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ITA-1710. English Version. Sales Kit V1.3. CN/ES Embedded Systems Group M ar . 2013. Content. Market Trend & Opportunity………..……..……..p.3 Product Roadmap & Position………………….…..p.6 [ITA-1710] Product Showcase………....…….……p.8 System Overview Key Features System Block Diagram

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  1. ITA-1710 English Version Sales Kit V1.3 CN/ES Embedded Systems Group Mar. 2013

  2. Content Market Trend & Opportunity………..……..……..p.3 Product Roadmap & Position………………….…..p.6 [ITA-1710] Product Showcase………....…….……p.8 System Overview Key Features System Block Diagram IO Interfaces Specification Table Supports F-RAM System Design Features Easy-accessible CF/DOM Module Software Support [ITA-1710] SKU & Ordering Information ……….p.20 Application Stories Sharing…………………….…….p.28 Backup………………………………………………..….…...p.30 Resource Download & Contacts Product Life Cycle Naming Rule EN50155 Standard Introduction *** Marketing Materials download link on Advantech WIKI: http://wiki.advantech.com/wiki/Embedded_System_Group (provides Product Sales Kit, Roadmap, Brochure, eDM/Banner, AD/Poster, Application Story, Press Release, Flash Video, Whitepaper, DSS…etc.)

  3. Market Trend & Opportunity

  4. Automatic Fare Collection System Intro Line Central Computers Station Computers Station Terminal Equipment

  5. AFC Station Terminal Equipment • AFC: Automatic Fare Collection System • AGM =AutomaticGate Machine • TVM= Ticket Vending Machine • BOM=Booking Office Machine Gate Control System Booking Office Machine Ticket Vending Machine

  6. Product Roadmap & Position

  7. Q2’13 ES Q3’13 MP Roadmap of ITS Low PowerBox Computer Products Fanless -25 ~ 60°C Rich I/O Compact Size ITA-1710E ITA-1910 ITA-1610 ITA-1710 Intel ® Atom® D525 processor 2xGbE, 6xUSB, 48-ch D I/O 14xRS-232/422/485 2xVGA or VGA+LVDS Size: 240x190x100mm Intel ® Atom® D525 processor 2xGbE, 8xUSB, 48-ch D I/O 16(18)xRS-232/422/485 2xVGA or VGA+LVDS Size: 315x200x100mm Intel ® Atom® D525 processor 2xGbE, 6xUSB, 24-ch D I/O 10xRS-232/422/485 2xVGA or VGA+LVDS Size: 200x190x100mm Intel ® Atom® D525 processor 2xGbE, 6xUSB, 8-ch D I/O 2xRS-232/422/485 2xVGA or VGA+LVDS Size: 200x190x70mm Developing Planning Available 2012 2013 2014

  8. ITA-1710 Product Showcase

  9. System Overview • ITA-1710 • Intel® Atom D525 DC Wide Range Compact Fanless System with Dual GbE, 10 x COM, 6 x USB, Dual Display • The ITA-1710 size is 200x190x100mm and the IO better match for AGM or BOM applications. • ITA-1910 relatively suitable for TVM use. ITA-1910 ITA-1710 TheSameMotherboard *Note: ITA-1910 is another product of ITA Series

  10. Key Features • ITA-1710 • Built-in Intel Atom D525, 1.8GHz Dual Core - Onboard CPU • Supports 9-36V wide range DC input - with euro type connector • Supports up to 2 x GbE, 6 x USB 2.0 10 x COM ports • Serial ports support RS-232/422/485 with automatic flow control • Dual Display • Supports up to 24 Channel 24/48 bits Digital I/O - you can choose 24 bits DI/O+10 COM or 48 bits DI/O+8 COM • Onboard DDR3 memory 1GB - max up to 2GB • Optional F-RAM

  11. Key Features (2) • ITA-1710 • Easy-accessible CF/DOM Module • Support -25°-60°C (-13 ~ 140° F) wide working temperature - temperature 0°-40°C (32 ~ 104° F) if with HDD • Support 2.5” HDD • Audio with 3W amplifier • Power Budget: 25~33 W - Full loading 33w • Certificate: CE/FCC class A • Comply with EN50155 for rail transportation applications

