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FORGING LOCATOR. WYMAN GORDON. DETAILED DESIGN REVIEW. ROCHESTER INSTITUTE OF TECHNOLOGY Multi-Disciplinary Senior Design Team 12556 KEVIN CONWAY (ME, Lead Engineer) MARK GONZALEZ (ME) ROBERT HAGEN (EE) JOE MAJKOWSKI (EE) JORGE VIANA (ISE, Project Manager). OUTLINE.
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FORGING LOCATOR WYMANGORDON • DETAILED DESIGN REVIEW ROCHESTER INSTITUTE OF TECHNOLOGY Multi-Disciplinary Senior Design Team 12556 KEVIN CONWAY (ME, Lead Engineer) MARK GONZALEZ (ME) ROBERT HAGEN (EE) JOE MAJKOWSKI (EE) JORGE VIANA (ISE, Project Manager)
OUTLINE • Introduction of Wyman-Gordon • Forging Process • Manufacturing Environment • Customer Necessity & Requirements • Detailed Design – Electrical Feasibility • Sensors and System Orientation • Processing System Design • Data Logging System Design • Electrical Display Design • Detailed Design – Mechanical Feasibility • Sensor System Bracket Design • Sensor Enclosure Design • Display Design
OUTLINE (continued) • Bill of Materials • Mechanical Sub-Systems • Sensor System Bracket • Sensor Enclosure • Display Enclosure • Electrical Sub-Systems • Sensors • Processing System • Data Logging System • Electrical Display • Risk Assessment • Schedule
WYMAN-GORDON • Global leader in manufacturing of titanium, steel and nickel–based forgings. • 50,000 ton press National Historic Mechanical Landmark • 3 Primary Markets • Aerospace ( Landing Gear/ Airframe structures) • Energy (Various Turbine Engines and components) • Military (Airframe structures / Vehicle Armor)
FORGING PROCESS • Billets are heated to 1700⁰F-2100⁰F. • Dyes are lubricated with graphite based lubricant (sometimes a non-stick paper). • Forklifts transfer the hot billets from the oven to the dye. • Workers with crowbars have roughly 60 seconds to position the hot forging within the dye. • The operator gets the go-ahead from the workers, the press closes and the billet is forged. • The press opens, workers blast the dye with compressed air clearing the debris into the exhaust fans. • The forged billet is removed and the process starts all over again.
ENVIRONMENT • Hot • Dyes < 900oF • Billets < 2100oF • Flames and Smoke • Graphite based lubricant ignites • Flying Debris • Debris is blown out of the dye using compressed air • Debris is sucked into the exhaust fans • Dirty and Dusty • Dust had encapsulated the entire forging building due to the grinders • High impact • Large forklifts • Worker with crowbars
CUSTOMER NECESSITY • Problem: • Current Billet Positioning Technique: • Visual Judgment = Art Form • Majority of the workforce is getting ready to retire. • Lack of a medium for knowledge transfer • Process is currently less systematic • Leads to $1M in scrap and rework • Solution: • Sensor Positioning System
CUSTOMER REQUIREMENTS • Position the billet within + 0.25” of a predetermined position within the dye. • Communicate: • Position relative to the ideal position • Necessary corrections • Catalog position electronically in reference to the part and job number. • Withstand the harsh environment. • Minimal physical and visual interference with operators and forklift drivers • Dynamic/real time feedback throughout process
SYSTEM LAYOUT • 3 Major Components • Computer • Lasers • Display • Computer will be used for data storage and laser interface • Laser will be used in order to interface with display
OPTONCDT ILR1181 LASER DISTANCE SENSOR • Time of flight sensor • Data acquisition and interface software available • RS232 or RS422 serial interfaces • Has been utilized on measuring red hot materials. • Class 2 laser (No eye protection) Red 650 nm output • Alarm function to supply up to half an amp • Can reference measurement from any point • Measuring Range Black Material .4m - 17m • Resolution .1mm • Repeatability less than .5 mm • Linearity ±2mm (+15°C … +30°C), ±5mm (+30°C … +50°C)
TIME OF FLIGHT SENSOR • Sends out a laser pulse and measures time to receive the beam back. • Theoretically the infrared pulse will have more power than the noise floor making it visible to the sensor. • Word of mouth that this has worked on materials emitting infrared noise • Test plan has been produced to confirm accuracy of laser on heated pieces of material.
DATA ACQUISITION • Data exported into column format in excel. • File name/path specified in program • 3 values exported • Time • Distance • Error
LOGIC SETUP • Set each alarm to trigger High when box is within spec or too close to the sensor • High = 24V Low = 16V • Alarm zones will intersect to within spec (Red zone) • When inside the tolerance zone all four alarms are logical high, triggering green light indication • When outside tolerance triggers respective arrow circuit with low signal • Logical high for each • Low • Piece • outside zone • High
When an alarm line is low, circuitry in respective arrow is triggered turning on red LEDs (indicating direction needed to move) • All alarms lines being high, triggers green LED circuitry to turn on center circle giving the go ahead to operators • 2 different types of circuit boards • needed • DISPLAY
ARROW CIRCUIT SIMULATION • Ground is the signal line • When high circuit essential an open(no current flow) • When low, voltage differential of 8V creates current flow of 8.546mA • LEDs have maximum rating of 10mA • LEDs will not be supplied to much current and will turn on
CIRCLE CIRCUIT SIMULATION • All inputs high, no current to diodes, Power BJT is on which allows current to flow through the BJT and the LED's to draw power • 9 Green Diodes, max rating of 20 mA • Resistors set to 330 ohms to limit current.
CIRCLE CIRCUIT SIMULATION • All inputs are low. Current drawn for LEDs is minimal at 30pA.
