1 / 49

Serial Code Accelerators for Heterogeneous Multi-core Processor with 3D memory

Serial Code Accelerators for Heterogeneous Multi-core Processor with 3D memory. Philip Jacob Thesis Defense July 26 rd 2010. Committee members John F. McDonald Tong Zhang Paul Schoch Christopher D. Carothers. Outline. Need for Serial code accelerator Clock Race Multi-core CMOS

orpah
Download Presentation

Serial Code Accelerators for Heterogeneous Multi-core Processor with 3D memory

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Serial Code Accelerators for Heterogeneous Multi-core Processor with 3D memory Philip Jacob Thesis Defense July 26rd 2010 Committee members John F. McDonald Tong Zhang Paul Schoch Christopher D. Carothers

  2. Outline • Need for Serial code accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  3. Outline • Need for Serial Code Accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  4. Motivation for High Clock Rate CPU: HPCS • Faster processing nodes to execute MPI code using SiGe HBTs. • Improve packet handling to reduce communication latency. Ref1: http://www.nas.nasa.gov/About/Projects/Columbia/columbia.html

  5. Previous decade: Clock Race suggested need for 3D Memory Memory Wall Ref 2: Hennessey, Patterson ,”Computer Architecture – A Quantitative approach”

  6. The Clock Race for CMOS has Ended 6 Clock Doubling Times = 64 GHz! Ref 3 : WilfriedHaensch, 2008 IBM TAPO meeting

  7. CMOS Repeater Crisis - Wires Don’t Scale WellNumber of Repeaters is Exploding as a Power of 10 per 33% Shrink Chip Integration – Technology Challenges • Mx resistance increasing with technology scaling. • High resistance requiring increased repeater counts. • Increased power consumption as buffers are leaky and • accounts >50% of logic leakage. • Forced to reduce /hold clock rate Ref 4: RuchirPuri, IBM, 2007 Sematech/ACMThermal and Design Issues in 3D ICs

  8. Result: Multi-cores in CMOS – Dual core to Quad Core to 50 core Generation 50 core Knights corner cloud computing chip Quad Core Dual Core

  9. Is adding more cores the right solution? Amdahl’s 1967 Figure of Merit (FOM) estimates speedup to an overall system when only part of the system is improved.Speeding up parallel code by adding “n” cores. Ref 5:Gene Amdahl ”Validity of the single processor approach to achieving large scale computing capabilities” AFIPS Conference, 1967

  10. Speed up The Serial Code

  11. Heterogeneous Multi-core System with MCU’s, and a single HCRU for Serial Code MCU0 MCU1 • Turn off High clock rate processor • during parallel operation to save power. • Integration could be either on same chip • or through Silicon carrier. MCU2 MCU3 HCRU MCU4 MCU5 MCU6 MCU7

  12. Outline • Need for Serial Code Accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  13. Alternate technologies SiGe HBT Strained Si FinFETs

  14. SiGe HBT • Vertical Device. • 3 regions of operation: OFF, Forward active, Sat. • Current equations are exponential making them better drivers of wires.

  15. Doping Profile to form Hetero-junction • Ge into the base region reduces the potential barrier to injection of electrons from emitter into the base. • Drift field accelerates e-. • Results in increased Ic and reduced base transit time. Ref 6:On the potential of SiGe HBTs for extreme environment Electronics, Cressler, Proceedings of IEEE, Sept 2005

  16. Scaling in SiGe HBTs • FOM- Cut off Frequency. • Solomon Tang Scaling rule. • * Circuit delay scales with emitter size. • * Shrink the Emitter for constant TOTAL Current. • Collector current density goes up. • Supply Voltage and swing voltage is constant. 90nm 130nm 180nm Ref 6: On the potential of SiGe HBTs for extreme environment Electronics, Cressler, Proceedings of IEEE, Sept 2005

  17. Emitter Coupled Logic Design • Current Steering circuits. • Differential input/outputs. • Low voltage swings. • Taller trees for more complex gates but higher static power consumption. NAND gate