  12. Mother Board Block Diagram

  13. ITA-1710 I/O Interfaces Dual VGADisplay (Dual display 1366x768) 2 x10/100/1000LAN Indicators & Reset 6 xUSB 2.0 Audio in & out with Amplifier 9~36Vwide DCinput ITA-1710 vs ITA-1910 10 xRS232/422/485 ports 12 DI & 12DO Easy-accessible CF/DOM Module Difference Same

  14. Specification Table

  15. ITA-1710 Supports F-RAM • What’s F-RAM? • Ferroelectric Random Access Memory(saving important data at sudden power break )F-RAM is widely applied in measurement, computing, industry, research, medicine and other demanding fields. With its unique features, F-RAMis ideal for extensive key tasks. • Ideal for frequent powerdown environment • All nonvolatile memories can reserve configurations. However, configuration alterment and powerfail could happen at any time, F-RAM which has higher write endurance allows unlimited alterment. Any system status change will be kept, so changes at the short time of powerdown or during an immediate failure could also be written into the memory.

  16. System Design Features • Large heatsink directly contact with the highly heated chips • Support -25°-60°C (-13 ~ 140° F) • All IO on one side • Few internal cabling • No gold finger connectors, more stable • Easy-accessible CF/DOM Module

  17. Easy-accessible CF/DOM Module • Easy-accessible storage device module • Use hand screw, not need opening the chassis to replace storages. • Storages including CF, SATA DOM. *This module also can match with Advantech SATA Slim series SATA DOM

  18. Software Support Note: It is necessary to update all the latest Microsoft hotfix files when using this OS.

  19. ITA-1710 Std. Sku EN50155 Compliant Status Not Compliant Compliant Compliant Page 19

  20. ITA-1710 SKU & Ordering Information

  21. ITA-1710 Order Information • Ordering Information *Note: Please contact with sales for factory option of onboard 2GB memory

  22. ITA-1710 Order Information • ITA-1710-S0A1E • Front View: • with 4*COM232, LVDS, P/2, 24 bit DIO • Rear View • Stay same with ITA-1710-00A1E • Front View • Rear View *Note: Please contact with sales for factory option of onboard 2GB memory

  23. ITA-1710 Accessory Information • HDD Accessory • Optional Accessory

  24. Support Mini PCIe VGA Card • PCA-5650-00A1E • ƒ 2 VGA output Mini PCI Express Graphic card • ƒ GPU: Silicon Motion SM750 • ƒ VGA output: 1920 x 1080, up to 75Hz vertical rate • ƒ 16 Mb of embedded DDR memory *Note: It is necessary to modify the I/O panel or remove storage module for connecting the additional VGA interface when install this VGA card. • with PCA-5650 • with CF/DOM module

  25. Support Adapter and Power Cord

  26. Supports DOM Vertical Type Slim Series

  27. Supports CF Card

  28. Application Stories Sharing

  29. AFC System in Station Terminal Equipment- Ticket Vending Machine • Numerous I/O devices • Internal Compact Structure Ticket Box Coin ID. / Storage Equipment LED Display Bill Identification Equipment Station Ethernet Bill ID / Storage Equipment Queue Ticket Dispenser Bill Identification Equipment IPC Power Supply LCD Screen Touch Panel Coin Changer

  30. Back Up Resource Download & Contacts(website Info, WIKI, FTP, PLM CERT. no) Product Life Cycle Naming Rule EN50155 Standard Introduction

  31. Resource Download & Contacts • Product Webpagehttp://www.advantech.com/products/ITA-1710/mod_94543F4C-2826-4CB0-881A-CBF7D34A0937.aspx • Major ContactsAdvantech Shanghai R&D CenterNo.56, 9F, Jiangchang Three Road, Shanghai, China 200436 Tel: +86 021 36321616 - Pax Chiu / PD Head(pax.chiu@advantech.com.cn; ext. 3201) - Archer Xu/ PM (xu.ning@advantech.com.cn; ext. 3359) - Nick Wu / PSM(nick.wu@advantech.com.cn; ext. 3393) -Tony Chen / HW Leader (tony.chen@advantech.com.cn; ext. 3210)

