Auto Ball Refill Guideline (For host s/w v1.43 or above)

1. Auto Ball Refill Guideline(For host s/w v1.43 or above) Prepared by : ASM BP Product Team Date : 15th Nov, 2005

2. 2000 1000 6 New feature in v1.43 Auto Ball Refill Parameters • For host v1.43 or above, three parameters (in recipe setup) are used to control ball refill • Auto ball refill – Before cylinder cutoff delay • Duration for refill head rolls down to transfer balls to ball refill tube • Auto ball refill – After cylinder cutoff delay • Duration for BSU rolls down for clearing balls in refill tube to ball sweeper • Auto ball refill cycle interval • No. of strips to process for auto ball refill cycle

3. Auto Ball Refill Parameters Ball refill head Ball refill tubes BSU Ball sweeper Ball refill head rolls down for dropping solder balls to ball refill tubes BSU rolls down for transfer the solder balls in ball refill tubes down to ball sweeper

4. Auto Ball Refill Setting • Set Auto ball refill – Before cylinder cutoff delay • Typically ~2000 (i.e. 2s) • Set Auto ball refill – After cylinder cutoff delay • Typically ~1000 to 1500 (i.e. 1-1.5s) if before cylinder cutoff delay = 2000 • Check if all solder balls in ball refill tube drop down to ball sweeper before BSU starts rocking. • Set Auto ball refill cycle interval • Need to ensure auto ball refill rate is a bit slower than ball consumption rate in ball sweeper • Initially set a high auto ball refill cycle interval (eg. 6 to 8) and check time interval for long refill during normal production • Reduce the auto ball refill cycle interval until the time interval for long refill increases to ~1 hr • Recommended long refill delay is ~10000-15000 (i.e. 10 – 15s)