  18. D Flip Flop Latch Cross coupled inverters

  19. Low Power in Bipolar: I2L / Integrated Injection Logic NOR INV NAND Vcc = 1V Signal Levels Low= 0.2V High=0.7V

  20. NPN only IIL VCC VCC Out in VEE VEE 1.1V power supply 4.4ps rise time 300mV swing In collaboration with Tuhin, Srikumar Ref 7: J.H. Pugsley and C.B. Silio, Proceeding of the 8th International Symposium of Multiple-Valued Logic, Pg 21-31, 1978

  21. ITRS Roadmap for CMOS Microprocessor Power

  22. Apple Sponsored Exponential PowerPC • 0.7M Hitachi Si-bipolars. • 0.3um x 1.0 um emitter 20 GHz fT 1995. • 2.0M 0.5µm FET’s. • Die Size 15mm x 10mm. • Metal Pitch 2µm. • ~80Watts. • 0.75~0.85 GHz (last tapeout). • Mixed ECL 500mV and CML 250mV swing. • Main power supply was 3.5V (most contemporary designs would use 2.5V). 22

  23. Outline • Need for Serial Code Accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  24. High Level Architecture

  25. CPI vs. Clock vs. Bus width Cache structure -unified L0 (1KB) -unified L1 (16KB) - A huge L2 - CPI=7.82 • Trace driven simulator – Dinero • Cache access time - CACTI

  26. Access time improvement in BiCMOS over CMOS L1 cache (16K cache) 1. Decoder data 2. Word Line 3. Sense amp data 4. Comparator 5. Mux 6. Sel Inverter 7. o/p driver • CMOS access time=0.718ns • BiCMOSaccess time=0.431ns Ref 8: CACTI 4.2, 5.0 http://quid.hpl.hp.com:9081/cacti/detailed.y?new

  27. Simplescalar – Execution driven simulator 3D cache with wide bandwidth Ref 9: www.simplescalar.com

  28. Reducing CPI for HCRU • Simple scalar simulator • 3 level cache • SPEC int benchmarks • CPI around 2.5 to 3

  29. 3D processor memory stack solution Multi-core Multi-tier Multi-bank • Higher bandwidth through 3D-vias translates to multi-port cache accessing simultaneously multiple banks or tiers. • Good for multi-cores where bus arbitration can be avoided.

  30. Multiprocessor simulator- RSIM Symmetric multi processor simulator adapted for 3D memory over multi-core Ref 10: RSIM http://rsim.cs.uiuc.edu/rsim/

  31. Multi-core processor – RSIM results FFT benchmark

  32. Outline • Need for Serial Code Accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  33. L0 i-cache + Remote Program Counter Pipeline controller (FSM) External signals & traps Pipeline stage control signals Signals to FSM Data Reg File Instruction Decode Instruction queue Register File Stage 1 Register File Stage 2 Operand preparation ALU Output Scan Chain Core Test input (instruction sequence generator) ALU feed forward Data Bus L0 d-cache Post Ex/ Write Back Queue Update Remote PC 7 stage Pipelined processor core

  34. Dual Ported 8HP Register File • Read Port A Operation at 18.4 GHz (measured) • 2 read ports/ 1 write port • size = 8 words Ref 11:Okan ErdogoPhd Thesis 2008

  35. CLA carry chain test structure Measured waveform of the 8 HP adder test chip 26.67GHz Ref 12:Paul BelemjianPhd Thesis, 2008

  36. Operand Preparation block

  37. CLOCK SET HLT STALL_CACHE STALL_BR UNSTALL_CACHE FSM X Y Z Pipe Clear States Pipe control signal Data I/p counter STAGE 1 STAGE 2 Test output Pipeline Controller FSM chip

  38. 3D FDSOI CMOS Process - MITLL Ref 13:MIT LL process documentation

  39. 3D cache – Floor plan & Microphotograph Way 0 Way 1 TAG ARRAY Way 3 Way 2 3D Via 3D Via Controller In collaboration with Aamir Zia

  40. Measured Results of 3D memory chip Measured waveform of alternating read after write from Tier 1 at 500MHz clock Measured waveform with a string of consecutive 0s from Tier 3

