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Pads

Pads. Assembly- Zamiatin Si Detector – ELMA/Dubna/MSU Interface Board – dubna/baskagiv Carrier Board -dubna/baskagiv Pre-Amp –sleniov(analog) Basilev-dubna FEM – Basilev –-dubna Analog(Slepniov) Digital Basilev Layout – Baskagiv. Pad assembly. Assemble

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Pads

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  1. Pads • Assembly- Zamiatin • Si Detector – ELMA/Dubna/MSU • Interface Board – dubna/baskagiv • Carrier Board -dubna/baskagiv • Pre-Amp –sleniov(analog) Basilev-dubna • FEM – Basilev –-dubna • Analog(Slepniov) • Digital Basilev • Layout – Baskagiv

  2. Pad assembly • Assemble • Detector+interface+ceramics (dubna) • To bnl • Glue carrier+W (SUNY?) • Attach detector assembly via connectors • To bnl • Use connector to put together 2 sections! (at BNL)

  3. strips • Detectors – Elma/Korea • SRC (stripixel readout card) – BNL/CA • Bonding svx+pitch adapter –Helsinki • Assembly - Helsinki • Then to BNL

  4. Mechanical parts • Dubna – Litvinenko • Copper boxes etc

  5. Brick Assembly • Receive • Pad assembly • Strip assembly • Copper boxes

  6. groups • MSU-Merkin • 'Nikolai Zamiatin‘ • 'Basilev, Sergey‘ • Analoy Litvinenko • Andrey Sukhanov

  7. Pad detector (ELMA/ON/SENS) Interface board (Dubna-layout-Boskakov ) double unit Ceramics(USA) no electronics, with holes for soldering etc Connector Connector Carrier board(Dubna-layout Baksagiv) traces out to end carrying analog signal to pre amp Tungsten (USA) brick size Pad detector Assembled at Dubna Zamiatin Double unit Connector Connector Assembled at SUNY? Brick size Cable Polyamide Boskakov FEM board 14 bit ADC Design- Basilev Layout- Boskakov Assembled-Dubna Or Chi HBD board decoupling capacitor Pre-amp board - Hybrid pre-amp Slepniov Layout- Boskakov Assebled-Dubna To DCM “Hbd” cable

  8. Layout: BNL/MSU Implementation: BNL/Komposit (Ekaterinbourg, Russia) Sensors carrier board Absorber (W)

  9. Pad ReadOut Unit

  10. Pad ReadOut Unit

  11. Pad Detector Interface board Ceramic

  12. Pad detector Interface board Bonding pad Connector Ceramic Connector Carrier Tungsten Pad detector unit (close up of connections) Grounding foil Analog Signals To Pre-amp

  13. Pitch adapter SVX4 SRC (stripixel readout card) (USA) double sensor unit Ceramic (USA) Stripixel detector (ELMA/SENS) Ceramic (USA) Stripixel unit Assembled and bonded at helsinki Ceramic High Voltage+alignment (Dubna) brick size Cable Daisy chain Off the Shelf polyamide SVX4 Readout and Control (FPGA) Design- Sukhanov’s (1 per brick) Assembled USA Crate controller – linux to SVX4 To DCM

  14. To FEM High Voltage ceramic+alignment brick size To preamp To preamp To preamp Stripixel unit Stripixel unit Stripixel unit Pad unit Pad unit Pad unit Pad unit Pad unit Pad unit Pad unit Pad unit Pad unit Carrier Carrier Carrier Tungsten (USA) brick size Tungsten (USA) brick size Tungsten (USA) brick size Brick Copper “box” Cable Daisy chain Off the Shelf polyamide

  15. overview

  16. Pad sensor sub-assembly actually done in double units Dubna

  17. Pad sensor sub-assemblyDubna

  18. Pad sensor sub-assemblyattach to carrier board and W

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