'Mv peak' presentation slideshows

130 nm Module

130 nm Module. With wider ABCn130 . Reduces wire length with same angle by 1.1 mm (6.7 to 5.6 mm). Wider Chip Details. By widening chip by 400 m m and having only two test bond pads per row (in blue) can increase bond pad pitch from 109 m m to 119 m m. Comparisons at Liverpool.

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