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LG Electronics 2007

LG Electronics 2007. Mobile Platform Architecture: Addressing the Background and Trends. MC Communications Company LG Electronics Inc. 2007. 4. 11. Index. Industry Fact: - Growth in Demand - Growth in Volume Struggles in Market Platform Status Hardware Platform

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LG Electronics 2007

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  1. LG Electronics 2007 Mobile Platform Architecture: Addressing the Background and Trends MC Communications CompanyLG Electronics Inc. 2007. 4. 11

  2. Index • Industry Fact: - Growth in Demand - Growth in Volume • Struggles in Market • Platform Status • Hardware Platform • Software Platform • Platform Standards • Platform Based Development • Platform Example

  3. Industry Fact: Growth In Demand • The mobile phone was • ‘A tool to communicate with each other.’ Perception Change The consumers perception of the ‘Mobile Phone’ has dramatically changed • The mobile is becoming ‘A gadget that symbolizes oneself.’ Enjoy multimedia and entertainment services - Camcorder, MP3 music, broadcasts - Fun & useful services A fashion icon Multimedia - Take pictures - Send images Compact Data Download - Ring Tones - 2D Games Voice-Centric Usage 1 / 21

  4. Industry Fact: Growth In Demand Service Trend Services get more diversified to meet what customers think is ‘fun and useful’ and to increase ARPU simultaneously Fun & Useful Connection Keyword • MMS • IM • VOD/MOD • Games • LBS • Mobile TV • Wireless • Internet • Voice Call • TXT Messaging • 1x data SVC • Phonebook Services “Basic wireless services” “Consumer driven services” 2 / 21

  5. Industry Fact: Growth In Demand Digital Convergence Digital convergence is to provide comprehensive and richer user experience in mobile infotainment fields PC Notebook PC UM PC Desktop PC Mobile AV Player MP3 Player PMP & PMC Mobile Communicator Digital Convergence DBDM PDA Mobile Infotainment PDA, DMB, PND Car Infotainment • Home • Mobile • Car Ubiquitous Networking Telematics Car Audio/Video 3 / 21

  6. Industry Fact: Growth In Volume • Too Many Phones in the World! • Diverse Features!

  7. Struggles in Market • Background • Diverse Market Segmentation: Vertically and Horizontally • Vertically: From Lowest Tier to Highest Tier • Horizontally: Depending on various Regions • Enormous Development (R’D) Cost  Strong Price Pressure • Set: More and more man-month per product (HW, SW, …) • Si: More and more Fab cost (90nm, 65nm) • Less numbers sold per Model  Less numbers sold per Si • Tighter schedule per Model • Set: PbyP (Product by Product) approach may not be competitive anymore for the high-volume segment  PbyP can be still valid for Ultra-low and Ultra-high tiers • Si: Integrating IPs to make One-chip SoC doesn’t imply best solution anymore. • Should consider total R’D cost + price as well as BOM per product • Add-on Device • Add-on Device • Quick Si spin • (Peri change) Reference Platform • S/W Change • 100% reuse • Quick Si spin • (Elimination)

  8. Platform Definition (by Nomura Research) Pre-Integrated HW/SW Recycle, PCB 재활용(?) Cheaper to develop but less flexibility than 2.0 • Product by Product, Platform 1.0 및 Platform 2.0 으로 구분하여 정의 • Low-volume, high-end, high-price 제품의 경우 PbP 방식이 효율적 • 한정된 R&D 인력으로 제한된 범위내 Model수 확대 및 가격경쟁력확보를 위해서는 Platform 1.0 이 효율적 Platform 1.0 Product by Product Development Every Product designed from Scratch by individual team Highest flexibility(수제품), Big R&D, Big Operation cost, All or Nothing approach, Highly optimized to specific model, multiple component sourcing 어려움

  9. Platform Definition (by Nomura Research) • 효율적 R&D cost 유지 및 가격경쟁력확보와 동시에 Model 개발 자유도 및 Model수 극대화 및 위해서는 Platform 2.0 이 효율적이나, 초기 Platform 개발 및 유지비용이 발생함. High volume 유지 時 영업이익 극대화 가능 • Platform 2.0 개발 내역 • Plug-and-Play 가 가능하도록 highly modular, plug-and-play system 개발 (표준 Interface 개발 및 통일된 Architecture 유지) • Module 개발 • Integration 개발환경 및 Test 환경 구축 • Module 개발 및 Platform 유지관리 • Well-Defined 개발환경 tool 제공 Platform 2.0 Highly modular Integration is needed Plug-and-Play e.g.) Nokia SPP (Symbian Product Platform)

