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Tensky International Co.,Ltd .

Tensky International Co.,Ltd. Founded : March.2007 Factory Area : 370.76m 2 Address : No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.). Substrate Materials Wafer Drawing

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Tensky International Co.,Ltd .

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  1. Tensky International Co.,Ltd. Founded:March.2007 Factory Area:370.76m2 Address:No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.) Substrate Materials Wafer Drawing Metalized Materials/Design

  2. 2007 founded for ceramic parts and process ceramic by CNC. 2009 Cooperate with PCB and semiconductor factory dedicated to apply the thin film & lithography process on Alumina / Aluminium Nitride substrate to make passive and circuit components. With both circuit design and processing capabilities, Tensky can offer OEM/ODM manufacturing service for products with circuits on ceramic substrate. 2010 Building branch office in Shenzhen China. Company advance    POTENT MACHINERY & INDUSTRY CO.,LIMITED(Xiamen)

  3. Tensky International Co.,Ltd. • Tensky was established by a group of engineers with innovative processing on ceramic capability. • Our vision is to be the most advanced manufacturing service • provider on ceramic parts and substrate to designers, and become • the most reliable partner for all customers. • Tensky will strive to provide superior manufacturing service on thin/thick film processing integration for all application fields.

  4. Design Rule of Ceramic Substrate Substrate Materials Wafer Drawing Metalized Materials/Design Tensky International Co.,Ltd.

  5. Substrate Materials

  6. Wafer Drawing

  7. 101.6mm or 114.3 mm 3~5mm 3~5mm 101.6mm or 114.3 mm Patterning available region: 90%~95% for 101.6*101.6 mm or 114.3*114.3 mm Metalized Materials/Design

  8. Metalized Materials

  9. Benchmark of Various Substrate Materials

  10. Compare with Thick & Thin Film Process

  11. Sketch of Produce flow chart

  12. Thermal Shock Test Content

  13. Application of the Manufacturing Process High power LEDceramic substrate Flip chip /eutectic substrate manufacturing HCPV heat-sink of the solar cell Sensor ceramic substrate ESD/EMI protect design Thin film passive/protect devices

  14. Manufacturing technology for ceramic substrate Thin-film deposition technology Photo-lithography technology Electrode/electroless plating technology Micro-pattern design and manufacturing integrated technology

  15. Manufacturing technology (I) Major manufacturing equipment for substrate

  16. Thin Film(DPC) Manufacturing Products

  17. Thanks for Your Attention Tensky International Co.,Ltd. Founded:March.2007 Factory Area:370.76m2 Address:No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.)

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