Code 300 Overview Code 300: Workmanship

1. Code 300 OverviewCode 300: Workmanship Name: Jeannette Plante Title: Project Lead Tel: 4-5944 Email: jeannette.f.plante@nasa.gov

2. Organization Chart

3. Organization Charter Provide engineering and assurance expertise for printed wiring assembly and cable harness assemblyprocesses that are used in the manufacturing of electronic hardware for space flight application. • Provide support to OSMANASA HQ for • policy decision-making • policy interpretation • policy facilitation • manage and maintain five NASA-STD-8739 requirements documents. • represent NASA on industry standards committees • Ensure Eastern and Western Training Centers are compliant with HQ policy and are meeting Workmanship Project objectives. GSFC Project Support Provide inspection, risk assessment and risk mitigation recommendations to projects to facilitate compliance with the 8739 workmanship requirements and to resolve non-compliances. Manage, maintain and implement GSFC ESD Control Plan, GSFC-WM-001.

4. Organization FunctionsAgency Support • Standards Management and Maintenance: • NASA-STD-8739.x Implementation Requirements for NASA Workmanship Standards • NASA-STD-8739.1 Polymeric Applications • NASA-STD-8739.2 Surface Mount Technology • NASA-STD-8739.3 Soldered Electrical Connections • NASA-STD-8739.4 Crimp, Cable and Harnesses • NASA-STD-8739.5 Fiber Optic Terminations • ANSI/ESD S20.20 Electrostatic Discharge Safety • IPC J-STD-001DS.1 Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies • NASA-HDBK-8739.21 Workmanship Manual for Electrostatic Discharge Control

6. Organization FunctionsGSFC Policy / Standard Practice Support • Represent GSFC’s technical interests in Workmanship recommendations developed by the NASA Workmanship Technical Committee • Contribute Workmanship requirements and guidance for use in GSFC MARs, Golden Rules, specialty documents (specs, guidelines, etc.). • Provide technical review and analysis of in-house and out-of-house non-standard and non-compliant assembly processes. Provide risk mitigation approaches for these features. • Promote synergistic processes and gains with Code 500 packaging and materials analysis activities. Projects need to Budget 0.1 – 0.2 FTEs for Workmanship per year. More if new technologies are expected (CGA, Water Soluble Flux, Pb-free Solder, etc.)

7. Work Example Adoption of J-STD-001xS Space Addendum as a replacement for NASA-STD-8739.2 Automated Soldering and NASA-STD-8739.3 Hand Soldering - Explain OMB A119 Policy on use of Voluntary Consensus Standards by Executive Branch • Determine existing requirements set that must be included in the industry document to be adopted • Requirements gap analysis (~90 requirements found) Six Months • Collect requirements from stakeholders, NASA and Industry (find industry stakeholders!) • Leveraging opportunity being used to create new training program using existing slides. Twelve Months • - Coordinate wording with all NASA Centers and stakeholders for existing and new requirements to add to industry specification: Six Months • Risk rating exercise implemented • Results showed wide perspective across the Agency • Face-to-face coordination, CxP needs focus 90 gaps down to 30 gaps • Represent NASA in the IPC process: drafts, meetings, ballots • Request special interim change • Negotiate new way to run training which does not teach non-Space requirements. 24 months • Submit formal comments to IPC committee • Argue for NASA’s needs at IPC committee level quarterly • Vote on final ballots - Recommend adoption to NASA HQ OSMA

8. Work Examples Very active and non-Rosin flux require pre-approval to ensure that corrosive ingredients are adequately removed • acceptability of non-standard flux • qualification data for flux (suppliers don’t always test to spec, NASA Advisory) • sources and risk associated with contamination. Partially complexed flux, Courtesy: Foresite Courtesy: Foresite

9. Work Examples Column Grid Array Attach requirements - incoming inspection of parts - mechanical board design and part position - solder paste deposition - part placement - reflow profile design - solder joint inspection Requirements document & Audit Checklist – guide for quality assurance personnel Work Instructions (procedures) which track with requirements – guide for Process Engineer

10. Intermetallic Formation in Solder Joints Al (Aluminum) Sn (Tin) Au (Gold) Pb (Lead)

11. Technical Examples of Workmanship Issues (Manufacturing Process and Product Quality) fiber optic terminations cable and wire splices cable harnesses Polymeric Applications solder joints printed wiring boards

12. Grain structure in Sn-3.5Ag-1.0Cu ball grid array joint. Lead-Free Solder (Pb-free)

13. Public Workmanship Website http://nepp.nasa.gov/workmanship

16. Workmanship Protected Site (PBMA)

17. Impact on Mission Success • Workmanship requirements what: Apply quality rules which name and disallow defects in PWAs and Harnesses thus why: Reducing defect occurrences at higher levels of assembly thus why: Reducing high cost/schedule/mission success impact of those defects • Workmanship should show up when: • Establishing the Agency’s quality requirements baseline • Establishing Program and Project mission assurance requirements • Review and approval of exceptions and waivers • Qualifying new and advanced packaging designs • Review and approval of new processes • Checking traceability of design, assemblies instructions and assembly processes to requirements • Quality inspections to verify requirements are met • Review and approval of failure analysis and resolution • Workmanship usually works as a consultant to CSO and Code 320. Goal is to develop a proactive support process. The earlier the involvement the more insightful the support of non-standard issues