Common BGA Rework Problems
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The circuit board rework method includes heating the surface mount component throughout the rework procedure until the solder balls or pads melt. The part can then be taken out, which is typically done in an infrared reflow oven. To know more visit this linku00a0https://www.solder.net/services/pcb-rework-and-repair-services/
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Common BGA Rework Problems
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