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EndCap Module Production of the ATLAS semiconductor tracker (SCT)

EndCap Module Production of the ATLAS semiconductor tracker (SCT). Shulamit Moed, Geneva University On behalf of the ATLAS SCT collaboration. ATLAS SCT layout and specifications module production integration and system test results summary. A T oroidal L HC A pparatu S. ATLAS. ID.

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EndCap Module Production of the ATLAS semiconductor tracker (SCT)

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  1. EndCap Module Production of the ATLAS semiconductor tracker (SCT) Shulamit Moed, Geneva University On behalf of the ATLAS SCT collaboration • ATLAS SCT layout and specifications • module production • integration and system test results • summary Vertex 2004, Como, September 2004

  2. AToroidal LHC ApparatuS ATLAS ID • A general purpose LHC detector • p-p collisions at 14 TeV CM Energy • Bunch crossing every 25 ns • L = 1033 – 1034 cm-2 s-1 • Starting date: 2007 Vertex 2004, Como, September 2004

  3. ATLAS Inner Detector and Silicon Tracker • Inner Detector • Axial Magnetic field 2 Tesla • Pixel Detector (r = 4.8-16 cm) • Semiconductor Tracker (r = 27-52 cm) • Transition Radiation Tracker (r = 56 –107cm) • Semiconductor Tracker (SCT) • 4 cylindrical barrel layers • 2 X 9 EndCap disks • Hermetic coverage |η| < 2.5 • 4088 silicon modules • 16000 single detectors • ~62m² of silicon • 6.3 million read-out channels • Ambient temperature: -70 • Resolution: • - σ (Rφ) = 16 μm • - σ (z) = 500 μm Vertex 2004, Como, September 2004

  4. SCT Modules • silicon microstrip p+onn detectors • 768 AC-coupled readout strips • pitch size - 80 μm (barrel) - 50 – 90 μm (endcap) Barrel module 5 different module types • 1 barrel type • 4 endcap (forward) types - outer - middle - short middle - inner Difference between types • geometry (mainly) • different radial position on disk Middle forward module Vertex 2004, Como, September 2004

  5. Endcap Module Design and Hybrid • Detector part Hamamatsu, CiS • 4 single sided silicon sensors, 285mm thick • total strip length: 12 cm • back to back sensors, 40 mrad stereo angle • Spine (Thermal Pyrolytic Graphite) sandwiched between the pair • - mechanical spacer/ heat spreader • Hybrid • Cu/Polyimide flexible circuit laminated • onto a carbon-carbon substrate • 2x6 binary readout ASIC • - each chip reads out 128 channels • - radiation hard DMILL technology • optical data transmission • temperature sensors ABCD3T chip Opto chip Optical links used for CLK/COM + data transmission Vertex 2004, Como, September 2004

  6. Module Production • Production of the 4088 modules takes place at several sites worldwide • 4 barrel module assembly sites in Japan, Scandinavia, UK and USA • 7 forward module assembly sites in Australia, Germany, Netherlands, Spain, Switzerland and the UK • Modules must satisfy many criteria and tolerances – e.g. • a range of mechanical tolerances, some < 5 mm • module leakage current < 80 mA at 350V • noise per channel < 1500 ENC (non-irradiated) • average noise occupancy at 1 fC threshold < 5 x 10-4 • < 1% bad channels Extensive quality assurance Vertex 2004, Como, September 2004

  7. Production in Geneva (1) • Geneva: Production of ~630 outer EndCap modules (to be shipped to CERN for quality assurance). • Lab with clean room facilities and infrastructure - controlled access - temperature and humidity control - personnel: smocks, hairnets, (antistatic) slippers, face mask - antistatic stations (floor and bench mats) - clean room with temperature (21±1)º and humidity (40±5)% control, class 1000 • Classify the modules (according to specifications) as: - good/pass/fail/hold - rework (wire bonds defects, chips replacement etc) Vertex 2004, Como, September 2004

  8. Production in Geneva (2) • Tests of components before assembly • Visual inspection and electrical tests of hybrid performance. • IV measurements of the individual silicon sensors. • Inspection of mechanical pieces (spine,pad-locator, fan-ins…) metrology station probe station Vertex 2004, Como, September 2004

  9. Production in Geneva (3) Tests during module assembly IV measurements - after spine/sensors gluing - after hybrid gluing - after wire bonding IV measurements of a module during different assembly stages • Tests after module assembly: • thermal cycling • (-30) – (+35) degrees • ~17 hours • module supported without stress on a jig • nitrogen flow (for dew point control) and cooling • metrology • electrical readout tests of the module Climate chamber For T.C Vertex 2004, Como, September 2004

  10. Metrology Plots (1) out of specs Good module The position of 50 different points on each side relative to a reference plane Z=0 Vertex 2004, Como, September 2004

  11. Metrology Plots (2) out of specs Good module Vertex 2004, Como, September 2004

  12. Metrology Plots (3) Summary of modules produced so far • Z profile distributions: • thickness • rear Z (50 points) • front Z (50 points) Well Within Specifications! Vertex 2004, Como, September 2004

  13. Module in a Test Box cooling blocks nitrogen flow inlet coolant inlet Kapton cables patch card Vertex 2004, Como, September 2004

