Innovative Printed Electronics Applications: Transforming Aerospace Engineering

1. Printed Electronics Processes & Applications Presented By: Arjun Wadhwa May 16, 2019 École de TechnologieSupérieur PhD Candidate: Applied Engineering

2. Background • B.S Chemical Engineering - University of Mumbai, India 2010 • M.S Industrial and Systems Engineering – Rochester Institute of Technology, Rochester, NY USA 2014 • Printed Electronics Process Improvement • Aerosol Jet Process Engineer - Quest Integrated LLC, Kent, WA USA 2018 • Printed Electronics Applications Development • Senior Applications Engineer - Addem Labs Inc, Toronto ON, Canada 2019 • Photocure Based Flex PCB Fabrication - Process Development • PhD Candidate: Applied Engineering - ETS / C2MI / Varitron, Montreal QC, Canada Present • Printed Electronics Lab to Fab transition

3. Partners

4. Printed Electronics Applications

5. Aerosol Jet Printed Double Helix Wireless Resonant Marker for MRI Catheter Tracking

6. Project Objective • Endovascular catheter-based procedures under MRI guidance for neurointerventional applications are inherently difficult • Major challenge is tracking the tip of the catheter under MRI, as standard fabrication methods for building semi-active markers are rigid and bulky • Project encompasses building an inductively coupled, semi- active RF coil marker on a polymer catheter using Aerosol Jet deposition. • The LC circuit was printed directly along the length of a 2 mm diameter catheter using silver nano inks and dielectric insulator ink

7. Double Helix LC Circuit Design and Prints Full-length catheter Proximal end Distal end Length of marker Hand-wound LC circuit Aerosol-jet deposited LC circuit

8. 0.05 in 0.05 in 0.05 in Double Helix LC Circuit Design and Prints 0.05 in

9. In Vivo GRE Swine Testing 20° 20° 45° 5°

10. Conformal Printed Ice Detection and De-icing System

11. Leading Edge De-icing System Printed serpentine space heater Printed ice detection sensor Printed fractal space heater

12. Print Configuration Bottom Section Leading Edge Top Section Blade & Print Head Orientation

13. Thermal Imaging Results Temperature profile at 13V input case.

14. Non-Invasive Structural Health Monitoring for Aerosoace ApplicationsPSKIN

15. Project Objective • To design a fully printed 'functional skin' on the body of an aircraft to detect and monitor structural stress, strain, pressure and temperature changes during the life cycle of an aircraft. • Technology to enable preventative maintenance of aircraft and allows engineers to understand better the changes the structures undergoes during all phases of flight. • Technology also to tackle de-icing before flight by developing on board fully printed de-icing system as opposed to the current technology saving cost and time for both military and commercial applications. • Sensors designed to measure strain, temperature and pressure. • Use of Aerosol Jet and screen printing to design ultra low profile sensors that do not compromise aerodynamic properties of aircraft.

16. Printed Leading Edge Heaters and Strain Gauges Over the edge connectos Source: SAMPE Journal, Vol 53 No. 4, July/August 2017 Patent Pending Printed System on Aluminum 2024-T3 Wing Section

17. Wind Tunnel Testing Printed IPS + SHM on Aluminum 2024-T3 Mounted in a Wind Tunnel Source: SAMPE Journal, Vol 53 No. 4, July/August 2017 Patent Pending

18. Printed Sensors Fabrication Patent Pending Source: SAMPE Journal, Vol 53 No. 4, July/August 2017

19. Printed Sensors Fabrication Source: SAMPE Journal, Vol 53 No. 4, July/August 2017 Patent Pending

20. Printed Sensors Fabrication Printed silver strain gauge Trace crossover Printed Heating Elements Printed thermocouple Printed ice detection sensor Patent Pending Source: SAMPE Journal, Vol 53 No. 4, July/August 2017

21. Wind Tunnel Testing System Mounted on a Sting for Wind Tunnel Testing at University of Washington Patent Pending Source: SAMPE Journal, Vol 53 No. 4, July/August 2017

22. Thermal Imaging of Heating Elements Patent Pending Source: SAMPE Journal, Vol 53 No. 4, July/August 2017

23. Structural Failure Detection via Printed Electronics

24. Crack Propagation Fuse Like Sensor Printed fuse rings - 100 micron spacing Printed resistor of different values to measure crack propogation Printing fuse like sensor aroud rivet hole directly onto structural member BEST PRODUCT AWARD - IDTechEx 2018, Santa Clara, CA Patent Pending Source: Printed Functional Systems on Aircraft Structures, Dr. G. F. Nino, IDTechEx BerlIn 2016

25. Acknowledgements DOD/USAF/AFRL/AFOSR STTR contract # FA9550-15-C-0007 DOD/USAF/AFRL SBIR contract # FA8650-14-M-2481 Dr. Sylvain G Cloutier – Professor, École de Technologie Supérieure Dr. Martin Bolduc – Director, Advanced Technologies - Varitron Dr. Giovanni Nino - Director, Systems Development - Quest Integrated LLC Dr. Vincent Fratello - Director of Materials Research, Quest Integrated LLC Dr. Caroline Jordan - Postdoctoral Scholar, UCSF Department of Radiology Dr. Denis Cormier - Industrial and Systems Engineering, RIT Dr. Scott Williams - School of Chemistry and Material Science, RIT Dr. Marcin Piech – Senior Research Engineer – United Technologies Research Center Jaime Benavides Guerrero – PhD Candidate - École de Technologie Supérieure Luis Felipe Gerlein – PhD Candidate - École de Technologie Supérieure Dr. Charles Trudeau – Research Engineer - Institut national d'optique DOD/USAF/Robins AFB contract # FA8501-09-C-0029 CLIN 005 SBIR Contract Number: NNX16CL40P

26. Thank you