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CrossFlo ™ Modular Interconnect System May 6, 2004. CrossFlo ™. Advantages of CrossFlo Design. Simple configuration Fewest number of block types required Single layer design w / second layer option No welding required Seal features Captive seal Standard O-ring sizes Leak test port
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CrossFlo™ Modular Interconnect System May 6, 2004
CrossFlo™ Advantages of CrossFlo Design • Simple configuration • Fewest number of block types required • Single layer design w / second layer option • No welding required • Seal features • Captive seal • Standard O-ring sizes • Leak test port • Configuration options • Skip purging possible • 1X, 2X, 3X block spacing option
CrossFlo™ Basic CrossFlo Block Mounting holes for component ID / OD seal capture Leak Test channel Pin holes Inlet / Outlet Port Compliant with ISA/ANSI SP76.00.02 open architecture standards.
CrossFlo™ Conceptually Simple: In-Line Stick • Substrate parts push together • Components top mount • Seals are captive
CrossFlo™ Conceptually Simple: CrossFlo • Ports not required are simply plugged
CrossFlo™ Seal Features • OD profile retains outer edge of seal • ID is raised to capture seal inner edge • Standard seal sizes used
CrossFlo™ In-Line and CrossFlo Blocks
CrossFlo™ Interconnect Elements
CrossFlo™ Typical Sampling System
CrossFlo™ Expansion to Second Level Interconnect
CrossFlo™ Second Layer Interconnect
CrossFlo™ Advantages of CrossFlo Design • Simple configuration • Fewest number of block types required • Single layer design w / second layer option • No welding required • Seal features • Captive seal • Standard O-ring sizes • Leak test port • Configuration options • Skip purging possible • 1X, 2X, 3X block spacing option • www.celerity.net/crossflow