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Front-End R and D in HEP (Room temperature and Cryogenic Temperature)

Front-End R and D in HEP (Room temperature and Cryogenic Temperature). Analog /digital Asic. Mains analog blocks Charge Sensitive Amplifier Shapers Buffer. Full diff CSA. ILC (DHCAL et ECAL) INNOTEP (medical imaging project) Beam profiler for hadrontherapy T2K.

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Front-End R and D in HEP (Room temperature and Cryogenic Temperature)

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  1. Front-End R and D in HEP (Room temperature and Cryogenic Temperature) Analog /digital Asic • Mains analog blocks • Charge Sensitive Amplifier • Shapers • Buffer Full diff CSA • ILC (DHCAL et ECAL) • INNOTEP (medical imaging project) • Beam profiler for hadrontherapy • T2K AMS 0.35 CMOS and BiCMOS process

  2. Technology transfer TARANIS Project through CESR in Toulouse via MIND/C4I Experiment goal : Measurement of the energetic electrons generated by atmospheric thunderstorms, space electronics (µsatellite) Front-end analog blocks (CSA, Shapers, comparators) come from several projects (INNOTEP, ILC T2K) 2 types of detectors : CdZnTe and Si diode

  3. R&D dedicated to ILC/Calice Very-front-end electronics of SI-W calorimeter: • Dynamic range of 15 bits • Global precision > 8 bits • Embedded multi-channels chips • > 100.106 channels • Ultra-low power : 25 µW per channel 2002 • 2-gain shaper (Gated integrator) • analog memory 2007 Low power ADC: • 10-bit pipeline • 12-bit cyclic 2008 • Single VFE channel including ADC 0.12 µW/conversion with power pulsing 25 µW with power pulsing 2009 Next steps • Improvement of the precision of ADC • Reference voltages sources • Multi-channel chip • Power pulsing management • Digital block inside the chip • Improvement of the consumption • … The embedded VFE chip inside the sandwich structure of the Ecal detector

  4. INNOTEP (AMS 0.35µm SiGe) ANR GANHADRON + ENVISION CONSORTIUM (AMS 0.35µm or 130nm IBM process : To be Discuss) • Fast preamplifier and 40ns shaper (tested) • Used for a 40 channels demonstrator. • 100 Mhz 8 bits ADC (S. Crampon thesis) • First version tested, need of an iteration • Beam profiler : high counting rate (100Me/s) • TOF : 1ns resolution • TOF PET : very high timing resolution << 200ps • Very High speed ADC >> 500Ms/s • Very fast preamplifier and shapers

  5. OUT GOING Microelectronic part of the EREBUS project “Intelligent sensor to limit the nitration Of industrial process and the rejection of VOC (Volatile Organic components) IBM 130 nm • SLHC : CMS tracker upgrade • High speed serial link (up to 1Gbit/s) • Digital data acquisition • 3D integration : High speed serial link forinter level communication(same as CMS tracker upgrade) • R&D on useful buildings blocks (comparators, • Amplifiers etc…) • Preamplifier, shaper, ADC and treatment. • Technology transfer (bourse CIFFRE)

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