  41. SERDES 2.5w L0 d-cache (reg file) 5w L0 d-cache (reg file) 5w Adder 2.5w Write/store queue 1.4w L0 d-cache (reg file) 5w L0 d-cache (reg file) 5w Op. Prep 1w Reg File 5w Test Inst generator i-cache (Reg file) 5w FSM (Pipe line Ctrl) 1w i-cache (Reg file) 5w Inst Q 4 words 1.4w Inst Dec-oder 1w Floor planning (5mm * 5mm) L1 CACHE

  42. Thermal Studies of Processor floor plan using COMSOL • Substrate too thick that the heat is not spreading into the bottom sink. • Deep Trench Isolation in SiGe HBT prevents lateral heat spreading 335K In collaboration with OkanErdogan

  43. Use of Diamond Heat Spreaders View at diamond Cu boundary for 50um Diamond layer under CPU with one tier of 3D Memory Silicon thinning to 50 µm, and bonding to 50 µm diamond Ref 14:J.C. Sung et al, “Semiconductor on Diamond (SOD) for System on Chip (SoC) Architectures”, VMIC Conference, Sept. 2006, pp. 35-38.

  44. Thermal studies with Processor- 3D memory 313K • Wafer thinning • Diamond substrate • Cu heat spreading interface layers

  45. Outline • Need for Serial Code Accelerator • Clock Race • Multi-core CMOS • Amdahl’s law • Alternate technologies • SiGe /FinFET etc • ECL/ I2L • Architectural studies • HCRU CPI • Multi-core • 3D memory • Processor core and 3D memory • FPGA core model • Chip designs • Thermal Analysis • Conclusion & Future Research

  46. Milestones • Fall 2004-2005  Preliminary study of 3D architecture, • 2005- 2006  DQE, IEEE D&T Paper accepted, Processor design on FPGA, MS degree • 2006-2007 Processor redesign on FPGA, Multi-core processor evaluations, Completion of course work, Candidacy • 2007-2008  Chip implementation, Testing blocks. • Operand preparation blocks • Pipeline Controller implementation in 8HP SiGe. • 2009-2010  Amdahl’s law and heterogeneous core integration • Thesis Defense

  47. Publications • "Mitigating Memory wall effects in High clock rate and Multi-core CMOS 3D ICs- Processor Memory Stacks", Philip Jacob, Aamir Zia, Mike Chu, Jin Woo Kim, Russell Kraft, John F. McDonald, and Kerry Bernstein, Proceedings of the IEEE – 3D IC special issue. Vol.97, No.1 , Jan 2009, pp 108-122 • "Predicting the Performance of a 3D Processor-Memory Chip Stack” Philip Jacob, OkanErdogan, Aamir Zia, Paul M. Belemjian, Russell Kraft and John F. McDonald, IEEE Design and Test, Nov-Dec 2005, pp 540-547.(cited 14 times) • “A Three-Dimensional L2 cache with Ultra-Wide Data Bus for 3D Processor-Memory Integration”, Aamir Zia, Philip Jacob, Russell P. Kraft and John F. McDonald, Transactions in VLSI, IEEE. Vol. 18, No. 6, June 2010, pp 967-977. • “A 40Gs/s Time Interleaved ADC using SiGeBiCMOS technology”, Michael Chu, Philip Jacob, Jin-Woo Kim, Mitchell LeRoy, Russell Kraft, John F. McDonald, JSSC, IEEE, Vol. 45, No. 2, Feb 2010, pp 380-390. • “A Reconfigurable 40 GHz BiCMOS Uniform Delay Crossbar Switch for Broadband and Wide Tuning Range Narrowband Applications”, Jin-woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell Kraft, John F. McDonald, IET Circuits, Devices and Systems. [Accepted]

  48. Conclusion & Future Research goals • Need for a fast core • Possible alternative technologies especially SiGe • Chip designs in 3D memory and SiGe for processor core • Thermal analysis using COMSOL • Heterogeneous core integration with 3D memory – the way forward! • IIL Logic for low power operations • Serial code/ parallel code separation.

  49. Thank you for your attention Questions

More Related