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Embark on a journey through the LTCC (Low-Temperature Co-Fired Ceramic) and HTCC (High-Temperature Co-Fired Ceramic) Market with our comprehensive analysis, offering insights into current trends and future projections. This report delves into market dynamics, key trends, and factors driving the growth of LTCC and HTCC technologies across various industries. Gain valuable insights into the competitive landscape, technological advancements, and market challenges that define the present and future of this advanced ceramic sector.
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Understanding the Growing Applications of LTCC and HTCC in Automotive Sector 1 © Prescient & Strategic Intelligence Private Limited. All rights reserved
With the growth and usage of power devices, particularly 3rd-generation semiconductors, semiconductor devices are progressively evolving in the path of miniaturization, high power, multi- function, and integration, which also put forward greater needs on the performance of packaging substrates. Ceramic substrates possess good heat resistance, high thermal conductivity, low coefficient of thermal expansion, radiation resistance, good insulation, high mechanical strength, corrosion resistance, and more, and are extensively employed in electronic device packaging. Between them, co-fired multi-layer ceramic substrates are increasingly being employed in packaging high-power devices as they can attain a high degree of incorporation by firing electrode materials, electronic devices, and substrates at once. Co-firing multi-layer ceramic substrates are produced of various single ceramic substrates via methods such as hot pressing, lamination, sintering, and debinding. As the number of layers can be increased, the density of wiring is greater, the length of interconnection lines can be reduced as much as possible, and the signal transmission speed and assembly density can be enhanced, so it can adjust to the necessities of electronic machine for high density, circuit miniaturization, multifunction, high speed, high power, and high reliability. Along with the alteration of temperature in the preparation procedure, the co-fired ceramic substrate can be categorized into LTCC (low-temperature co-fired ceramic) multilayer substrate and HTCC (high- temperature co-fired ceramic) multilayer substrate. So, what is HTCC? HTCC is a high-temperature co-fired ceramic that utilizes AlN, alumina, and various other ceramic materials to be frittage with conductor materials (W, Mn, Mo) under a high temperature of 1600 degrees Celsius. The advantages of the HTCC are high thermal conductivity, high structural strength, high wiring density, and good chemical stability. What about LTCC? LTCC possesses a lower frittage temperature below 900 degrees Celsius, utilizing Cu, Ag, AU, high conductivity low melting point metal materials can be frittage by air. LTCC and HTCC are Majorly Used in Automotive Sector 2 © Prescient & Strategic Intelligence Private Limited. All rights reserved
The acceptance of telematics, governments’ safety standards, and the rising emphasis of customers on the safety of automobiles are boosting the requirement for automotive electronics. Furthermore, the increasing need for automobiles in Argentina, Russia, India, Thailand, and Brazil, has formed a high-volume need for these ceramics because of their application in the sensors and devices of automobiles. To receive free sample pages of this report@ https://www.psmarketresearch.com/market- analysis/ltcc-htcc-market/report-sample Electronic equipment is regularly employed in tight confines inside an automobile, where it is exposed to extreme temperature and stress. To unite the package, connect, and implant passive parts into a single structure, LTCC implements a cubic arrangement. It is located in the gearbox and engine control systems. LTCC accomplishes the packing requirements of high-speed networks and high bandwidth, while also preserving environmental and mechanical safety. Therefore, the rising penetration of electronic sensors/devices in automobiles, coupled with the surging production of electric vehicles is set to further boost their demand in the coming years. In Ending This With the surging utilization of ceramic substrates in automotive, consumer electronics, telecommunications, and various other sectors, the demand for LTCC and HTCC will reach USD 4,125.6 million in 2030. The research offers market size of the global LTCC and HTCC market for the period 2017–2030. Market Segmentation by Product Type LTCC HTCC • • Market Segmentation by Application Automotive Telecommunication Aerospace & Defense Consumer Electronics Others • • • • • Market Segmentation by Region 3 © Prescient & Strategic Intelligence Private Limited. All rights reserved
North America LTCC and HTCC Market oBy product type oBy application oBy country – U.S. and Canada Europe LTCC and HTCC Market oBy product type oBy application oBy country – Germany, France, U.K., Italy, Spain, and Rest of Europe Asia-Pacific (APAC) LTCC and HTCC Market oBy product type oBy application oBy country – China, India, Japan, Australia, South Korea, and Rest of APAC Latin America (LATAM) LTCC and HTCC Market oBy product type oBy application oBy country – Brazil, Mexico, and Rest of LATAM Middle East and Africa (MEA) LTCC and HTCC Market oBy product type oBy application oBy country – Saudi Arabia, South Africa, and Rest of MEA • • • • • 4 © Prescient & Strategic Intelligence Private Limited. All rights reserved
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