Diamond Wire Wafer Slicing Machine Industry in-depth analysis including leading key players

1. Diamond Wire Wafer Slicing Machine Industry in-depth analysis including leading key players Market Overview Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade. A dicing saw is equipped with the machine which cuts these wafers into individual chips. Materials that are sliced from these machine are silicon, silicon carbide, gallium nitride, gallium arsenide, and ceramic, among others. These wafers are used for production of semiconductors, which in turn, are used in the manufacturing of electronic components. One of the major factors attributed to growth of the market is restraints in using conventional slicing machines including high volume of wastage while cutting the wafer, low speed of slicing the wafer, and low quality of dices. These factors are driving manufacturers to develop advanced wafer slicing machines, to overcome the challenges associated with conventional machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing machine. This machine ensures maximum material utilization while cutting and it requires low electricity while production and this machine also not produces any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges associated with the recycling of silicon wafer. Request Sample Copy Of This Business Report: https://www.coherentmarketinsights.com/insight/request-sample/1864 Market Dynamics Increasing use of large size of wafer is a key trend that is being witnessed in the market. For instance, according to a press release of SEMI, a leading semiconductor manufacturing company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases, it will further increase the number of dies cut from it, which in turn helps in reduction of production cost as well as product wastage while slicing process. Therefore, as the size of wafer increase, it need more efficient machine to provide accurate cuts, and produce more dies from a single wafer. The market for diamond wire wafer slicing machine in Asia Pacific accounted for largest share in the global market in 2017. The factor attributed to growth of the market is increasing penetration of smartphones, increasing adoption of IoT, self-driving cars, and others. Therefore, rising demand for consumer electronics is leading to high demand for diamond wire wafer slicing machines. For instance, according to the Coherent Market Insights’ analysis, the number of smartphone users in India was 292.6 million in 2016 and it has grown to 342 million in 2017. Increasing demand for smartphones and advancement in smartphone technology has led to development of thinner and smaller ICs. This leads to high demand for diamond wire wafer slicing machine. Hence, this factor will help in propelling growth of the market during the forecasted period. Get Request Customization Copy Of This Business Report: https://www.coherentmarketinsights.com/insight/request-customization/1864 Major players operating in the global diamond wire wafer slicing machine market are Dalian Linton NC Machine Co., Ltd, Meyer Burger Technology AG, Slicing Tech,, Diamond Wire Technology, Disco Corporation, Plasma Therm LLC, Tokyo Electron Ltd, ATV Technologies, and EV Group among others.

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