • The GBTIA has to be included in the ROSA  a bit more delay • Main cost drivers are the TOSA and the ROSA

  10. Price List • Chips and VTXX will be sold to the experiments at the following price: • GBTX 50 CHF • GBT-SCA 24 CHF • VTTX 150 CHF • VTRX 200 CHF • Pledge letters from the experiments requested when we place big orders

  11. What is required from the Elec. Coord.? • Take note of the price list and use it • Check it’s properly budgeted in the projects • Refine quantities • We shall order additional devices to take into account yield and the unforeseen needs but the more we know, the better it is • Check that getting pledge letters is OK from your experiment

  12. ECFA Workshop Next October

  13. Slide from Phil Allport

  14. Slide from Phil Allport

  15. Electronics PG • Summary of the first SG meeting (from Magnus) • The group should organize Electronics Systems, ASICs, High Bandwidth links, High Density Inter-connects, Power systems, Modular electronics, and xTCA. • The group should include requirements and talks from all systems, thus no or very little overlap with subsystem/detector class sessions that will NOT include electronics. We have 3 full hours. Lots of work. • We need to prepare a group mailing list and organize meetings as required. • Typically: Magnus, Philippe, Ken and Alex. • This time we are suggested to be more inclusive, thus add any number of participants to the preparatory group. • Tentative schedule: • End June: preparatory group definition • End July: Talks definition • September: Agenda with agreed speakers

More Related