  10. Platform Status Product Focused(Platform 0.0) Platform 1.0 Platform 2.0 - Platform A: - Platform: - 개별 Model 단위 개발팀 및 각각의 부품, S/W 개발 - 모델의 수 = 개발팀의 수 BB (A) / OS (A) / Set of Features (A) – Apps, FF, UI, etc. BB (A) OS (B) - Platform B: Set of Feature (C) - Apps, FF, UI, etc Concept & 특징 BB (B) / OS (B) / Set of Features (B) – Apps, FF, UI, etc. • High Modularity & Flexibility Modularization • Open Architecture & Interfaces • Very Scalable • Platform based, but limited Modularity • Less Configurability & Flexibility • Closed Interface within Platform • #1: Choose platform & development • #2: Choose platform & adaptation / additional SW development 개발 시나리오 • Create a team per model and develop from the scratch Vendor Positioning Implication • Platform은 Chip Type과 OS Type, 그리고 Feature Set Type의 Combination으로 정의됨

  11. Hardware Platform LCD Camera Speaker / Mic. Vibrator Battery PC Interface Memory Card Cellular PCS GPS Bluetooth Baseband Modem Rx chip • Antenna • RF Component • Baseband Modem • Display • Camera • Connectivity • Processor / Accelerator • Battery Rx chip Diplexer Tx chip 지상파 DMB 위성 DMB WiFi / WiBro Memory Application Processor Multimedia Accelerator * Case: Qualcomm MSM6500

  12. Software Platform Platform Software Architecture Downloadable Application Native Application Game PIM Camera Browser Messaging (SMS,MMS) • Call Processing • Network Protocol • Firmware Programming • OS Adaptation • Middleware / Browser Programming • Graphic Engine • Image / Sound Processing • HI (Human Interface) API Manager Signaling Stack Application Manager Extended API Set Basic API Set Handset Adaptation Layer OS (RTOS, OpenOS) DMSS / AMSS Hardware

  13. Platform Standards Hardware • 단말 내부 Data 증가로 Bus Line 수 증가에 따른 신뢰성 Issue 발생  고속 Serial I/F 표준화 진행 - Nokia, Micron, TI를 중심으로 MIPI Camera, Display I/F 상용화 진행 중 (’07.2H 본격 출시 예상) - 최근 Nokia가 MIPI에 Focus한다는 결정에 따라 부품업체들도 MIPI에 집중 • Cellular / WLAN / PAN 등 복합 Network 化로 Multi-band, Multi-mode의 Needs 증대 - Motorola 등 주도로 소형 / 저전력화를 위한 Digital RF I/F 표준화 및 상용화 진행 - SDR Forum, WWRF를 중심으로 SDR 기술 연구 중 Software • 모바일 서비스 Application의 상호 운용성 증진으로 시장 활성화를 위한 Protocol 및 I/F 표준화 진행 - 유럽 사업자들을 중심으로 Messaging, DRM 등의 OMA 표준 적용에 대한 요구 증 중 - 유럽/아시아 사업자 중심의 OMTP는 제조사 및 관련 단체에게 Platform Requirement를 Release

  14. Platform Based Development LGE Reference Platform Products Service Providers Premium Platform LGE Strategy Premium Lead Product Spin-off #1 Market Requirements End Users Spin-off #n Customer Needs Lead Technology Technology Availability Very Low Cost VLC Platform Lead Product Spin-off #1 Spin-off #n Requirements, Roadmap LGE-Optimized Chipsets Strategic Chipset Partners

  15. Platform Example • Separated vs. Integrated Solution 선택은 Cost, Form Factor, Time to market등 여러 가지 요소에 의해 결정 • Low Feature Phone : BB+ Accelerator를 Single die로 통합한 SOC • Feature Rich Phone : 별도의 Accelerator chip 또는 Integrated BB+AP • Smart Phone : 분리된 Application Processor 사용

  16. LG Electronics 2007 Q&A Thank You!

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