CIRCLE CIRCUIT SIMULATION • Worst case only one input is low. • Circuit still draws small current of 56.6pA • LEDs should not glow with this current.
DISPLAY CIRCUIT PCB • Bottom Top Silk Screen
WIRING HARNESS • RS-422 uses 24/4 shielded wire • Other connections 244AWG
ENCLOSURE • Protective housing for Sigma-Epsilon Sensors • Thermal insulation is primary function • Die Temp 700-900 °F • High temperature insulation for use in fire protection • Aluminum Housing • 1/8” thick sheet top • ¼” Al Block bottom support • Weight: 9.5 lbs. • External Port for Sensor Harness • View hole for Sensor Optics • Air Purge System • Increase visibility of line-of-sight to environment • Additional cooling of sensor (secondary function)
ENCLOSURE • Determine the necessary thermal conductivity (k-factor) of the insulation (0.875” thk) to provide acceptable operating temperatures for the sensor (50°C) • Radiation dominated heat transfer problem • Assumptions: • qrad = qconv • The bulk temperature for convection was 900 °F (773 K) • h = 15 W/m2*K (free convection of air) • Excluded Forced convection within box • Aluminum outer case • 0.125” thick (0.00317 m) • ɛ = 0.18 , k = 218 W/m*K • Area = 29.44 in2 (0.0189 m2) • Results • @ 0.875” thk, k = 0.116 W/m*K (0.067 Btu/h-ft-F ) • Chosen Material: k @ 427 °C (900 °F) : 0.115 W/m*K
ENCLOSURE SUPPORT • Provides Horizontal and Vertical Motion • Allows sensors to view distinct billet geometries • Aluminum/Steel Build • Al blocks, Al Square Tubing, Steel Blocks • Weight: 24 lbs. • Horizontal Travel • Steel Rail Guide (double track T-slot) • Supports Enclosure & Vertical Adjustment • Fixed w/ Set screw to Rail. • Vertical Adjustment (Telescoping Bars) • 5” Adjustable Height • Height Maintained w/ Set screw (0.375”) • Die Measuring Configuration • Sensor w/o Telescoping feature • Located lower (rests on Steel Rail Guide)
ENCLOSURE SUPPORT (CONTINUED) • Die Measuring Configuration • Exploded View
SET SCREW ANALYSIS • Find necessary pressure applied from set screw to hold sensor up • Basic Static Problem w/ friction • Parameters • Weight: 14.24 lbs. • Friction coefficient (Al –Al dry): 1.05 • Area of contact( minimal): 2.625 in2 • Results • The Set-screws require a maximum of 5.2 psi of pressure to maintain static equilibrium
RAIL SUPPORT SYSTEM • Rests on Shoe of Die Press • Provides horizontal motion to all sensors • Length: 4 ft. • Aluminum/Steel Build • Al Sheet, Al Square Tubing, Steel Block • Weight w/o sensors: 43lbs. ( 88 lbs. in configure shown) • Magnetic Feet Attachment (not shown) • Prevents movement before/during/after press processing • Maintains location for accurate readings
STRUCTURE ANALYSIS • Static Analysis • Determine if Rail system can support weight of sensors • Results • Maximum Stress : 123 psi on guide rail (compressive yield stress = 36ksi) • Maximum Strain: 9.1565 microns/in
OSHA REQUIREMENTS • ILR-1181-30 Time of Flight Sensor manufactured by Mirco-Epsilon • Class II Laser: described as a low-power visible laser that emits above Class I levels but at a radiant power not above 1 mW. • Human aversion reaction to bright light will protect a person • Accident data on laser usage have shown that Class II lasers are normally not considered hazardous from a radiation standpoint unless illogically used. • Direct exposure on the eye by a beam of laser light should always be avoided with any laser, no matter how low the power. • Sensor will be enclosed, so no protection will be needed. • More information: http://www.osha.gov/dts/osta/otm/otm_iii/otm_iii_6.html
SUMMARY OF HAZARDS • UV and Near-Infrared (NIR) wavelength ranges do not apply to Class II Lasers. • VIS (Visible) wavelength ranges do apply to Class II Lasers. • NO fire or diffuse ocular hazards. • Direct ocular hazards will occur only after 0.25 seconds of being exposed.
BILL OF MATERIAL (BOM) • Divided in 3 sections: Electrical, Mechanical and Supplementary Parts. • Consists of Part Description, Part Number, Manufacturer, Vendor, Unit Price, Quantity, Price, Lead Time, and Link. • Most vendors authorized by RIT. • Biggest Expense: TOF Sensor by Micro-Epsilon at $1,840 each ($11,040 total). • Initial Budget of $15,000, flexible according to needs. • Total expenses with a 5% Contingency on the Total Price: $19,300
MAJOR RISKS • Lead Times • Sensors not being adequate for customer needs. • Components not interfacing. • Miscommunication with customer. • Failures due to temperature or interference. • Exposure to Water. • Tolerances are not met. • The equipment is not deployable at location.
MILESTONES • -Senior Design Review (Week 5-MSD I) • -Detailed Design Review (Week 10-MSD I) • -Present BOM to Wyman Gordon (Week 10-MSD I) • -Testing TOF Sensor (Week 11-MSD I) • -Purchase Requisitions (Week 1-Week 3 MSD II) à Once Budget is approved. • -Building, Testing and Incorporation of System (Week 4 to Week 8-MSD II) • -Imagine RIT Presentation (Saturday May 5th, 2012) • -Project Review Presentation, Poster Session., and Technical Paper (Week 10-MSD II) • -Visit Wyman Gordon for Installation of System ( Week 10- MSD II) • -Final Project Management Review + Uploading of all documentation (Week 11-MSD II).