1 / 42

Growing Degree Day Monitor

Growing Degree Day Monitor. Group 26 Anthony De Roo , John Habegger , Jay Zhaoyu Yao ECE 445 May 2, 2014. Introduction. Growing degree day monitor (GDDM) provides a cost effective solution to track crop maturation throughout the growing season

obert
Download Presentation

Growing Degree Day Monitor

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Growing Degree Day Monitor Group 26 Anthony De Roo, John Habegger, Jay Zhaoyu Yao ECE 445 May 2, 2014

  2. Introduction Growing degree day monitor (GDDM) provides a cost effective solution to track crop maturation throughout the growing season Integrates temperature sensors, a microcontroller, flash memory, USB, and display in order to record cumulative growing degree days

  3. Features Temperature collection and data computation Initiate degree day calculation when soil reaches germination temperature Temperature data logged during the course of season Displays instant degree day status Solar and battery powered USB interface

  4. GDDM Initial Concept

  5. GDDM Case Interior

  6. Case Dimensions Bud Industries. (4 February 2014). Tablet Enclosure, TB-32610-W [online] Available: http://www.budind.com/pdf/hb32610.pdf

  7. Printed Circuit Board

  8. System Overview • Hardware: • Power Module: Solar Panel, Switch FETs, Rechargeable Batteries, Voltage Regulator • User Interface: Display Driver, 7-Segment Displays, Push Button • Controller Module: Microcontroller (TI MSP430), Flash Memory • Sensor Module: Temperature Transducer Soil (Ground), Temperature Transducer Air (Ambient) • I/O Interface: USB Hardware

  9. System Overview Software: • Power Module: Activate Solar Panels to Charge Batteries • User Interface: Display Driver, Status LED Illumination • Controller Module: Write and Read to the Flash Memory • Sensor Module: A/D Voltage to Temperature Conversion • I/O Interface: USB Data Transfer, Java GDDM Program

  10. System Overview (Signals)

  11. System Overview (Power)

  12. Power Module Solar Panels • Charge batteries during day • Provide up to 6V of voltage (6V in full sun, 5.3V in overcast) • Current provided at 50mA Batteries • Produce 4.8V to circuit to drive display, monitor LEDs, and sensor • 700mAH of capacity to last for several days Switch FETS • Signal from MSP430 delivers charge enable signal, connecting solar panels to battery • Monitored by 2:1 voltage divider across panels and batteries Voltage Regulator • Produce 3.3V of voltage up to 150mA • Power MSP430, display drivers, and flash memory

  13. Power Analysis

  14. Solar Charging Calculations

  15. User Interface Display Driver • Each drive 2 7-segment displays • Segment current set by limiting resister Seven Segment Display • Displays growing degree day number Display Button • Interrupt high to low transition • Displays 7-segment display for 5 seconds Status LED • Blinking 15 second timer.

  16. Expanded User Interface

  17. Control Module MSP430F5510IPT 4 A/D lines to monitor sensors and power voltage divider SPI to need to interface with flash chip General purpose I/O pins to drive display, enable charging, and indicate device status Real time clock (RTC) support Easy to program USB support

  18. Control Module Flash Memory Must be able to write daily temperature records to the memory Needs to use Serial Peripheral Interface (SPI) communication Total storage of 512 kB across 8 sectors 256 B page size Can only write 1 to 0 unless on delete operation

  19. Sensor Module 2 Temperature Sensors Ground and ambient air temperatures Ground temperature sensor purpose Frequency of readings Calibration Methods

  20. I/O Interface Module USB Process • Initiation and communicate with GDDM • Enumeration with host computer GDDM Java Program • Send commands and receive data • Commands to interact with the GDDM

  21. Verification and Testing Hardware requirements verified through multimeter using test points Software requirements verified through TI Code Composer using MSP430 FET tool

  22. The GDDM Device (Top View)

  23. The GDDM Device (Rear View)

  24. Single Prototype Cost

  25. Commercial Market Manufacturing • PCB costs to roughly $10 a board • Case and stand costs at $15 • Economies of scale on components for $30 • Automated build process • Pick and place • Reflow • Automated testing with bed of nails and chip flashing Target Market • Individuals tracking growing conditions (farmers, gardeners, etc.) • 2.2 million farmers in the United States USDA. 2007 Census of Agriculture [online]. Available: http://www.agcensus.usda.gov/Publications/2007/Online_Highlights/Fact_Sheets/Demographics/demographics.pdf

  26. Issues Encountered During Project Flash memory writing procedure Soldering difficulties due to initial reflow design Contamination created due to hardware debugging Implementation of software on MSP430

  27. Future Hardware Development Wireless capability (Bluetooth for data transfer) Additional sensors to record other crop information Change several pinoutson the device to avoid fabrication issues Adjust ground temperature sensor’s molex connector Add thermal reliefs to all ground vias Develop formal procedure for adding parts to PCB

  28. Future Software Development Allow the user to modify the requirements to start the device process for different climate regions Additional metrics measured and stored in memory Ability to easily update information stored in memory Improved user interface for the computer Additional user and debugging commands from the computer Separate user and factory software builds Implementation of lower power modes for microcontroller and flash memory IC Recovery of the GDDM from loss of power

  29. Credits Professor Paul Carney Michelle Ansai Rishi Ratan ECE Machine Shop: Skee Aldrich ECE Part Shop: SkotWiedmann Advanced Circuits: Kyle Askew Texas Instruments

  30. Thank You

  31. GDDM on Ground

  32. Power Module Schematic Solar Panel and Batteries

  33. Power Module Schematic Voltage Regulator

  34. User Interface Schematic Display Drivers

  35. User Interface Schematic Monitor LED and Pushbutton

  36. Controller Module Schematic

  37. Sensor Module Schematic

  38. I/O Module Schematic

  39. Reference Board Schematics Texas Instruments. MSP-EXP430F5529LP Schematics, BOM, and Software (Rev. B) [online]. Available: http://www.ti.com/lit/zip/slac623 Texas Instruments. MSP-TS430RGC64USB Development Board Schematics, Layout, and BOM (Rev. A) [online]. Available: http://www.ti.com/lit/zip/slac374

  40. Prototype Flash Memory Chip and Display Drivers Interface with MSP430

  41. I/O Interfacing Commands

  42. Sample from Program

More Related