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From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 20

From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 2009 PDE Workshop Tom Thurman (Ret.), Michael Benda Rockwell Collins Advanced Manufacturing Technology. Topics. About Rockwell Collins MBE Vision DFx

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From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 20

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  1. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 2009 PDE Workshop Tom Thurman (Ret.), Michael Benda Rockwell Collins Advanced Manufacturing Technology

  2. Topics • About Rockwell Collins • MBE Vision • DFx • Paper Based Data Flow • Fiducial Example • Filled Via Example • Model Based Data Flow • Immersive Visualization

  3. What Rockwell Collins Does • A Leading Supplier Of • Aviation Electronics • Airborne/Mobile Communication Systems • Roughly Equal Division Between Commercial And Military Sales > 15 Manufacturing Locations • Primarily High Value, High Mix, Relatively Low Volume Products • Reliability, Flexibility, Reducing Lead Times Are Important • AP 203 & AP 210 Are Key Components Of Our Environment

  4. Model Based Enterprise Environment • Attributes of the Model Based Enterprise (MBE): • Tools and processes are integrated through the application of standard information • All data abstractions for functional needs are accessible through data management interfaces • Performance verified with science based simulation environments and augmented by required physical testing • Knowledge captured and fed back through every stage of the life cycle Integrated agile & flexible engineering, manufacturing, and operations characterized by modeling, simulation, and optimization, utilizing common processes and Integrated systems/tools/data standards across the extended enterprise.

  5. Design for X (DFx) • Vision: Design rules are implemented to allow early and consistent evaluations of new designs to identify and resolve issues prior to release for production • Rockwell Collins first release of DFx has been Printed Circuit Assembly (PCA) Design For manufacturability (DFm): • Abstraction of standard information from CAD data • Manufacturing rules are run against design data • Visual representation communicates to the design team • Developed in a collaborative environment • Second implementation of DFx is PCA Design For testability (DFt): • Same approach as DFm • Third implementation of DFx is DFm at the Line Replaceable Unit (LRU) level: • In process

  6. Design for Manufacturability • Analysis of how Suited a PCA Design is for Manufacturing • Offline Process can be Run as Often as Needed During Design Process • Process Supports Balance Between Design and Manufacturing Needs • Native CAD Data • Artwork • Component Terminal Locations • Drill Location, Size • PCA Bill Of Material • Milling • Data Beyond Scope of Native CAD • Configuration Management (Product ID, Revision, Approvals, Date…) • Deleted/Replaced/Unpopulated Components in PCA • Fiducials • PCB Stackup • Assembly Panel (Tabs, Cutouts) • Standard Component Catalog Data • Component Manufacturing Properties • Component Manufacturing Classification • Textual Assembly Requirements

  7. Design for Testability • Analysis of how Suited a PCA Design is for Test • Extension of DFm • Data Added to DFm Data • Native CAD Data: • Component Reference Designations Realized in Printed Circuit Board (PCB) • Netlist • Component Placement in PCA • Component Terminal Locations in PCA • Land Locations in PCB • Connector Signal-Pin Outs • CAD-Defined Test Point Locations in PCB • Data Beyond Scope of Native CAD: • Special Symbols Realized in PCB • Tooling Hole Locations in PCB • Special Lands for Terminals, Jumpers, etc… • Special Test Point Locations in PCB

  8. Paper Based Data Flow Product ID, Approvals CM Drawing Review Native CAD; Basic geometry, Netlist ECAD Panel Model Material Stackup Model Drawing Creation (Scripting with ECAD Tool) Assembly Requirements Fabrication Requirements Requirements data Product data

  9. Departmental Specific Encoding of Domain Specific Features: Fiducial • In the printed circuit card manufacturing domain, a Fiducial is a small mark included in a PCB used to align components • Fiducials are required to be included in a PCB design and must be identified to facilitate design review and Computer Aided Manufacturing (CAM) tools. • A Fiducial is represented in a Specific Design Department by a part with a name = “FIDUCIAL”. “FIDUCIAL” is not a material item so the originating Department filters any Bill Of Material (BOM) related data before publishing. Another Design Department may represent a Fiducial by assigning a name to some other CAD data type; the identification string varies. • Fiducial is a predefined feature data type in the layout view in AP 210. If a Department published BOM-related data from an AP 210 database, no filtering would be needed, because features are not parts, thereby reducing maintenance costs.

  10. Domain Specific Features: Sharing Fiducial Data Between Departmentsin A Supply Chain Domain Specific Features Data (Out of Scope of CAD Tool) Domain Specific Features Data (In Scope of CAM Tool) Design Intent CAD TOOL Native CAD To AP 210 Mapping Departmental Encoding To AP 210 Mapping AP 210 Data Set AP 210 To CAM Mapping CAM TOOL CAD Native Data Model Departmental Specific Encoding of Domain Specific Features in CAD CAM Native Data Model

  11. Departmental Specific Encoding of Domain Specific Features: Filled Via • In the PCB manufacturing domain, a filled via is a small plated hole that is filled after the lamination process. • Filled vias may be included for various reasons. • A Filled Via is represented in a Specific Design Department by a user defined classification defined in the released drawing. The identification of the fill material is included in a note. • Filled_via is a predefined data type in AP 210. • Material_identification is a predefined data type in STEP that is related to the fill material through a predefined relationship in AP 210.

  12. Domain Specific Features: Analyzing Filled Via Impact on Product Properties Display Filled Via Impact Design Intent Filled via Classes Filled via Material CAD TOOL Native CAD To AP 210 Mapping Departmental Encoding To AP 210 Mapping AP 210 Data Set AP 210 To Analysis Mapping Analysis TOOL Departmental Specific Encoding of Filled via, material

  13. Model Based Data Flow Component Information System Product ID, Approvals CM (Daily) Native CAD; Basic geometry, Netlist ECAD CIM Global Library Panel Model Results AP210 (P28) Part Data LKSoft Mapping Engine Material Stackup Model DFXpert Rules Engine AP210 (P21) Part & Design Data Assembly Requirements Fabrication Requirements Mapping Specifications Requirements data Product data Part data

  14. Will Provide Advanced 3-D Visualization Including Domain Specific Features Allow Designers To See How Everything Will (Or Will Not) Fit Together Design Reviews Can Use Virtual Touchable Models Immersive Visualization 3-D Component Models AP 203 AP 210 AP 210 AP 210 Standard Model SIMULATION TOOL 14

  15. Questions?

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