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Office of the Secretary of Defense

Office of the Secretary of Defense. Defense Microelectronics Activity (DMEA) . Doug Casanova Defense Microelectronics Activity (DMEA). DMEA Mission. DoD Mission - Provide microelectronics technology solutions Leverage advanced microelectronics technologies

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Office of the Secretary of Defense

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  1. Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics Activity (DMEA)

  2. DMEA Mission • DoD Mission - Provide microelectronics technology solutions • Leverage advanced microelectronics technologies • Improve reliability and maintainability • Enhance capability and performance • Address effects of rapid obsolescence • Assigned as DoD Executive Agent for microelectronics DMS • Coordinate DOD activities • Develop OSD policy and strategy • Serve as joint resource for DoD / government / industry / foreign allies • Established by Secretary of Defense • Defined DMEA’s joint mission & explicit organizational structure • Report directly to the Deputy Under Secretary of Defense for Logistics & Materiel Readiness

  3. The Challenge B-52 1946 1955 2040+ 94+ Years 0 50 100 Years • Increased DoD use / reliance on microelectronics (“Smart” weapon systems) • Essential technology for all military missions • Strategic, tactical, C4I, special ops • “Critical” DoD technology • Enabling technology for transformational opportunities • Extended system life cycles (20 – 40 years) • Increased reliability and maintainability issues • Rapidly evolving, expanding missions - new capability requirements • Diminishing Manufacturing Sources (DMS) • Decreased technology stability • Dynamic development drives obsolescence cycles of 18 months or less • Over 95% of all DoD DMS cases are electronics Notional Projected Lifetime Extended Life

  4. DMEA’s Total Solution Approach • Key: Understand ALL the military requirements • Verify System Problems • Reliability and maintainability of system/boards • Adequacy of spares • Testability and repair issues • Existing and projected obsolescence • Develop Solution Options • Component • Aftermarket • Substitution • Emulation • Custom • Board / Box / System • Technology Compression • TOC savings over chip for chip • Increased capability (transformation) • Opportunity for open architecture

  5. DMEA’s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS) • Government / Semiconductor Industry partnership • New flexible foundry technology • New business model • Government-held process licenses • No commercial conflicts • Prototype / low volume production by DMEA • High volume production by industry • Terminal transfer to DMEA upon OEM business decision • Transfers industry-developed (commercial) IP & technology • COTS as a solution, not a problem • Ensures continued DoD supply as industry flexes with market Save processes, Not parts !

  6. DoD / Industry PartnershipTogether Supporting the Warfighter • Boeing / F-22 Obsolescence Problem • Custom power management device no longer available • Used throughout the weapon system • Multi-year production requirement • 500 parts / year X 10 years • Part for Part solution determined the best value • Requested DMEA’s ARMS Foundry Support • Solution - DMEA & Boeing “Cooperative Research And Development Agreement” (CRADA) • DMEA / Boeing worked together on developing new IC • DMEA provided design engineering • DMEA tested & delivered new IC

  7. DMEA B2 Support • B-2 Defensive Management System (DMS) unsupportable • DMSMS plus lack of repair procedures, lack of tech data, spares, etc • Prime Contractor wanted $54M to redesign system • DMEA Proposed $22M to make supportable for next 10 years • DMEA performing System-level DMS Supportability Improvement Program • System level assessment • IC / board / box solution strategies • Reverse engineering • Solution design, prototype, and test • Cost avoidance = $32 Million

  8. DoD / Industry Partnership Evolved Sea Sparrow Missile (ESSM) • Raytheon / ESSM Obsolescence and R&M Problems • Obsolete Custom Microprocessor & Interface Logic Devices • Impacts future production of Missile Borne Computer (MBC) Subsystem • Requested DMEA’s Support to Eliminate Obsolescence • DMEA Provided 3 Options • Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS • DMEA to redesign 6 boards and 2 ASIC’s • Microprocessor & Interface Logic redesign • Technology Compression to replace other ICs & develop new FFF MBC Subsystem • DMEA / Raytheon to Integrate & Test new MBC • Cost Avoidance of $20,000,000

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