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Addressing Time-to-Market Issues in DS-UWB Proposal

This submission responds to comments on time-to-market issues for the DS-UWB proposal, explaining how concerns have been addressed by the comment resolution team. It discusses the challenges of aligning proposed specifications with existing silicon chips in DS-UWB products. The document emphasizes the need for clarity, credibility, and consistency in claims related to time-to-market advantages. It aims to facilitate discussion within the IEEE 802.15 Working Group for Wireless Personal Area Networks (WPANs).

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Addressing Time-to-Market Issues in DS-UWB Proposal

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  1. Project: IEEE 802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Response to the No Comments Involving Time To Market Issues] Date Submitted: [14Sept2004] Source: [Jack Pardee] Company [Innov8rs, LLC] Address [9135 W. Manitoba St. #2, Milwaukee, WI, USA] Voice:[+1 414-364-6688], FAX: [], E-Mail:[Jack.Pardee@ieee.org] Re: [15-04-0377-11-003a-consolidation-explanations-no-vote-confirmation.doc] Abstract: [Response to 802.15.3a No Vote Comments] Purpose: [Explain rationale for how one or more no votes for confirmation of DS-UWB merger #2 proposal have been addressed by the merger #2 comment resolution team.] Notice: This document has been prepared to assist the IEEE 802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by 802.15.

  2. Time To Market - Representative Issues • Time to market for DS-UWB proposal • Currency of proposed specification for standardization vis-à-vis the silicon chips in DS-UWB products presently being shipped

  3. Representative TTM Comments • #3 - It is not clear what the time to market for this proposal is. • #55 - I would consider changing my "NO" vote for merged proposal #2 to a "YES" vote if:There is a better explanation of the time-to-market considerations. • #84 - I also have concern for power and time to market. Lack of data for these items as still missing

  4. Representative TTM Comments • #29 - Time to market Merge proposal #2 has repeatedly claimed time to market advantages because of "silicon shipping today". I have heard these claims for almost 2 years now repeated over and over again but there is no evidence that this is true. Since this proposal has changed as recently as last meeting, I am worried about time-to-market with this proposal because there is so much work to do and they are so far behind the dozens of vendors already building silicon and end products based on the MBOA proposal. Additionally, in the IEEE meetings the presenters or merged proposal #2 have repeatedly made contradictory statements about whether or not the proposal they are presenting represents the silicon they claim is commercially available. … For me to change my no vote to yes would require seeing working silicon that implements the proposal as I fear there is significant time to market concerns for merge proposal #2. In addition, I would require that credibility of their claims be re-established since there are so many inconsistencies in their past claims.

  5. Representative TTM Comments • #73 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

  6. Representative TTM Comments • #152 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

  7. Representative TTM Comments • #200 - Freescale has not addressed the questions raised regarding time to market issues with their proposal. The proposal has changed significantly several times, and yet they have continued to say they have ICs ready to ship with each version of their proposal. This is not a realistic statement.

  8. Representative TTM Comments • #253 - Time to Market - There is too much confusion in the argumentation about DS-UWB products. The arguments since 2003 are that "the silicon is already here, the production has started". However many changes have occurred since that time in Proposal#2, and the way the current silicon reflects or will reflect that (technical changes, interoperability, worldwide regulation) is very unclear to me (gate count, power consumption etc.).

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