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Automated Seal Tool

Automated Seal Tool. Presenter: Kou Song Course: ETLS 502 Manufacturing Processes Professor: John Walker 9/18/08. Topics. Current Seal Process Reason for Change Automated Seal Tool New Seal Process Process Improvement – Automation Advantages Conclusion References.

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Automated Seal Tool

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  1. Automated Seal Tool Presenter: Kou Song Course: ETLS 502 Manufacturing Processes Professor: John Walker 9/18/08

  2. Topics • Current Seal Process • Reason for Change • Automated Seal Tool • New Seal Process • Process Improvement – Automation Advantages • Conclusion • References

  3. Current Seal Process – Manual Bond

  4. Current Seal Process – Bond Fixtures

  5. Current Seal Process – Isolator Installment

  6. Inertial Measurement Unit (IMU)

  7. Old Rework Process Spin Isolator Cut Open Soda Blast Average Time 40 Minutes

  8. Reason for Change • New electronics and base design triggers opportunity with new seal tool • Previous seal process inhibits extensive tool and fluid usage • Variation within operator • Manual process is too costly • Increase rework • Increase of scrap hardware

  9. New Automated Seal Tool Torque Driver E-Stop Load Belt Drive Torque Head Light Curtains Parts Nest

  10. New Process - Isolator Install • Two keying notches on isolator and cover Isolator Misalignment Eliminated

  11. New Process - Seal

  12. New Rework Process Average Time 20 seconds

  13. Process Improvement - Automation Advantages • Data recorded for each unit • Torque - how tight is the threaded interlock ring applied to the isolator ring • Angle - the amount of rotation until torque • Force - the pressure compressed to both the cover and base assembly • Displacement - under force pressure this defines the start position and compares to the end position. • Pass/Fail limits on all values • Remove operator variation Repeatable Process with Reduced Variation

  14. New Seal vs. Existing Seal Process

  15. New Process Map Install LIAs on motor Solder HVM to LIAs Install cluster to base Install Interface Ring Attach Connectors Thermal Thermal Data Reduction Bond Load IMUs into Bond Fixtures Bond Cure Remove IMUs from Bond Fixture V-bake Back-Fill Plug & Plug Cure Resistance Check Load IMUs into ESS fixtures Remove IMUs from ESS fixtures Leak Check Run 4 day ESS Install Isolator Isolator Cure Vibe CVA

  16. Conclusion • Provided a more consistent assembly process • Integrated approach to solve problems • Meetings with the operators and listening to their feedback • Shorten Process Time • Remove 6 steps • Combine operations • Remove Operator Variability • Enhanced Traceability – Data Collection • Reduce Use of Assembly Fluids • Bond epoxy • Isolator loctite Key Factor

  17. Reference • 1. MicroChemicals (2008). Solvents. Retrieved on September 14, 2008, from http://www.microchemicals.com/solvents.html • 2. TechTarget. (2008). In whatis?com. Retrieved September 14, 2008, from whatis?com http://whatis.techtarget.com/definition/0,,sid9_gci555460,00.html • 3. Jacob, G (2008). In SodaBlast Systems, The Pinnacle of Versatility. Retrieved September 15, 2008, from SodaBlastSystem LLC http://www.sodablastblog.com/

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