Global IC Packaging Market to Exhibit a CAGR of 9.50% from 2022 to 2028

1. Global IC Packaging Market is anticipated to exceed USD 147.57 Billion by 2028, By SkyQuest Technology The IC packaging market is expected to benefit from increased government support. For example, the CHIPS for America Act, or the Creating Helpful Incentives to Produce Semiconductors for America Act, establishes investments and incentives to encourage semiconductor production, research and development, and supply chain security in the United States. Semiconductors will be crucial in the development and growth of connected and electrified vehicle technology. Automotive semiconductors will have a lot of opportunities to support increased connectivity, battery performance in electric vehicles, improved sensors, and other technologies in the quickly evolving automotive industry. The growing need for AI-based applications across a wide range of industries (including healthcare, telecommunications, energy, finance, transportation, agriculture, manufacturing, aerospace, and defence) will open up new opportunities for semiconductor manufacturers and suppliers. By boosting chip performance, cutting production costs, and increasing output, AI will also speed up semiconductor manufacturing. As a result, the demand for IC packaging is growing. The growth of the IC packaging industry is significantly driven by the growth of the semiconductor market, as packaging is an early stage in the electronics value chain. Get free sample pdf:https://skyquestt.com/sample-request/ic-packaging-market The DIP category of the market is expected to account for the largest share of the IC packaging market, with a CAGR of 9.7% over the forecast period. The DIP package is the most common method of packaging ICs and is also the most cost-effective. However, when compared to other package kinds, the size is larger. The WLP, BGA, and FC, on the other hand, are among the fastest expanding package types on the market. Smaller internal parts, such as small sized ICs, are necessary as the industry moves toward downsizing of products. This is what propels the market forward. With a market share of more than 90%, the Asia-Pacific region is likely to dominate the IC packaging industry. A major factor driving regional market expansion is the presence of major IC packaging and

2. assembly companies in the region. The Asia-Pacific area is widely recognised as a key global hub for integrated circuit assembly and packaging. Taiwan, China, Japan, and South Korea are important regional contributors to the IC packaging market's growth. The sector is not evenly distributed and is dominated by a small number of countries, including the United States, Taiwan, South Korea, Japan, China, and Europe. The entire production stack is not under the control of any one location. Asian countries manufacture 57% of semiconductor materials, 56% of wafer fabrications, and 70% of memory. Electronic design automation (EDA), logic, equipment, discrete and analogue are all areas where the United States leads the globe. As a result of this interdependence, no single country can maintain global leadership across the whole value chain. The high demand for ICs for numerous applications around the world has resulted in a supply deficit. In the future, the worldwide IC packaging sector may confront hurdles. Aside from that, natural disasters such as drought in Taiwan have wreaked havoc on the country's IC business. As a result, these are some of the elements that are posing a threat to the IC packaging market's expansion. The report published by SkyQuest Technology Consulting provides in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. Read full report : https://skyquestt.com/report/ic-packaging-market Report Scope & Segmentation Report Attribute Details Growth Rate CAGR of 9.50% from 2021 to 2028 2021 The base year for estimation Historical data 2016 – 2020 Forecast period 2022 to 2028 Report coverage Revenue forecast, company ranking, competitive landscape, growth factors, and trends ●By Type - DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others ●By Bonding Techniques - Wire Bonding, Flip Chips, Wafer Level Packaging, Others ●By Application- Memory IC, Logic IC, Discrete, SIP, Other Segments covered Regional scope North America, Europe, Asia-Pacific (APAC), Latin America (LATAM), Middle East & Africa (MEA)

3. Country scope US, Canada, Germany, France, UK, Italy, Spain, China, India, Japan, Brazil, GCC Countries, South Africa ●ASE Technology Holding Co. Ltd. (China) ●Amkor Technology (US) ●JCET (China) ●SPIL (China) ●Powertech Technology Inc. (China) ●TongFu Microelectronics Co. Ltd. (China) ●Lingsen Precision Industry Co. Ltd. (China) ●Sigurd Corporation (China) ●Greatek Electronics Inc. (China) ●OSE Corp. (China) ●Tianshui Huatian Technology Co. Ltd. (China) ●UTAC Holdings Ltd. (Singapore) ●King Yuan Electrics Co. Ltd. (China) ●ChipMOS Technologies Inc. (China) ●FATC (China) Key companies profiled Customization scope Free report customization (15% Free customization) with purchase. Addition or alteration to country, regional & segment scope. Pricing and purchase options Reap the benefits of customized purchase options to fit your specific research requirements. What does this Report Deliver? ●Market Estimation for 20+ Countries ●Customization on Segments, Regions, and Company Profiles ●100+ tables, 150+ Figures ●Global and Country IC Packaging Market Trends ●Comprehensive Mapping of IC Packaging Industry Parameters ●Attractive Investment Proposition ●Competitive Strategies Adopted by Leading IC Packaging Market Players ●IC Packaging Market drivers, restraints, opportunities, and impact on the market ●IC Packaging Market growth rate till 2028 ●Regulatory scenario, regional dynamics, and IC Packaging market insights of leading countries in each region ●Segment trends and analysis ●IC Packaging Market Opportunity analysis by region and country ●IC Packaging Market Segmentation opportunity and growth ●Porter’s five force analysis to know the market’s condition ●Pricing analysis

4. ●Parent market analysis ●Product portfolio benchmarking Speak with our analyst for more information :https://skyquestt.com/speak-with- analyst/ic-packaging-market SkyQuest has segmented the Global IC Packaging Market based on the Type, Bonding Techniques, Application and Region: ●Global IC Packaging Market by Type (Revenue, USD Billion, 2021 - 2028) oDIP oSOP oQFP oQFN oBGA oCSP oLGA oWLP oFC oOthers ●Global IC Packaging Market by Bonding Techniques (Revenue, USD Billion, 2021 - 2028) oWire Bonding oFlip Chips oWafer Level Packaging oOthers ●Global IC Packaging Market by Application (Revenue, USD Billion, 2021 - 2028) oMemory IC oLogic IC oDiscrete oSIP oOther ●Global IC Packaging Market Regional Outlook (Revenue, USD Billion, 2021 - 2028) oNorth America ▪ US ▪ Canada oEurope ▪ Germany ▪ France ▪ UK ▪ Italy ▪ Spain ▪ Rest of Europe oAsia Pacific ▪ China ▪ India ▪ Japan ▪ Rest of Asia Pacific oCentral & South America

5. ▪ ▪ Brazil Rest of CSA oMiddle East & Africa ▪ GCC Countries ▪ South Africa ▪ Rest of ME About Us: SkyQuest Technology is leading growth consulting firm providing market intelligence, commercialization and technology services . It has 450+ happy clients globally . Contact Us: Address: 1 Apache Way, Westford, Massachusetts 01886 Phone: USA (+1) 617-230-0741 Email: sales@skyquestt.com