Semester 1 CHAPTER 8 Le Chi Trung

1. Semester 1CHAPTER 8Le Chi Trung

2. Content • Network design and documentation. • Planning structured cabling. • Design practices. • Electricity and grounding. • Network power supply.

3. Schedule

4. NETWORK DESIGN AND DOCUMENTATION

5. General design process • Develop a Layer 1 LAN topology: • The type of cable (fiber, coaxial, CAT 5 …). • The physical (wiring) topology. • Types of Ethernet topologies. • Hub, repeater, closet, patch panel ... • Develop a Layer 2 LAN topology: • To add Layer 2 devices to your topology to improve its capabilities. • Develop a Layer 3 LAN topology: • Build scalable inter-networks. • Link to WANs.

6. Network design issues • Gather information about the organization. • Analyze and assess of the current and projected requirements. • Identify the resources and constraints of the organization. • Document the information in the framework of a format report.

7. Network design process • Designer: person doing the design. • Client: person who has requested, and is probably paying for, the design. • Users: persons who will be using the product. • Brainstorming: generation of creative ideas for the design. • Specifications development: usually numbers which will measure how well the design works. • Building and testing: to meet client objectives and satisfy certain standards.

8. General design methodology • Problem solving cycle. • Problem solving matrix. • Brainstorming.

9. Problem solving cycle

10. Problem solving matrix

11. Brainstorming • Quantity of ideas. • No censorship of ideas. • Building upon others ideas. • Wildest ideas possible.

12. Network design documents • Engineering journal. • Logical topology. • Physical topology. • Cut sheets. • Problem-solving matrices. • Labeled outlets. • Labeled cable runs. • Summary of outlets and cable runs. • Summary of devices, addresses.

13. Review • Understand about design process. • Design documentation.

14. PLANNING STRUCTURED CABLING

15. Cabling standard

16. Cabling terminologies

17. Horizontal cabling components

18. Horizontal cabling structure

19. Horizontal cables • 4-pair 100 Ω UTP.  • 2 fiber (duplex) 62.5/125 µm or multimode optical fiber. • 50/125 µm multimode fiber will be allowed in ANSI/TIA/EIA-568-B. • A minimum of two telecommunication outlets are required for each individual work area.

20. Wiring closet: Overview

21. Wiring closet: Specification • A central point of a star topology. • Where the horizontal cabling runs must be attached and the patch panel must be installed. • The size will vary with the size of the LANand the types of equipment required to operate it: • Each floor must have a minimum of one wiring closet. • Each 1000 m2 have a wiring closet.

22. Wiring closet: Size

23. Wiring closet: Environmental • Materials for walls, floors, and ceilings. • Temperature and humidity. • Locations and types of lighting. • Power outlets. • Room and equipment access. • Cable access and support.

24. Rooms must not have a dropped, or false, ceiling 20mm plywood that is at least 2.4m • Minimum load capacity. • Raised floor or Ladder Rack Support. • Tiled, or some other type of finished surface. Wiring closet: Wall, floor and ceiling

25. No water or steam pipes running through or above the room. Wiring closet: HVAC Temperature : 21OC Relative humidity : 30% - 50% HVAC : Heating/Ventilation/Air Conditioning

26. Wiring closet: Lighting and Power • Minimum of two dedicated, non-switched, AC duplex electrical outlet. • At least one duplex power outlet positioned every 1.8m along each wall. • Power outlet should be positioned 150 mm above the floor. • A lighting switch should be placed immediately inside the door. • Florescent lighting should be avoided for cable pathways.

27. Wiring closet: Room and equipment Wiring hub and patch panel were mounted to a wall with a hinged wall bracket. Wiring hub and patch panel were mounted with distribution rack

28. Wiring closet: Cable access • All horizontal cabling that runs from work areas to a wiring closet should be run under a raised floor. • When this is not possible, the cabling should be run through 10.2 cm sleeves that are placed above door level. Any wall/ceiling openings that provide access for the conduit.

29. Wiring closet: Identification • Draw a floor plan approximately to scale. • Identify the devices that will be connected to the network. • MDF is secure locations that are close to the POP. • Choose potential wiring closet locations. • Determining number of wiring closets.

30. Wiring closet: Floor plan

31. Wiring closet: Star topology Draw circles that represent a radius of 50m from potential wiring closets.

32. Wiring closet: Catchment area

33. Wiring closet: Potential location (PW)

34. Wiring closet: Identification PW • If there are any potential wiring closet whose catchment areas substantially overlap, you could probably eliminate one of the wiring closet. • If there are any potential wiring closet whose catchment areas can contain all of the devices that are to be connected to the network, then one of them could serve as the wiring closet for the entire.

35. Wiring closet: Practice • Do any of the circles overlap? • Can any of the PW locations be eliminated? • Do any of the circles provide coverage for all of the devices that will be connected to the network? • Which of the PW locations seems to be the best? • Are there any circles where only a few of the devices fall outside the catchment area? • Which PW is closest to the POP? • Based on your findings, list the three best possible locations for wiring closets. • Based on your findings, how many wiring closets do you believe will be required for this network? • What are the advantages and disadvantages of each of the PW?

36. Wiring closet: Practice (cont.)

37. Wiring closet: Practice (PWs)

38. Wiring closet: HOMEWORK • Teamwork: • 5 groups. • Object: • Identification wiring closets for floor plan. • Presentation: • 5-10 minutes per group. • Tools: • Microsoft Visio, Microsoft PowerPoint… • Feedback: • From other students.

39. Multiple Wiring closet: MDF and IDF • MDF: Main distribution facility • IDF: Intermediate distribution facility.

40. Multiple Wiring closet: Multi-story The MDF is usually located on one of the middle floors of the building, even though the POP might be located on the first floor, or in the basement.

41. Backbone: Components • Backbone cabling runs. • Intermediate and main cross-connects. • Patch cords used for backbone-to-backbone cross-connections. • Vertical networking media between wiring closets on different floors. • Networking media between the MDF and the POP. • Networking media used between buildings in a multi-building campus.

42. Backbone: Structure

43. Backbone: Media • 100 Ω UTP (four-pair). • 150 Ω STP (two-pair). • 62.5/125 µm multimode optical fiber. • Single-mode optical fiber. • Although TIA/EIA-568-A recognizes 50Ω coaxial cable, generally, it is not recommended for new installations.

44. Backbone: TIA/EIA-568-A • Each IDF can be connected directly to the main distribution facility. • IDF: horizontal cross-connect (HCC). • MDF: main cross-connect (MCC). • 1st IDF interconnected to a 2nd IDF. The 2nd IDF is then connected to the MDF. • 2nd IDF: intermediate cross-connect (ICC). • No more than one ICC can be passed through to reach the MCC.

45. Backbone: TIA/EIA-568-A (type A)

46. Backbone: TIA/EIA-568-A (type B)

47. Backbone: Maximum distance

48. Backbone: Single mode FO (type A)

49. Backbone: Single mode FO (type B)

50. Review • What is a wiring closet and how to identify the wiring closets? • What is the backbone cabling? • What are HCC, ICC and MCC?