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4-channel ASIC Tests. Michael Baumer, Jean-Francois Genat, Sam Meehan, Eric Oberla August 26 th 2009. DC, AC, Anodes tests (see also Eric’s document). DC tests (Chicago) - No s/w needed - DC power vs biases, ring oscillator frequency, ADC ramp monitoring, token passing
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4-channel ASIC Tests Michael Baumer, Jean-Francois Genat, Sam Meehan, Eric Oberla August 26th 2009
DC, AC, Anodes tests (see also Eric’s document) • DC tests (Chicago) • - No s/w needed • - DC power vs biases, ring oscillator frequency, ADC ramp monitoring, token passing • AC tests (Hawai’i) • - Chip on board (wire-bonding) • - DACs, • - FPGA, • - USB interface (in the FPGA), • - Fast pulser, (IEEE488 to PC) • - F/w and s/w: load FPGA, program and trigger pulser, control DACs, • read digital data, manage results, (LabView ?) • Functional and parametric tests: • - Sampling cell output vs input and sampling window • - Max sampling rate, analog bandwidth • - Leakages (voltage droop), • - Resolution • - Crosstalk • - Linearities, dynamic range, • - Readout speed. - Anodes/MCP tests (Chicago) - 4 chips (16 channels, 4”) - FPGA - DACs - USB - Test f/w and s/w 1
DC tests card DC test card
Detector tests with 4-channel ASIC Goal: Check the sampling ASIC with an actual detector
Flip-Chip • - CVInc (TX) contacted • They can do it, not clear yet if: • - Real “cheap” stud-bonding, or • Regular “expensive” bump bonding requiring an Under Bump Metallization • - Barcelona people will answer next week