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RBSP Instrument/Suite Name

RBSP Instrument/Suite Name. Critical Design Review PI. Instrument/Suite Name CDR Agenda. Instrument/Suite Name CDR Agenda. Instrument/Suite Name Team. 1-2 pages Organization chart of the instrument/suite team members Include team member roles

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RBSP Instrument/Suite Name

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  1. RBSP Instrument/Suite Name Critical Design Review PI RBSP-instrument name CDR yyyy-mm-dd

  2. Instrument/Suite Name CDR Agenda RBSP-instrument name CDR yyyy-mm-dd

  3. Instrument/Suite Name CDR Agenda RBSP-instrument name CDR yyyy-mm-dd

  4. Instrument/Suite Name Team • 1-2 pages • Organization chart of the instrument/suite team members • Include team member roles • Include any key partners, subcontractors or major suppliers • Highlight major changes since PDR RBSP-instrument name CDR yyyy-mm-dd

  5. Instrument/Suite Name Entrance Criteria/Objectives • 1-2 pages • List entrance criteria/objectives for the I-CDR RBSP-instrument name CDR yyyy-mm-dd

  6. Instrument/Suite Name CDR Success Criteria • 1-2 pages • List Success Criteria for the I-CDR as provided by the Project RBSP-instrument name CDR yyyy-mm-dd

  7. Instrument/Suite NameScience Overview • 3-4 pages • List of the major science objectives allocated to the instrument and the resulting instrument performance requirements and specifications • List the major requirements that drive the instrument design and give their parent (usually STARD). • This may be best presented in a table as a compliance matrix • Describe any changes to science requirements since PDR • Describe any non-conformances in instrument performance RBSP-instrument name CDR yyyy-mm-dd

  8. Instrument/Suite Name Space Weather Support • <Instrument/Suite name> will broadcast data in real-time as part of the RBSP mission support of space weather modeling, forecast and prediction efforts or Notes: All values reported once per spin, except ……… Total bit rate: XX bps. Tables can be provided by Nicky if necessary RBSP-instrument name CDR yyyy-mm-dd

  9. Instrument/Suite Name Instrument Overview • 1-2 pages • General description of the instrument to the level of the major subsystems. • Block diagram of the total instrument • Serves as an introduction to the detailed presentations to follow RBSP-instrument name CDR yyyy-mm-dd

  10. Instrument/Suite Name Systems Engineering • 5-7 pages • List major instrument/suite performance requirements trace to the major subsystems • Include their parent requirement • May be best presented in a table as a compliance matrix • Describe any requirements changes since PDR • Include relevant document numbers and their release status • Design description and top level specifications • Electrical and thermal instrument and components performance REQUIREMENTS • Software architecture and design • Mechanical design and analyses • Grounding diagram • Mechanical and electrical interface requirements with other subsystems • Status of Instrument ICD (address any outstanding TBDs) • Instrument specification documentation status • Subsystem specification status • Status of any pending ECRs (engineering change requests) • Resource requirements • Table of mass and power for the components • Commanding and housekeeping telemetry requirements • Power services required • Margins • Other RBSP-instrument name CDR yyyy-mm-dd

  11. Instrument/Suite Name Systems Engineering - continue • Describe your approach to “worst case” or “defensive” design principles. Items to consider: • the design’s response to spurious and out-of- specification inputs • the extremes of operation • performance and failure mode behavior • Environmental design and test requirements • Summary of drawings • Number of drawings required to build the FM instrument • Status of drawings • Instrument Performance • Describe any known shortcomings in instrument performance relative to known science requirements • Identify any Long-Lead Time procurements not discussed in subsystem presentations RBSP-instrument name CDR yyyy-mm-dd

  12. Instrument/Suite NamePeer Reviews Held Since I-PDR • 1-2 pages • List of Peer Reviews held since I-PDR (include requirements & design); more detailed info presented in each appropriate section RBSP-instrument name CDR yyyy-mm-dd

  13. Instrument/Suite NameTechnical Changes since I-PDR • 1-2 pages • Give each change (recommend table below). • Give reason for change and provide impact, as appropriate, on resources of mass, power, size, telemetry, cost and schedule. RBSP-instrument name CDR yyyy-mm-dd

