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Title. No. ： Company ： Contestant ：. Content. Contestant Introduction Company & Product Introduction Product and Mold Development Process Product Development Trend and Challenge CAE Application Process Moldex3D Successful Application Case Study

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  1. Title No. ： Company： Contestant：

  2. Content • Contestant Introduction • Company & Product Introduction • Product and Mold Development Process • Product Development Trend and Challenge • CAE Application Process • Moldex3D Successful Application Case Study • Moldex3D Application Value and Benefit Analysis • Moldex3D Future Application

  3. Contestant Introduction • Name: • Company: • Department: • Products in-charge: • Specialties:

  4. Company Introduction

  5. Product Introduction

  6. Product and Mold Development Process

  7. Product Development Trend and Challenge • Development Trend • Challenge • Common Problems

  8. Why CAE? • Why utilize CAE Simulation Analysis • Expected results and objects • Problems encountered • Short-term solution implemented

  9. CAE Application Process

  10. Moldex3D Successful Application Case Study

  11. Background • Product Size • Length： mm • Width： mm • Height： mm • Thickness： mm • Material • Process Condition • Filling Time： Sec • Melt Temperature：℃ • Mold Temperature：℃

  12. Mesh Model • Mesh Type • Mesh Count • Part Mesh: • Runner Mesh: • CPU CPU Time • Flow: • Pack: • Cool: • Warp: • Computer Information • CPU: • RAM:

  13. Runner Layout

  14. Cooling Channel Design

  15. Analysis Items and Contents

  16. Original Design Analysis and Results Interpretation

  17. Process Parameter

  18. Melt Front Time

  19. Filling Analysis _ Internal Temperature Distribution

  20. Cooling Analysis _ Temperature Distribution

  21. Cooling Analysis _ Cooling Time

  22. Warpage Analysis _ Total Displacement

  23. Warpage Analysis _ Sink Mark Index

  24. Design Alternatives and Simulation Analysis

  25. Attempts of Revised Design • Issues with original design • Revised Design

  26. Filling Analysis Result _ Injection Pressure

  27. Cooling Analysis Result _ Cooling Temperature

  28. Warpage Analysis Result _ Z-Displacement

  29. Warpage Analysis Result _ Sink Mark Index

  30. Comparison of Z-Displacement

  31. Comparison of Warpage Displacement

  32. Comparison of Simulation Result and Real Product

  33. Comparison Result

  34. Benefit Analysis and Future Application

  35. Moldex3D Application Value Analysis

  36. Moldex3D Future Application • Future Application • Future Study Direction

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