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DMT 244 FAILURE ANALYSIS

DMT 244 FAILURE ANALYSIS. AHMAD SYAHIR B AHMAD BAKHIT School of Microelectronic Engineering. EVALUATION. FINAL EXAM : 50% MID TERM (20 DEC 2013) : 10% END TERM (07 FEB 2014) : 10% LABORATORY (WEEK 3-6) : 15%

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DMT 244 FAILURE ANALYSIS

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  1. DMT 244FAILURE ANALYSIS AHMAD SYAHIR B AHMAD BAKHIT School of Microelectronic Engineering

  2. EVALUATION FINAL EXAM : 50% MID TERM (20 DEC 2013) : 10% END TERM (07 FEB 2014) : 10% LABORATORY (WEEK 3-6) : 15% CASE STUDY/GROUP ASSIGNMENT : 15%

  3. COURSE OUTCOMES At the end of the course, student should have :

  4. SYLLABUS CHAPTER 1 : INTRODUCTION TO FA • DEFINE Failure Analysis (FA) , FA techniques, Failure Modes, Failure Mechanisms, Root Cause • ILLUSTRATE Failure Analysis process flow • EXPLAIN Differences between Destructive and Non-Destructive techniques

  5. CHAPTER 2 : ELECTRICAL CHARACTERIZATION • NAME and EXPLAIN different types of electrical failures • MAKE an interpretation of results of electrical characterization analysis CHAPTER 3 : PACKAGE ANALYSIS • IDENTIFY and EXPLAIN different techniques use to perform package analysis • ILLUSTRATE and EXPLAIN the concepts and principles of scanning acoustic microscopes. • COMPARE the advantages and disadvantages of acoustic micro imaging and x-ray/radiographic inspection

  6. CHAPTER 4 : FAULT LOCALIZATION • EXPLAIN the importance of fault localization. • IDENTIFY the common fault localization techniques • ILLUSTRATE and EXPLAIN the concepts and principles of thermal based method. • DESCRIBE photon – based method and other fault localization techniques. • IDENTIFY types of failures that can be detected using this FA techniques.

  7. CHAPTER 5 : DIE EXPOSURE • GIVE the differences between decapsulation and delidding . • EXPLAIN different types of decapsulation method available and the process of backside preparation.

  8. CHAPTER 6 : DIE DEPROCESSING • DEFINE deprocessing. • EXPLAIN the purpose of deprocessing. • EXPLAIN different types of deprocessing techniques. • COMPARE the advantages and disadvantages of each deprocessing techniques.

  9. CHAPTER 7 METALLOGRAPHIC CROSS – SECTIONING • ILLUSTRATE and EXPLAIN the concepts and principles of metallographic cross-sectioning techniques. • ILLUSTRATE and EXPLAIN the concepts and principles of metallographic cross-sectioning techniques. • IDENTIFY types of failures that can be detected using this FA techniques.

  10. CHAPTER 8 : INSPECTION TECHNIQUES • ILLUSTRATE and EXPLAIN the concepts and principles of Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM). • COMPARE the advantages and disadvantages of AFM vs SEM. • EXPLAIN other inspection techniques. CHAPTER 9 : FA CHALLENGES • EXPLAIN 10 primary challenges of FA and its trend.

  11. LIST OF EXPERIMENT • Cross-sectioning • Electrical Characterization • Reactive Ion etching (RIE) • Wet Decapsulation

  12. REFERENCES • Patrick O’Conner (2002). Practical Reliabiliy Engineering, Wiley • Failure Analysis, A Practical Guide for Manufacturers of Electronic Component and Systems, Marius Bazu and Titu Bajenscu, John Wiley • E. Ajith Amerasekera and Farid N. Najm (1997). Failure Mechanisms in Semiconductor Devices. 2nd Ed.: John Wiley & Sons • Lawrence C. Wagner, (1999). Failure Analysis of Integrated Circuits: Tools and Techniques.: Kluwer Academic Publishers. • Reliability and Failure Analysis (2012), Noraini Othman, Nurjuliana Juhari, Nur Hamidah Abdul Halim, UniMAP

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