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Versatile Link Project Description

Versatile Link Project Description. Optical Physical layer linking front- to back-end Bidirectional, ~5Gbps Versatile Multimode (850nm) and Singlemode (1310nm) versions Point to Point and Point to Multipoint architectures Joint Project (CERN, Fermilab, Oxford, SMU). BE. FE. W1.1 – P2P

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Versatile Link Project Description

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  1. Versatile Link Project Description • Optical Physical layer linking front- to back-end • Bidirectional, ~5Gbps • Versatile • Multimode (850nm) and Singlemode (1310nm) versions • Point to Point and Point to Multipoint architectures • Joint Project (CERN, Fermilab, Oxford, SMU) BE FE francois.vasey@cern.ch

  2. W1.1 – P2P SMU, J. Ye W1.2 – P2M W1.3 – Mixed W2.1 – Front-End CERN, J. Troska W2.2 – Back-End FNAL, A. Prosser W2.3 – Passive Oxford, C. Issever Project Structure and Partners Versatile Link Project Steering Board Spokesperson: F. Vasey Link to GBT CERN, P. Moreira W1 - System W2 - Components francois.vasey@cern.ch

  3. Backend Transceiver Digital Signal Analyzer Optical Eye Pattern Analysis Jitter Decomposition and Analysis PRBS Pattern Synchronization francois.vasey@cern.ch

  4. Back End Optical Technologies SNAP12 Tx (2.7 Gbps/channel) SFP+ Single Channel TRx (10 Gbps) 4x4 Optical Engine Transceiver (6.25 Gbps/channel)

  5. Versatile Link Future Phases • Project Plan calls for Phase 2 to end in March, 2011. Phase 3 would be • production readiness phase. • A “Phase 2B” has been discussed. This would bridge the period between • the end of Phase 2and the beginning of a production readiness phase • synchronized wit h LHC upgrades. • Possible Phase 2B Activities: • 100 Gbps telecom products are driving the development of array optics. • FNAL already has begun investigating the use of existing array technologies • for Versatile Link (SNAP 12, optical engines) • FNAL proposes to continue working with vendors of array technology to • evaluate evolving products. • Activities would include design and development of test platforms, • working with vendors to specify packaging options, test engineering, and • component specification for these products. • FNAL has already worked with 2 vendors of such technology (NDAs are • in place) and more are being contacted. We will be responsible for the support • of reference test platforms for array transmitters and receivers for the • Versatile Link project. • Possible to submit this as a Generic R&D proposal .

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