  14. Instrument/Suite Name Lessons Learned from Previous Missions • 1 page • Summarize any applicable lessons learned from previous missions…. • If you have no lessons learned, be prepared to say you’ve reviewed them as applicable to your instrument/suite RBSP-instrument name CDR yyyy-mm-dd

  15. Subsystem Name (ex. Detector System)Design Description • 6-8 pages ; Subsystem design description, including • List major subsystem performance requirements • Include their parent requirement • May be best presented in a table as a compliance matrix • Describe any changes in requirements or implementation since I-PDR • Block diagram(s) • Subsystem design description and top level specifications • Electrical and thermal subsystem design • Software architecture and design (if applicable) • Mechanical design and analyses • Design and performance margins • Discuss any changes since I-PDR • Major mechanical and electrical interface requirements with other subsystems/components and how these are captured (mechanical ICD, electrical ICD, other?) • Resource requirements • Table of mass and power for the components • Commanding and housekeeping telemetry requirements • Power services required • Other • Breadboard/Engineering Model Testing • Status of testing • Approach to subsystem testing • Summarize tests • Results • Describe ground handling • Results of special parts testing, as applicable • Results of packaging studies, show shielding plans RBSP-instrument name CDR yyyy-mm-dd

  16. Subsystem Name (ex. Detector System - continued)Design Description • Subsystem Verification • Plans for subsystem performance verification • Changes to plans for system verification since I-PDR • Status of any interface verification • Subsystem Peer Reviews • Summary description of any subsystem peer reviews • Status of the action items (tabular format ok with list of actions items in backup) • Discuss schedule for development/procurement • Describe any changes planned from the EM to the FM • Subsystem risks with mitigation plan and trigger dates per risk • Describe any open work relative to design work yet incomplete • Include discussion of major component procurements • Include any major subcontracted fabrication activities • Describe any special fabrication or test facility needs • Drawing release status • Parts/Materials PMPCB approval status • Include derating results • Waivers sought against requirements • Supporting the presentation (available hard copy in the room and electronically) • As-designed parts list with any parts requiring special screening identified • As-designed materials & processes list • Drawings (schematics, board artwork, assembly drawings) RBSP-instrument name CDR yyyy-mm-dd

  17. Subsystem Name (ex. FPGA)Design Description • 6-8 pages ; Subsystem design description, including • List major FPGA performance requirements • Include their parent requirement • May be best presented in a table as a compliance matrix • Describe any changes in requirements or implementation since I-PDR • Block diagram(s) • FPGA design description and top level specifications • Electrical and thermal subsystem design • Software architecture and design (if applicable) • Design and performance margins • Discuss any changes since I-PDR • Major interface requirements with other subsystems/components and how these are captured (mechanical ICD, electrical ICD, other?) • Resource requirements • Table of mass and power for the components • Commanding and housekeeping telemetry requirements • Power services required • Other • Breadboard/Engineering Model Testing • Status of testing • Approach to subsystem testing • Summarize tests • Results • Describe ground handling RBSP-instrument name CDR yyyy-mm-dd

  18. Subsystem Name (ex. FPGA - continued)Design Description • FPGA Verification • Plans for FPGA performance verification • Changes to plans for FPGA verification since I-PDR • Status of any interface verification • FPGA Peer Reviews • Summary description of any FPGA peer reviews • Status of the action items (tabular format ok with list of actions items in backup) • Discuss schedule for development • Describe any changes planned from the EM to the FM • FPGA risks with mitigation plan and trigger dates per risk • Describe any open work relative to design work yet incomplete • Describe any special assembly or test facility needs • Drawing release status • Waivers sought against requirements • Supporting the presentation (available hard copy in the room and electronically) • Drawings (schematics, board artwork, assembly drawings) RBSP-instrument name CDR yyyy-mm-dd