  32. Product Life Cycle

  33. Naming Rule ITA – 1710 Intelligent Transportation Appliance Hardware Platform Serial Number Dimension & Expansion Rackmount 1：1U 2：2U 3：3U 4：TBD 5：TBD Wallmount 6：Compact Size 7：Much I/O 8：Full I/O 9：With Expansion slots Hardware Platform Level 0：RISC 1：Entry Level Mobile 2：TBD 3：Performance Mobile 4：TBD 5：Desktop Product Category 1：AFC 2：ISCS 3：TBD

  34. EN50155 Standard for Railway Application Page 34

  35. Operating Temperature Requirements • Electronic equipment shall be designed to meet the full performance specification requirement for the selected temperature categories as stated in below Table. • The design shall take into account temperature rises within cubicles to ensure that the components do not exceed their specified temperature ratings. • In addition, the equipment shall meet the special short-term start up thermal conditions as stated in column 3. Page 35

  36. Enhance Thermal Design - Fanless & Wide Range Temperature • ITA products commonly used in the open space and need to face the impact of high temperature and dust. Large heatsink design lets operating temperature can reach 60 or 70 degrees. Fanless and hermetic design can reduce the impact of dust. High power components put on the same side of PCB and direct contact with heatsink. Improve the thermal performance. Page 36

  37. Validation - Thermal Profile Test Test Condition: Test in the box with non-airflow condition and record the test point temperature. Test Result: Make sure there is no damage in electronic and mechanical functions. Performance is maintained with no incurable physical damage or degradation. All components temperature was not over specification. Page 37

  38. High Temperature Test Test Standard: Reference IEC 60068-2-56 Testing procedures Test Cb: Damp Heat Steady State Test Reference IEC 60068-2-2 Testing procedures Test Bb: Dry Heat Test Page 38

  39. Low Temperature Test Test Standard: Reference IEC60068-2-1 testing Procedure Test Ca: Cold test Page 39

  40. Shock & Vibration Tests for Rolling Stock IEC 61373 standard cover the requirements for random vibration and shock testing items of mechanical, pneumatic, electrical and electronic equipment/components to be fitted on to railway vehicles. This test levels to be applied to the item under test are dictated only by its location on the train ( ie. Axel, bogie, or body mount) Category 1 : Body mounted  Class A --- Cubicles, subassemblies, equipment and components mounted directly on or under the car body  Class B – Anything mounted inside an equipment case which is in turn mounted directly on or under the car body Category 2 : Bogie mounted  Cubicles, subassemblies, equipment and components which are to be mounted on the bogie of a railway vehicle Category 3 : Axle mounted  Subassemblies, equipment and components or assemblies which are to be mounted on the wheel set assembly of a railway vehicle Page 40

  41. Position Categories Page 41

  42. General Location Identify Page 42

  43. Random Vibration Testing Conditions Note :  Test time : Not less than 10 min. & To allow all the specified functions to be completed. ( for each axis) Page 43

  44. Simulated Long Life Test Levels Note :  1. It is not necessary for equipment to function during this test  2. Test time : 5 hrs for each axis Page 44

  45. Shock Testing Conditions Note :  1. It is not necessary for equipment to function during this test  2. Test times : total 18 shocks (3 times for each face) Page 45

  46. Anti-vibration Design • The applications of transportation will close on the vibration source, so need to enhance the anti-vibration design. • Simple and rugged construction. • Onboard memorydesign. • HDD with buffer design. • Use PIN type connectors. • Cable with lock. Page 46

  47. HDD Anti-vibration Design • HDD buffered design: • Isolation HDD bracket with chassis main parts. Reduce the passing of stress. • Reduce the mechanical resonance. Resonance Page 47

  48. Thank You!

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