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The “Insertable B-Layer” Project

The “Insertable B-Layer” Project. PH-DT / PH-ADx meeting. Motivation. The present ATLAS Pixel Detector has 3 Layers, the innermost is called “B-Layer” The B-Layer will gradually loose efficiency due to radiation damage to sensors and chips

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The “Insertable B-Layer” Project

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  1. The “Insertable B-Layer” Project PH-DT / PH-ADx meeting

  2. Motivation • The present ATLAS Pixel Detector has 3 Layers, the innermost is called “B-Layer” • The B-Layer will gradually loose efficiency due to radiation damage to sensors and chips • It needs to be replaced by ~2013 (before high-luminosity running) • Replacing the B-Layer was studied in detail and was found to be not feasible because • Time required is significantly longer than winter shutdown 2013/14 • Risks to Layer 1 and 2, which stay in place, are significant • Solution: Add a 4th Pixel Layer inside the present B-Layer: The Insertable B-Layer • Existing Pixel detector stays installed and a 4th layer is inserted inside the existing pixel detector together with new beam pipe . (Requires new, smaller radius beam pipe to make space) • This is the first project of the ATLAS Upgrade program • It serves also as a “technology step” from now to sLHC (e.g. 4x radiation hardness) • The IBL project will be the first to use much of the new technologies currently under development for sLHC (FEI4 chip, new sensors, …)

  3. Layouts under study • Uses newly developped FE chip: FEI4 • Pad size 50x250m • 20.1x19.6mm • Radiation hardness >200Mrad • 15 staves, each with 32 FEI4 Frontend chips • 16 degree tilt angle • ~37 mm sensor radius (tbd) • ~33 Inner Radius, 41.5 Outer Radius • Beam pipe ID 25

  4. IBL flow chart “Module WG” “Stave WG” CF support + pipe Sensors Module Stave Assembly Stave loading Bump-Bond EOS HDI FEI 4 Test & QC Internal Services EOS-PP1 Test & QC (elec, opto, thermal) Preparation of off-detector system in USA 15 & CR (DAQ, DCS, ROD, Opto board, PS, Cooling) “Integration & Installation WG” Stave integration to support and BP + Testing of IBL (on surface) Beam Pipe Global Supports “Off-detector WG” IBL and BP Installation in Pit + Installation & Connection to services in the pit Test of services to PP1 Commissioning with Pixel system and ID deliverables “aware”

  5. IBL Organization IBL is a SLHC Phase I upgrade project: Present Pixel Institutes, new Institutes and Upgrade PO will contribute to construction; The ATLAS CB has asked PL (G. Darbo) and TC (H.Pernegger) to proposed an organization for the IBL project Organization will have IBL Institute Board (IB) to discuss and agree important parameter of the project: MoU, contribution to deliverables, schedule, costing,,… Management Board (MB) to follow the execution of the project.

  6. Management Board (MB) • IBL Management Board • Membership: • IBL PL + IBL TC • 2 coordinators from each WG • Plus “extra” members • Module WG • (2 coordinators) • FE-I4 • Sensors • Bump-Bonding • Modules • HDI • Test & QC • Irradiation • Stave WG • (1 Phys + 1 Eng.) • Staves • Loaded Stave • Internal Services • Test & QC • IBL Integr.-Install. • (2 Eng.) • Stave Integration • Global Sup. • Beam Pipe (BP) • Ext.services inst. • IBL+BP Installation • Cooling Plant • Test & QC • Off-detector • (1 Phys + 1 E.Eng.) • Power • DCS • ROD • Opto-link • Ext.serv.design/proc. • Test Beam • System Test

  7. IBL Timeline • Super-simplified RD & Prototyping FDR Module Production

  8. WBS • WBS : • Defines the main deliverables & costs for IBL project • Discussion for responsibility sharing have started at IB & MB • WBS items are associated to WGs • WBS is the backbone for TDR • WBS on EDMS: https://edms.cern.ch/document/982037/1 • Aim to arrive at Interim MoU by June/July For detailed list see attached PDF

  9. Working Group “ Module” Module WG = Sensors + FE-I4 + Bump-Bonding Deliverable: Modules with 460 FEI4s Detector modules (with spares) tested and ready to be loaded on stave Design, production and QC of HDI (High Density Interconnect Flex Hybrid) Responsibility include Sensors (all of WBS 1) FEI 4 (WBS 2.1) Bump Bonding (WBS 3.1) HDI flex hybrid & test (WBS 3.2) Bare module & test (WBS 3.3) Single Module test system (WBS 2.7) Irradiation (WBS 12.1)