  19. Controller ElectronicsDesign Description • 6-8 pages • List major controller electronics performance requirements • Include their parent requirement • May be best presented in a table as a compliance matrix • Describe any changes in requirements or implementation since I-PDR • Block diagram(s) • Controller electronics design description and top level specifications • Electrical and thermal subsystem design • Software architecture and design (if applicable) • Mechanical design and analyses • Design and performance margins • Discuss any changes since I-PDR • Major mechanical and electrical interface requirements with other subsystems/components and how these are captured (mechanical ICD, electrical ICD, other?) • Resource requirements • Table of mass and power for the components • Commanding and housekeeping telemetry requirements • Power services required • Other • Breadboard/Engineering Model Testing • Status of testing • Approach to subsystem testing • Summarize tests • Results including any problems identified • Describe ground handling • Results of special parts testing, as applicable • Results of packaging studies, show shielding plans RBSP-instrument name CDR yyyy-mm-dd

  20. Controller Electronics - continued Design Description • Controller Electronics Verification • Plans for controller electronics performance verification • Changes to plans for system verification since I-PDR • Status of any interface verification • Controller Electronics Peer Reviews • Summary description of any controller electronics peer reviews • Status of the action items (tabular format ok with list of actions items in backup) • Discuss schedule for development/procurement • Describe any changes planned from the EM to the FM • Controller Electronics risks with mitigation plan and trigger dates per risk • Describe any open work relative to design work yet incomplete • Include discussion of major component procurements • Include any major subcontracted fabrication activities • Describe any special fabrication or test facility needs • Drawing release status • Parts/Materials PMPCB approval status • Include environmental worthiness of EEE components • Derating results • Waivers sought against requirements • Radiation worthiness (both total dose and SEE) • Supporting the presentation (available hard copy in the room and electronically) • As-designed parts list with any parts requiring special screening identified • As-designed materials & processes list • Drawings (schematics, board artwork, assembly drawings) RBSP-instrument name CDR yyyy-mm-dd

  21. Controller Software Design Description • See template previously distributed by G. Heiligman RBSP-instrument name CDR yyyy-mm-dd

  22. Mechanical Packaging & StructuralDesign Description • 6-8 pages: Structural/Mechanical design description, including • Design description, with a complete and comprehensive definition of the entire design. • Requirements and design changes since PDR and rationale • Analyses are completed for mechanical/structural loads, stress, dynamics, fracture control, and torque margins & venting, thermal environment, including predicted performance and margins • If applicable, finite element model demonstrating structural integrity of the housing under launch loads • Analyses down to board level for electronics • Presentation on all analysis margins • Presentation of all required mechanical GSE design • Combined optical, thermal and mechanical budgets (specifically internal alignment plans) • Surface coating • Interface control documents (ICDs) formally released for subsystems • Final implementation plans, including engineering models, prototypes, flight units, and spares. Include any changes planned from EM to FM RBSP-instrument name CDR yyyy-mm-dd

  23. Mechanical Packaging & StructuralDesign Description - continued • Engineering model/breadboard test results and design margins • Mechanisms qualification • Completed detailed design with bulk (~75%) of drawings signed off and ready for fabrication. (Drawings available.) • Completed (or near completion) Materials Identification List (MIL) including procured components • Brief report on fabrication plans and any items of concern for fabrication (possibly a report from an FFR, or a plan for one) • Fabrication, Assembly, Integration and Test plan/procedure at instrument level, including a detailed handling plan. Include purge requirements • Ground and in-flight calibration plans and their impact on mechanical alignments and I&T • Environmental test plans and test flow with test verification matrix • Integration and Environmental Test plans at observatory level • Include LV operation requirements (pre fairing install, shipping, erection, and at pad) • Purge requirements while on LV RBSP-instrument name CDR yyyy-mm-dd

  24. Mechanical Packaging & StructuralDesign Description - continued • Mass report on margins, bottoms up mass stack-up reported • Presentation on mechanical risks (if any) to instrument delivery • Plans for shipping containers, environmental control, and transportation & logistics • Waivers sought against requirements RBSP-instrument name CDR yyyy-mm-dd

