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0 – Stock-out

0 – Stock-out. CMi DS 380 µm. Silicon. 1 – Litho #1 . Silicon. PR. AZ92xx 4 µm. 2 – Si Etch # 1. Silicon. PR. AMS 200  SOI_Accurate _++++ 70 um. 3 – Resist Strip # 1. Silicon. 4 – Anodic bonding. Pyrex. Silicon. Cleaning with Piranha

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0 – Stock-out

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  1. 0 – Stock-out CMi DS 380 µm Silicon

  2. 1 – Litho #1 Silicon PR AZ92xx 4 µm

  3. 2 – Si Etch #1 Silicon PR AMS 200  SOI_Accurate_++++ 70 um

  4. 3 – Resist Strip #1 Silicon

  5. 4– Anodic bonding Pyrex Silicon Cleaningwith Piranha Bonding in LMIS4 lab: 1000 V 350 °C

  6. 5– Thinning Pyrex 200 – 150 – 100 Silicon 70 Pyrex

  7. 6– Litho #4 (Inlets) AZ9260 8 µm Pyrex Silicon Pyrex PR

  8. 7– Si Etch (Inlets) Pyrex Silicon Pyrex PR 601E  Si_Ambiant_2

  9. 8– PR Strip #4 Pyrex Silicon Pyrex

  10. 9– Dicing Pyrex Silicon Pyrex

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