  10. Possible participation in Module activity • Main Steps • FEI4 prod & QC • Sensor Prod & QC (Currently 3D and planar silicon are in development, CVD dia are under discussion) • Bumpbonding • Mounting of Flex circuit • Wirebonding • Test of Module • PH-DT and PH-ADE together have expertise and infrastructure in this activity, e.g. • Test and QC of Sensors • Flex circuit mounting and Wirebonding in DSF • Test of Pixel Modules (electronic, source) • Irradiation and Testbeams for Sensors and Modules • Can envisage a very fruitful cooperation in these area

  11. Working Group “Stave” Stave WG = Stave Integration Activities covered by this WG will mainly happen outside CERN Deliverables: 15 (+ spare) staves assembled, cabled and tested Responsibility include Prototype stave (WBS 4.3) Local support and stave (WBS 4.1, 4.2) End Of Stave card (EOS) (WBS 2.2) Internal cables and cooling pipe (WBS 5.1 WBS 5.2) Main activity area: Mechanical: stave design (FEA, Thermal Analysis) Tooling for Loading Modules, Stave QC Electrical: electrical design and test (signals, DCS and power transmission), testing of loaded stave & QC.

  12. Working Group “ IBL assembly and installation These activities will be in SR1 and pit and cover the overall assembly and installation Lead by R. Vuillermet & N. Hartmann Deliverable: IBL package & beam pipe installed and cabled Installation of cables, opto-fibers, detector cooling Responsibility include: Assembly on surface to support (all of WBS 7) Beam pipe & interfaces (all of WBS 6) PP1 cable and cooling services, opto board mechanics (WBS 5.3, WBS 5.4) External cooling (all of WBS 9) Installation in the pit (all of WBS 10) Main activities: Integration of Staves around beam pipe + Tests after integration Removal of BP Installation of IBL+beam pipe package inside existing pixel system PH-DT and PH-ADE share a lot of expertise in this area, e.g. Mechanical engineering, Design for tooling and assembly procedure System testing of assembled detector

  13. Working Group “Off-detector” Deliverable: all off-detector systems and services to PP1 - installed, tested and ready to connect to IBL Responsibility include DAQ, DCS, Interlock, PS (all of WBS 11) electronics (WBS 2) except FEI 4 and EOS (i.e. WBS 2.3,2.4,2.5,2.6,2.7) External services and service installation (all of WBS 8) Test/Qualify first-off components in system test Main activity: Hardware Readout system and Detector powering Software adaptation and system integration to existing pixel system

  14. Conclusion • IBL project is the first upgrade project in ATLAS • Build and install a new pixel B-Layer by 2013 • It includes key R & D areas for sLHC upgrade (FE electronics, radhard sensors,…) • It will be the first to use those developments, hence the IBL serves as a very good “entry-point” to sLHC upgrade activities • PH-DT and PH-ADE together have a lot of expertise in core areas of the IBL project • Sensors and Modules • Integration and Engineering • A common participation in selected IBL activities can be an attractive entry to LHC upgrade with clear deliverables on timescale of 4 years • The IBL will allow us to be contribute in several areas of our core expertise and use existing experience and infrastructure.

  15. Backup slides

  16. IBL Management Board IBL Management Board (MB) membership IBL Project Leader: G. Darbo IBL Technical Coordinator: H. Pernegger “Module” WG: 2 Physicists “Stave” Working Group: 1 Physicist + 1 Mechanical Engineer “IBL Assembly & Installation” WG: 2 Engineers initially, a Physicist later. “Off-detector” WG: 1 Physicist + 1 Electronic Engineer “Extra” members: Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling) Offline “liaison”: Pixel Off-line coordinator TDR editor: (temporary) Weekly meeting (2 hrs) with “core” group of WG responsibles

  17. IBL Cost Evaluation Cost constructed on WBS deliverables ~20 persons consulted to obtain costs Based on update of old costs of the Pixel detector, beam-pipe Yield assumed from old production (modules) or other models (FE-I4) Installation cost considers consultancy and manpower for operation in activated – large spread.

  18. Software & Commissioning WG IBL Offline and Simulation WG (inside Pixel off-line with reporting to IBL MG) Layout Simulation Material budget monitoring through out project Later also Integration of IBL to off-line (e.g. like Byte Stream converter, data format,…) IBL Commissioning WG (as part of Pixel / ID commissioning) Include commissioning activities already now in planning Main activity of this WG is to monitor and prepare for the inclusion of IBL to Pixel operation system integration (DAQ-DCS, Links to Pixel and ID systems) E.g. through system test & test beam initially Include in schedule for IBL and ATLAS intervention for winter 2013/14 for planning purposes

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