  25. Thermal Design Description • 4-6 pages • Thermal design description, including • List of instrument thermal requirements • Description of implementation of thermal requirements • Final design for the instrument thermal control • Implementation plan • Expected performance and margins • Plans for thermal verification • Plans for acquisition of any MLI, heaters or special surface finishes (paints, germanium black kapton, etc.) RBSP-instrument name CDR yyyy-mm-dd

  26. MechanismsDesign Description • 6-9 pages • Design description, with a complete and comprehensive definition of the entire release or deployment mechanisms used for the instrument. • Requirements and design changes since PDR and rationale • Implementation plans • Presentation on all design and analysis margins • Plans for verification • Discuss any peer reviews conducted since the PDR • EM testing and analysis shall be presented, including life tests if applicable. • Safing philosophy shall be presented to verify that the mechanism will not deploy unexpectedly. • Any heritage based information on similar mechanisms should also be presented. • Test and validation plans specific to mechanisms should be presented. • Plans for verification of release and/or deployment shall be presented. RBSP-instrument name CDR yyyy-mm-dd

  27. Power System - LVPSDesign Description • 6-9 pages • Low voltage power supply system final design description, including • List major performance requirements for the low voltage power systems • include their parent requirement • may be best presented in a table as a compliance matrix • Include performance margins • Include environmental • Include magnetic cleanliness requirements • Include EMI/EMC requirements • Block diagram(s) • Power system design description and top level specifications • Describe of the power supplies topology, circuit margins, packaging and thermal management • Interface requirements with other subsystems/components and how these are captured (ICD, other?) • Resource requirements • Table of mass and power for the components • Other • Resource margins • Breadboard/Engineering Model Testing • Summarize tests • Results • Current status • Implementation plans • Work remaining to be done • Verification plans RBSP-instrument name CDR yyyy-mm-dd

  28. Power System - LVPSDesign Description - continued • Results of special parts testing, as applicable • Results of packaging studies, show shielding plans • Plans for testing • LVPS Peer Reviews • Summary description of any LVPS peer reviews since PDR • Status of the action items (tabular format ok with list of actions items in backup) • Packaging of the LVPS • Include any thermal analyses related to the packaging • Plans for EMI and ESD protection • Current status of EEE component procurements • Status of any custom magnetics development or any special screening imposed on a DC/DC converter supplier • Discuss any special protection circuits (input over voltage, short circuit protection and any internal failure detection/recovery circuits) • Supporting the presentation • As-designed parts list with any parts requiring special screening identified • Schematics, assembly drawings, printed wiring board layout drawings RBSP-instrument name CDR yyyy-mm-dd

  29. Power System - HVPSDesign Description • 6-9 pages • High voltage power supply system final design description, including • List major performance requirements for the high voltage power systems • include their parent requirement • may be best presented in a table as a compliance matrix • Include performance margins • Include environmental • Include magnetic cleanliness requirements • Include EMI/EMC requirements • Discuss any requirements changes since PDR • Block diagram(s) • Power system design description and top level specifications • Describe of the power supplies topology, circuit margins, packaging and thermal management • Interface requirements with other subsystems/components and how these are captured (ICD, other?) • Resource requirements • Table of mass and power for the components • Other • Resource margins • Breadboard/Engineering Model Testing • Summarize tests • Results • Current status RBSP-instrument name CDR yyyy-mm-dd

  30. Power System - HVPSDesign Description - continued • Implementation plans • Include any implementation plans since PDR • Work remaining to be done • Verification plans • Results of special parts testing, as applicable • Results of packaging studies, show shielding plans • Discuss E-field analysis performed on the design of the HVPS packaging • Plans for packaging • Include any thermal analyses related to the packaging • Plans for testing • HVPS Peer Reviews • Summary description of any HVPS peer reviews since PDR • Status of the action items (tabular format ok with list of actions items in backup) • Plans for EMI and ESD protection • Current status of EEE component procurements • Status of any custom magnetics development or any special screening imposed on a DC/DC converter supplier • Discuss any special protection circuits (input over voltage, short circuit protection and any internal failure detection/recovery circuits) • Discuss safety, air-safe operation and enable/disable interfaces and control • Supporting the presentation • As-designed parts list with any parts requiring special screening identified • Schematics, assembly drawings, printed wiring board layout drawings RBSP-instrument name CDR yyyy-mm-dd

