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VPX Cover. Overview and Update. “VPX, Open VPX, and VPX REDI ” are trademarks of VITA. VME Technology Roadmap. “ VMEbus Technology” logo is a trademark of VITA. What is VPX Technology?. A board form-factor standard for next generation critical embedded systems
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VPX Cover Overview and Update “VPX, Open VPX, and VPX REDI ” are trademarks of VITA
VME Technology Roadmap “VMEbus Technology” logo is a trademark of VITA
What is VPX Technology? • A board form-factor standard for next generation critical embedded systems • Highly scalable, highly flexible • Dense, compact, rugged form factor, 3U and 6U format • Abundant backplane I/O • Up to 4 ports of 4x switched fabric per slot, ready for PCIe, Serial RapidIO, Ethernet • All connectors are 7-row connector rated for signaling rates up to 6.25Gbps • Accepts 2 PMC or XMC (Fabric) mezzanines • ESD protected connector for ease of maintenance • Defines cooling schemes • Introduces 2-level maintenance • Architectural Framework for VPX • Leverages the individual VPX standards to create better interoperability. • Wide applicability in Critical Embedded Systems • MIL/Aero • Homeland security • Telecom • Transportation • More at www.vita.com/vpx
VPX Framework • The OpenVPX framework defines the allowable combinations of interfaces between the Module, Backplane and Chassis. • The OpenVPX framework acknowledges, but does not define the interfaces between the Application and the Module or Chassis (gray text and lines).
VPX and OpenVPX Benefits OpenVPX VPX Promotes interoperability and choice of supplier Provides specific design profiles that vendors can design to and integrators can specify as requirements Reduces integration issues resulting in faster development & deployment time Higher board volumes Economies of scale Industry leading bandwidth and density Higher velocity of technology upgrades • Abundant high-speed I/O • 4 ports of 4x switched fabric per slot, ready for PCIe, Serial RapidIO, Ethernet • Support for higher signaling speeds as technology is introduced • Explicitly designed and tested for critical embedded computing environments • Air, conduction, and liquid cooling • Reliability in harsh environments • Direct support for 2-level maintenance • Small systems enabled by 3U • Retains backward compatibility for VME protocol and PMC/XMC