  14. Module Readout Tests • Test the electrical performance of the module • Internal calibration circuit to inject charge of adjustable amplitude in the preamplifier of each channel • Adjust channel-to-channel threshold variations (trim DAC in chip) • Binary front-end chip -> occupancy vs threshold scan -> s-curves • Gain, offset, ENC for each channel • Noise Occupancy - Probability for a strip to give a hit for a certain event - Threshold scan without input charge - < 5 x 10-4 at 1fC nominal threshold Occupancy Vs channel and threshold Occupancy Vs threshold Vertex 2004, Como, September 2004

  15. WebPage of Completed Module • DataBase query • Metrology before and after T.C • Electrical tests results • Pictures of bottom and top sides. • Comments + pictures • Current location Vertex 2004, Como, September 2004

  16. Problems (1) • module 23 – readout test failed, 16 consecutive channels open, big scratch observed on fan-ins after assembly. • lesson – inspect all fan-ins before assembly. Magnification *50 Magnification *200 Magnification *500 Vertex 2004, Como, September 2004

  17. Problems (2) • module 29 – IV breakdown of one detector after assembly phase 1. Detector was suspicious when tested individually. • lesson – do not use problematic detectors. • module 35 – high leakage current due to scratches in guard ring and • HV ring. • lesson – inspection of detector edges. Vertex 2004, Como, September 2004

  18. Problems (3) • rework doesn’t always work – module 134 – breaking fan-in while refilling glue below top fan-in. • Crack of 20 consecutive channels. Vertex 2004, Como, September 2004

  19. Some Statistics Vertex 2004, Como, September 2004

  20. Production Status EndCap modules: Barrel modules: Production nearly completed ! ~42% produced Vertex 2004, Como, September 2004

  21. Integration of the Overall SCT Detector System Parts from 11 different production sites: A very challenging task! Vertex 2004, Como, September 2004

  22. System test of SCT detector operation (1) • ¼ of a disk inside a shielding box • geometry and mounting scheme close to final ATLAS conditions • prototypes of cables, patch-panels, power supplies, DAQ Vertex 2004, Como, September 2004

  23. System test of SCT detector operation (2) • Purpose: • verifying: • - performance on disk similar to performance in test box  • - no significant common mode noise  • - no significant cross-talk  • developing good grounding and shielding  Vertex 2004, Como, September 2004

  24. Summary • The ATLAS SCT will be a substantial part of the ATLAS inner detector. • Production and tests so far have demonstrated that the mechanical precisions can be met with sufficient yield. • The electrical performance of modules in our production is according to the design specifications. • Production is almost completed for barrel modules and is well underway for the EndCap modules. • Electrical tests of the completed barrels and disks and the integration into the ID is still a major effort. Vertex 2004, Como, September 2004

  25. endcap C endcap A+B barrel • The modules are arranged to provide 4 space points per track up to pseudo rapidity angle of 2.5 . • Each module measures two coordinates Vertex 2004, Como, September 2004

  26. Metrology No significant differences before and after thermal cycling Before After For the metrology of each module the following plots are made: Vertex 2004, Como, September 2004

  27. Integration area (SR1) at CERN Rack area assembly area Clean room, 700m² Control room • SCT modules will be mounted on support carbon-fibre structures at 4 different sites (barrel-oxford, liverpool,nikhef-endcap). • 4 SCT barrels, 2 ECs (9 disks each) fully mounted will arrive to CERN • acceptance tests of barrels and disks individually • assembly of 4 barrels and mounting of all thermal enclosures • insertion of SCT into TRT (barrel, endcaps) • tests of SCT/TRT after insertion -> Ready to go to the pit! Vertex 2004, Como, September 2004

  28. System test of SCT detector operation (2) • Purpose: • verifying: • - performance on disk similar to performance in test box • - no common mode noise • - no cross-talk • developing good grounding and shielding • Achievements: • grounding and shielding schemes • modules operate on disk – results similar to modules in a test box • no ‘cross-talk’ – running many modules together on a sector is the same like running one by one. Vertex 2004, Como, September 2004

  29. Production in Geneva (4) • Thermal cycling (cycle from +35 0C to -30 0C in 17 hours) in a climate chamber. - module supported without stress on a jig - nitrogen air flow (for dew point control) and cooling accommodated Dew point, frost point and absolute humidity determined from the relative humidity and the temperature of the cabinet. The frost point has no meaning above 0º. Vertex 2004, Como, September 2004

  30. The Integration timescale Vertex 2004, Como, September 2004

  31. Quality Assurance • Extensive QA tests on all components - before module assembly - after module assembly (module QA) Green light for production from the SCT steering group requires: • pre-qualification procedure (2 pre-qual. modules, results on web) • qualification procedure (5 qual. modules, results on web and SCT database) • The QA procedures are well documented • Qualified EndCap production sites: (Freiburg, Geneva/CERN, MPI Munich/Prague, NIKHEF, UK north, Valencia) Vertex 2004, Como, September 2004

  32. The Assembly of the endcaps SCT EndCap Insertion tool TRT SCT SCT EndCap support trolley TRT EndCap Vertex 2004, Como, September 2004

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