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Existing Cookbook Outline

Existing Cookbook Outline. Introduction (gives overview) Pre-modeling Steps (general guidance, needs some updates) Extracting the Data Spice to IBIS I-V and V-t I-V setups for CMOS, Open, ECL model types V-T setups for [Ramp], waveform tables Measurement guidance

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Existing Cookbook Outline

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  1. Existing Cookbook Outline • Introduction (gives overview) • Pre-modeling Steps (general guidance, needs some updates) • Extracting the Data • Spice to IBIS • I-V and V-t • I-V setups for CMOS, Open, ECL model types • V-T setups for [Ramp], waveform tables • Measurement guidance • Putting the Data Into an IBIS File (keyword notes at mostly Version 2.1 level and some questionable recommendations) • Header information • Component and Pin information • Model information • External Package (under construction) • Verifying IBIS file • Validating the Model (brief, should reference Accuracy Specification) • Correlating the Data (brief, should reference Accuracy Handbook) • Resources (wrong, needs updated) • Appendix - Examples (five examples to be added)  2002-2004 Teraspeed Consulting Group LLC

  2. Cookbook Options • Michael’s presentation raises fundamental questions • Document missing keywords at Version 4.0 level? • What is needed? Who does the work? Assignment of Sections? • Upgrade or rewrite? • Upgrade (based mostly on 2.1 level modeling, but incomplete) – continue BASIC level model development flow with just some 3.2 features • Requires major rewrite/many changes for technical content, notation, etc. • Rewrite – would require an “editor” or single primary author for consistency • Significant changes already needed based on more recent presentations and understandings – easier to start from scratch • Easier to add new information rather than patch it in • Some sections need to be removed • Restructure for Version 4.0 level, or issue topic specific cookbooks  2002-2004 Teraspeed Consulting Group LLC

  3. Other Rewrite/Organizational Options • Several Cookbooks by topics such as • Basic modeling at Version 2.1 • Package modeling, EBD modeling • Advanced Features (multi-stage or Driver Schedule, Differential buffers, Internal terminations, Series/switch keywords, etc. • Multi-lingual modeling in the future • Advanced Specification details (Model Spec, test loads, timing, overshoot, etc.) • Or follow keyword flow and annotation (minimal additional guidance, but large documents and easier to selectively expand) • (Siemens internal document) • 3Com documents by Roy Leventhal under training directory • Tree diagram outline • Several Cookbooks by keyword groupings (vertical coverage from basic to advanced) • Header and Component • Model (and model selector) • Package and EBD • FAQ Driven Topics per Lynne’s topics and basic tutorial • Add Descriptive Examples  2002-2004 Teraspeed Consulting Group LLC

  4. Recommendations for Keyword Coverage Beyond Existing Document (Add from Michael’s Red List) • Component keywords • [Diff Pin] • [Pin Mapping]? • [Package Model]? (then need a large package model section) • Model keywords • [Model Selector]? • (briefly, all Model_types) • [Model Spec]? • [Driver Schedule]?  2002-2004 Teraspeed Consulting Group LLC

  5. Recommendations and References • Decide organization for rewrite (discuss) • Select primary editor • Use references for Sections 5, 6. • Roy Leventhal’s documents: • http://www.eda.org/pub/ibis/training/3com-docs/ • IBIS_HowToUse.doc • IBIS_Syntax.doc • Accuracy Handbook • http://www.eda.org/pub/ibis/accuracy/handbook.pdf • handbook.pdf • IBIS Quality Committee documents • http://www.sisoft.com/ibis-quality/ • IQ_Specification_***.txt (under Documentation, and under development)  2002-2004 Teraspeed Consulting Group LLC

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