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Thermal Interface Materials Market by Application - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2018 –2024 Email:sales@axiommrc.com
The global Thermal Interface Materials Marketis mainly segmented on thebasis of type various materials, applications and by region/country.On the basis of type, the market is mainly segmentedintogreases&adhesives,tapes&films,gapfillers,metal- based materials, phase change materials and others. Further the marketissegmentedonthebasisofapplicationssuchas,computers, telecom, medical devices, industrial machinery, consumer durables and automotive electronics. The report includesmarket size estimation for the regions such as North America, Europe, Asia- Pacific, Latin America and Middle East andAfrica. Download a FREE sample report @ https://axiommrc.com/request-for-sample/?report=1338 HighdemandforthermalinterfaceisforeseenintheMedicaldevices segment as devices used in themedical industry need proper thermal management. Equipment’s such as ultra sound machines, digital imaging machines, X-rays machines and Lasers require proper thermal management as extra amount of heat can result in wrong data or can lead toinaccuracies. Get more details about this report @ https://axiommrc.com/speak-to-analyst/?report=1338 Key companies which lead the thermal interface materialsmarket: 3M Company, Henkel AG & Co. KGAA, Parker Hannifin Corporation, DOW Corning Corporation, Laird Technologies, Inc., Momentive Performance Materials Inc., The Bergquist Company, Inc., Indium Corporation, Wakefield-Vette, Inc. and Zalman Tech Co.,Ltd.
Buy this report @https://axiommrc.com/buy-now/? The companies of the industry constantly trying to launch new products to grab market share of niche and new areas. Recently Semikron launched silicon free thermal grease, a phase change material and the new high performance thermal pastewith an enhanced thermal performance. The newly developed product is targeted for all baseplate-less power modules. At the other hand ElectrolubealsolaunchedtwonewphasechangecalledTPM350and TPM550material products for the thermal management. The productsoffers high thermal conductivity, low phase change temperatures and low thermal resistance at the interface. The new products suits for electronic assemblies. Henkel also have recently added new product at APEX 2016, called Loctite® GC 10 fortargeting electronics Industry.
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