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ACETITE ADHESIVES in LCD Applications

ACETITE ADHESIVES in LCD Applications. Toshiharu Noguchi Technical Manager Asec Co., Ltd. November 30, 2003. Mother Glass Bonding : UV (Temporary) Main Sealing : Heat-cure Epoxy → UV End Sealing : UV/Visible Light Cure Terminal Sealing (Reinforcement) TAB : Silicone → UV

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ACETITE ADHESIVES in LCD Applications

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  1. ACETITE ADHESIVES in LCD Applications Toshiharu Noguchi Technical Manager Asec Co., Ltd. November 30, 2003

  2. Mother Glass Bonding : UV (Temporary) Main Sealing : Heat-cure Epoxy → UV End Sealing : UV/Visible Light Cure Terminal Sealing (Reinforcement) TAB : Silicone → UV Clip Pin : UV FPC : UV Terminal Bonding (ACP): Heat-cure Epoxy → UV COG/ITO Coating : Silicone → UV Types Of Adhesives in LCD Application

  3. Adhesives in LCD Application

  4. Major Advantages of UV or UV/Visible Light Curable Adhesives: • Fast Cure → Reduction of Assembly Time • Solvent Free → Environmental friendly • One Component → Production Efficiency ↓ Total Cost Saving

  5. Main Sealing 400~1,000mm Glass Bonding 400~1,000mm MOTHER GLASS BONDING - 1 Processes: 1) Apply Main-Sealing Adhesive 2) Apply Mother Glass Bonding Adhesive 3) Align and mate Glasses 4) UV Light Exposure 5) Pressing and Heat curing

  6. MOTHER GLASS BONDING - 2 Requirements for Adhesive: • Non-Flow Viscosity • Easy Spread in Small Gap • Hot Strength (No movement during Heating) AS-6954 (20,000mPa-s, Thixo 4)

  7. END SEALING - 1 End Sealing Processes 1) Suck LC into Cell 2) Wipe excess LC around the Charging Port 3) Apply and Suck-In Adhesive (by Cooling Method or Press Method) 4) UV Light Exposure

  8. COOLING Method STEP 1: Filling LC into Cell STEP 2: WIPING OFF Excess LC STEP 3: Applying UV Adhesive STEP 4: Cooling Cell down to 10-15deg.C STEP 5: Curing by UV Radiation PRESS Method STEP 1: Filling LC into Cell STEP 2: Stacking 20-60 Cells STEP 3: Pressing STEP 4: WIPING OFF Excess LC STEP 5: Applying UV Adhesive STEP 6: Releasing Press slightly STEP 7: Curing by UV Radiation Sealing Process Details END SEALING - 2

  9. 4) 2) 3) 1) LC END SEALING - 3 Main Problems In End Seal: 1) LC Disordering: Color difference / Contrast 2) Occurrence of Irregular shapes(“HIKE”) at Neck Region: Poor Appearance & LC Leakage 3) Gaps between End Seal & MainSeal: LC Leakage 4) Debonding of End Seal: LC Leakage

  10. END SEALING - 4 Requirements of End Sealant • Good Compatibility with LC (Low Extractive Ionic Compounds) • Good Adhesion to substrates (LC wetted) • Low UV Energy Curability (500~1,000mJ/cm2) (High CTV → Visible Light Curability) • Resistance to Washing agent • Durability • Appropriate Viscosity AS-1202 (6,000mPa-s) AS-1010 (10,000mPa-s) AS-1203 (20,000mPa-s)

  11. UV Adhesive TAB ACF UV Adhesive FPC ACF TERMINAL SEALING - 1 Application • Clip Pin: TN (Segment Type) • FPC, TAB: STN, TFT Process 1) Dispensing Process: One-sided or Two-sided a) Roller Method b) Syringe Method 2) UV Light Curing Process

  12. Terminal Sealing - 2 Requirements of Terminal Sealant • Good Adhesion to Glass, ITO, Sn, PI • Flexibility (Low Stress) • Moisture Resistance • Durability to withstand Thermal Shock & Thermal Aging • High Temp. resistance (Pin Clip) • Cure Depth > 1.0mm (Pin Clip) • Appropriate Viscosity AS-2002 (5,000mPa-s) AS-1057 (9,000mPa-s) AS-1204 (20,000mPa-s)

  13. FPC Au coated sphere Cu Pattern ACP ITO Pattern Glass TERMINAL BONDING - 1 Application • FPC to Glass (ITO, Conductive) Process 1) Apply ACP on ITO Terminal Pattern 2) Put FPC on the ITO Terminals 3) UV Light Exposure with Pressing

  14. TERMINAL BONDING - 2 ACP • UV Adhesive + Conductive Particles • Particles • Au coated Sphere Resin • Diameter: 3 ~ 5μm Requirements of UV Adhesive • Good Adhesion to Glass, ITO, FPC • Appropriate Flexibility • Appropriate Cure Shrinkage (Pressing Force) • Moisture Resistance and Durability • Appropriate Viscosity AS-2002 (5,000mPa-s)

  15. Overcoat Resin IC Chip FPC ACF or ACP COG/ITO OVERCOATING - 1 Processes: 1) Mount IC Chip on Glass (ITO Circuit) 2) Heat-Pressing 3) FPC Bonding with ACF or ACP 4) Apply COG Overcoat Resin over IC and ITO Pattern 5) UV Light Exposure

  16. COG/ITO OVERCOATING - 2 CURRENT PROCESS Bottle Neck 1) Insufficient Moisture Protection capability with RTV Silicone 2) Low Productivity due to Long Curing Time with RTV Silicone UV Curing Adhesives

  17. COG/ITO OVERCOATING - 3 Requirements of COG OVERCOATING RESIN • Low Water Permeability • Not Corrosive • Low Stress (Low Shrinkageor High Flexibility) • Toughness • Good Wettability (Glass, ITO, PI, Si) • Adequate Low Viscosity (< 1,000mPa-s) • Fast Cure (< 1,000mJ/cm2) • Durability (Thermal Shock, Heat Aging) AS-2008 (600mPa-s)

  18. Appendix LIGHT SHIELD RESIN - 1 Application 1) Protect IC of COG from Malfunction by Light 2) Apply the opposite side of Glass IC mounted 3) Current Process: Al or Black Adhesive Tape Overcoat Resin IC Chip FPC ACF or ACP Light Shield Tape or Resin

  19. LIGHT SHIELD RESIN - 2 Requirements of LIGHT SHIELD RESIN • UV/Visible Light Opaque (Black, White or Silver) • Screen Printable (High Productivity) • Good Adhesion to Glass • Adequate Low Viscosity (< 1,000mPa-s) • Fast Cure (< 1,000mJ/cm2) • Durability EX03-133 (6,000mPa-s)

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