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IBIS & ICM Interfacing: Three Options

IBIS & ICM Interfacing: Three Options

IBIS & ICM Interfacing: Three Options. Michael Mirmak Intel Corporation December 4, 2007. IBIS & ICM Today. High demand for improvements to IBIS package technology ICM can describe almost any interconnect ICM today includes Interconnect RLGC or S-parameter characteristics

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297 views • 29 slides
IBIS & ICM Interfacing: Three Options

IBIS & ICM Interfacing: Three Options

IBIS & ICM Interfacing: Three Options. Michael Mirmak Intel Corporation December 4, 2007. IBIS & ICM Today. High demand for improvements to IBIS package technology ICM can describe almost any interconnect ICM today includes Interconnect RLGC or S-parameter characteristics

★ ★ ★ ★ ★

304 views • 29 slides
IBIS & ICM Interfacing: A New Proposal

IBIS & ICM Interfacing: A New Proposal

IBIS & ICM Interfacing: A New Proposal. Michael Mirmak Signal Integrity Engineering Intel Corp. Chair, EIA IBIS Open Forum June 11, 2005. IBIS & ICM Today. Big demand for ICM as IBIS package technology ICM can describe almost any interconnect ICM today includes

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514 views • 24 slides
IBIS & ICM Interfacing: A New Proposal

IBIS & ICM Interfacing: A New Proposal

IBIS & ICM Interfacing: A New Proposal. Michael Mirmak Signal Integrity Engineering Intel Corp. Chair, EIA IBIS Open Forum June 11, 2005. IBIS & ICM Today. Big demand for ICM as IBIS package technology ICM can describe almost any interconnect ICM today includes

★ ★ ★ ★ ★

262 views • 24 slides

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