  31. Instrument/Suite Name GSE • 2-4 pages • GSE design description, including • EGSE and MGSE requirements and implementation associated with the GSE • EGSE software including requirements, design and verification of EGSE software • Instrument purge equipment • Instrument shipping container • Slings or other special fixtures needed to mount and align the instrument RBSP-instrument name CDR yyyy-mm-dd

  32. Reliability Engineering • 1-2 pages • Discuss any feedback/results of required instrument to spacecraft FMEA analysis (analysis performed by the Project) • Identify any limited life items • Discuss any ongoing reliability engineering work • Any special reliability concerns shall be presented along with mitigation plans. • Discuss GSE FMEA analysis results RBSP-instrument name CDR yyyy-mm-dd

  33. Radiation Modeling • 1-2 pages • Present the final modeling results for radiation effects • Discuss requirements, implementation, margins and plans for verification to meet the radiation requirements in the RBSP EDTRD. • Present any special radiation concerns along with mitigation plans. RBSP-instrument name CDR yyyy-mm-dd

  34. EMI/EMC RequirementDesign Description • 2-3 pages • Electromagnetic interference/compatibility requirements description as defined in the EMECP, including • Requirements • Specifications • Implementation • Margins • Description of design mitigations to meet the requirements • Description of testing to be performed to verify compliance • Description of when the testing will take place • Present any special EMI/EMC concerns along with mitigation plans RBSP-instrument name CDR yyyy-mm-dd

  35. Assembly, I&T Description • 5-7 pages • Assembly, I&T description, including • Flow chart(s) showing plans for the assembly, integration, functional and environmental testing (EMI, vibration, thermal balance, thermal vacuum, etc.), and calibration • Major milestones in the I&T flow • Description of any cleanliness requirements imposed on the mission by the instrument as well as any special facilities needed • Instrument alignment requirements and plans for verification of alignment • Purge requirements and plans for maintaining purge • Expected number of operating hours on the instrument at launch • Identify any special facilities • Discuss any risks including mitigation plans RBSP-instrument name CDR yyyy-mm-dd

  36. Calibration • 2-4 pages • Detailed discussion of plans for instrument calibration • facilities planned for calibration • range of parameters over which the instrument will be calibrated • any shortcomings to the calibration that bring into question the ability of the instrument to meet its mission science requirements RBSP-instrument name CDR yyyy-mm-dd

  37. Instrument/Suite Name Verification Plans • 2-4 page • Describe the process for verifying all instrument interfaces (hardware & software), resources, form factor, performance and operations, environmental worthiness, and science performance requirements • Discuss verification of internal redundancy (if applicable) • Complete I&T plans and the I&T schedule shows credible task durations. • Describe test plans, Provide test flow • Present a verification cross reference matrix (It is expected that every verifiable element identified in the instrument specification document will be linked to a verification requirement. ) • Discuss any time-phased verification closure plans • Discuss any verification activities which must be closed prior to flight hardware fabrication (design verification) RBSP-instrument name CDR yyyy-mm-dd

  38. Instrument/Suite Name Verification Plans - continued • Final design of all electrical GSE and special test requirements and facilities • Plan for mechanical GSE, shipping containers and environmental control for the selected mode of transportation • Supporting information available: • A verification plan exists (including science performance/calibration) that shows traceability from subsystem to system level. RBSP-instrument name CDR yyyy-mm-dd

  39. Flight Operations Description • 2-4 pages • Describe the flight operations including • key elements of the instrument ground system that allows the operation of the instrument • command definitions and critical housekeeping telemetry definitions • commanding path and telemetry data • concept of operations for command and data handling of your instrument during the commissioning phase of the mission as well as normal operations shall be presented. • Define all roles and responsibilities for the operations with signed ICDs available (if applicable) • Include plans for flight operations staffing RBSP-instrument name CDR yyyy-mm-dd

  40. Instrument/Suite Name Systems Assurance • 6-9 page • Identify performance assurance team and show organizational structure • Describe flow down of performance assurance requirements • Describe Performance Assurance Matrix Status • Identify any exceptions and status of exceptions • Identify any waiver requests and status of approval RBSP-instrument name CDR yyyy-mm-dd

