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Spectral Imaging of the Coronal Environment (SPICE). Caitlyn Quinn Summer 2010 Gregory Woytko, 547. What is SPICE?. Imaging coronal spectrograph One of ten instruments to fly on the ESA/NASA Solar Orbiter mission in 2017 Will orbit the sun at closest distances ever attempted, around 1/4 AU
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Spectral Imaging of the Coronal Environment(SPICE) Caitlyn Quinn Summer 2010 Gregory Woytko, 547
What is SPICE? • Imaging coronal spectrograph • One of ten instruments to fly on the ESA/NASA Solar Orbiter mission in 2017 • Will orbit the sun at closest distances ever attempted, around 1/4 AU • SPICE instrument currently in Phase A
Solar Orbiter Mission Goals • Evaluate plasma properties and composition of the sun with unprecedented spatial and spectral resolution • Improve our understanding of the Sun’s effects on Earth and the solar system • Better understand CME and space weather
Orbit .23 AU
The Instrument • Sun’s light comes in through entrance aperture • Ray hits primary mirror and series of optics • Pre-slit deflects excess radiation • Ray passes through slit mechanism; four slits of varying width • Detectors interpret incoming EUV light
The Detector • Spring-loaded door • 2 detector stacks MCP HAS FOC
Detector Stacks • Micro Channel Plates (MCP) • High voltage • Fiber Optic Coupler (FOC) • Transmits/focuses image • HAS chip • Intensified active pixel sensors • Off-centered active area • Components in stack connected by epoxy bond lines MCP FOC HAS
The Detector • Door opens, EUV radiation hits MCPs • MCPs are supplied a high voltage, detect and amplify incoming radiation • Radiation and voltage transmit through FOC to HAS chip • High voltage activates HAS pixels, which record incoming signal
Bonding the Detector Together • Epotek 310M Epoxy • Plastic adhesive • Transparent, maintains maximum strength down to 10-12 m • Connection between HAS and fiber optic coupler is CRITICAL • Determines resolution of images captured CRITICAL bond line
Critical Bond: FOC to HAS • FOC focus: 4 m • HAS pixels: 18 m • Light refracts 30° on either side of ray from the FOC to epoxy • Distance between FOC and HAS (i.e. bond thickness) determines spread • Smaller spread, better resolution
Critical Bond: FOC to HAS Worst case scenario: bond line 12 m, single focused ray spreads over multiple HAS pixels
Issues With Bonding • ESD sensitivity of HAS • Accuracy, precision • How to ensure precise placement of FOC in active area despite slight variations in HAS chips? • 2 bonds on one FOC • Expense of HAS • Only get “one shot” to do it right during actual fabrication Solution??
Bonding Fixture • Grounded metal plate with HAS-shaped pocket • Outer holes to secure fixture and ground plate • Holes around pocket for T-shaped alignment bars (adjustable) • HAS is removable after bonding is achieved • Drawings approved, quote received, solid models in the making!
SPICE: General Issues • Ability of instrument to withstand wide range of temperatures • Will the detector and bonds withstand testing: vibration, thermal, acoustic, etc? • Passing upcoming CDR • Delayed execution of instrument (>3 yrs)
Other Experiences at NASA • Working alongside engineers, scientists, machinists • Clean room training • Disassembling hardware • Machine Shop • ESDM • 5-axis milling • Metrology, FARO arms • Rapid prototyping: SLA