  41. Instrument/Suite Name Systems Assurance - continued • System Safety • Discuss status of inputs to the Missile System Prelaunch Safety Package (MSPSP) • Discuss the instrument’s safety plan • Identify any safety hazards along with methods for controlling them • Discuss status of System Safety CDRLs RBSP-instrument name CDR yyyy-mm-dd

  42. Instrument/Suite Name Systems Assurance - continued • Reliability • Discuss results of the instrument to spacecraft FMEA performed by the Project • Discuss results of the instrument to GSE FMEAs performed • Discuss results of Worst Case Analysis • Discuss status of reliability CDRLs RBSP-instrument name CDR yyyy-mm-dd

  43. Instrument/Suite Name Systems Assurance - continued • Critical Suppliers • Describe procurement process including flow down of requirements • Identify critical supplier (if applicable) RBSP-instrument name CDR yyyy-mm-dd

  44. Instrument/Suite Name Systems Assurance - continued • Parts • EEE parts selection and screening plans • Plans for selection and qualification of special items such as detectors and mechanisms • Discuss status of Parts Identification List (PIL) • Discuss status of Parts Stress Analysis (have analyses available if requested) • Discuss PMPCB review/approval status RBSP-instrument name CDR yyyy-mm-dd

  45. Instrument/Suite Name Systems Assurance - continued • Materials and Processes • Materials selection and screening plans • Discuss any special processes needed to build the instrument • Discuss status of Material Identification List (MIL) • Discuss PMPCB review/approval status RBSP-instrument name CDR yyyy-mm-dd

  46. Instrument/Suite Name Systems Assurance - continued • Limited Life Items • Indentify limited life items (if applicable) and status RBSP-instrument name CDR yyyy-mm-dd

  47. Instrument/Suite Name Systems Assurance - continued • Software Assurance • Describe software assurance requirements • Discuss software assurance activities and plans • Configuration Management • Discuss configuration management requirements • Describe configuration management process being used • Discuss flight drawing status • Estimated release date of all mechanical drawings: • Estimated release date of all electrical drawings: RBSP-instrument name CDR yyyy-mm-dd

  48. Instrument/Suite Name Systems Assurance - continued • Contamination Control • Discuss contamination control and ESD requirements • Describe contamination control and ESD plan • Identify any special contamination control needs for your instrument/suite during instrument I&T and during spacecraft I&T • Work Order Travelers • Describe your process for developing, approving, use, and archiving work order travelers • Discuss status of work order traveler development • Inspection Flow • Describe the inspection process • What is the process if an anomaly is observed? • What activities will SQA be required to witness/verify • Identify Project-APL mandatory inspection points • Where are inspection results recorded? RBSP-instrument name CDR yyyy-mm-dd

  49. Instrument/Suite Name Systems Assurance - continued • Nonconformance Process • Describe the nonconformance process • Discuss any nonconformances already incurred • Problem / Failure Reporting Process • Describe problem/failure reporting process • Discuss the method to be used for tracking PFRs • Discuss the method to be used for reporting PFRs per the Project requirements • Material Review Board Process • Describe MRB process • Discuss minimum MRB membership • Describe APL’s (Project) role in the instrument MRBs • GIDEP Status • List any pending GIDEP/NASA Alert open issues and status of resolution RBSP-instrument name CDR yyyy-mm-dd

  50. Programmatics/Development Status • 6-8 slides • Should include (in the following pages): • Performance to date • Use of schedule reserve • Use of reserve funds • Cost/performance summary (can use EVM statistics) • Schedule moving forward (including critical path) • Include % of total remaining tasks on critical path • Include path closest to critical path and how far off the critical path it is • Cost plan summary moving forward • Long lead items status (including detectors) • Top level evidence that you have a realistic schedule with sufficient cost that can complete the instrument delivery and support post delivery • APL can help with the charts in the following pages if information is provided beyond the EVM/533 reports RBSP-instrument name CDR yyyy-mm-dd

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