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Tong Long Fu

Data Compression Module (DCM). Tong Long Fu. Laboratory of RF Photonics, Department of Physics National Cheng Kung University. Outline. Review - brief summary/ functional diagram/ works have been done Proposed Schedule - Interface -

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Tong Long Fu

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  1. Data Compression Module (DCM) Tong Long Fu Laboratory of RF Photonics, Department of Physics National Cheng Kung University Laboratory of RF Photonics

  2. Outline • Review - • brief summary/ functional diagram/ works have been done • Proposed Schedule - • Interface - • functional diagram/ Baseline from UCB/Table of Interface elements • Status of Health (SOH): error definition • Work-Flow of DCM - • work-flow diagram/ state description • Hardware Design - • Basic elements/ Schematic Block Diagram/DSP comparison • DSP Selection/ Features of TI DSP SMJC67x/ Power Management • Memory Map /other ICs required for DCM • Software Development - • available free software/ testing based on a Range Coder • Third-party supports • Summary - Laboratory of RF Photonics

  3. Review (1): brief summary • After consideration, it is Digital Signal Processor (DSP) to be used in data compression module (DCM) as DPU for data compression. • DCM is located at the Camera Image and Control (CIC) board of ISUAL. • The data from Mass Memory (MM) will be compressed by DCM to economize the space of MM. • After compression, the compressed data will be restored back into MM. Laboratory of RF Photonics

  4. CIC DPU DCM MM Review (2): functional diagram • DCM is located at the CIC • DSP is the main processor of DCM • DPU will issue event to trigger the function of DCM • Commands (TBD) are stored in MM Laboratory of RF Photonics

  5. Review (3): works have been done Laboratory of RF Photonics

  6. 2000 2001 2/15 CDR 11/15 IFR 6/9 SDR (NSPO) 8/15 PDR (UCB) J(6) J J J J(7) A(8) S(9) O(10) N(11) D(12) J(1) F(2) M(3) J A S O N D J F M Complete interface Interface 7/31 J A S O N D J F M Hardware Complete Prototype model Send to UCB J A S O N D J F M Code optimization and testing Completed Testing Software Proposed Schedule Main Schedule Completed module Interface testing Laboratory of RF Photonics

  7. Interface: functional diagram Reset DPU Event Timing (TBD) Power voltage: 5V (TBD) mA Event Timing 16 bits Data Bus 26 bits Address Bus (TBD) DCM MM Read Write SHD (TBD) Laboratory of RF Photonics

  8. Baseline from UCB • DSP can direct R/W access to MM • DSP in the CIC • DSP & DPU exchange Command and Status Information • Basic requirements: Laboratory of RF Photonics

  9. Table of Interface Elements Class Name Lines Type Power +5V @ (TBD) mA GND 1 1 Input Input Control Read Write Reset 1 1 1 Output Output Input Status (TBD) Reset Ready Command I/O Compression Idle Off Error 1 1 1 1 1 1 1 1 Output Output Output Output Output Output Output Output SOH (TBD) SOH 3 Output Data Bus Address Bus Data Address 16 26 (TBD) I/O I/O Event Timing Event Timing 1(TBD) 1 Input Output Laboratory of RF Photonics

  10. Status of Health (SOH) : Error Definition • Power Supply Error : (PSE) • Note: it will be supplied by power manage IC. • Start Error : (SE) (TBD) • Comment: to show that DSP could not work when power-on. • Load Program Error: (LPE) • Comment: to show the error when DSP load program form EPROM • Access External Memory (SDRAM or SBSDRAM) Error: (AEME) • Comment: DSP fail to access the external memory • Access MM (Mass Memory) Error: (AMME) • Compression Fail Error: (CFE) (TBD) • Comment: DSP fail in compressing data Laboratory of RF Photonics

  11. DCM Work-Flow: Work-Flow Diagram Start Self-testing Mode (TBD) Reset No Ready? Yes Commands (TBD) Commands (TBD) Data Input Idle Compression Data Output No Yes Finished? Laboratory of RF Photonics

  12. Work-Flow Diagram: state description Laboratory of RF Photonics

  13. Work-Flow Diagram: error handling How to handle error state (TBD)? Classification of Errors: (1) Internal problems (a) Hardware SDRAM/SRAM power IC EP ROM (TBD) (b) Software refer to command list (2) External problems (a) DPU no signal in (b) MM can’t read MM (c) Power (5V) no power in/ or incorrect Suggestion of solution: (1) Rejump to DPU and retry (2) Redundancy of Main parts Laboratory of RF Photonics

  14. Hardware Design: basic elements Power Management IC DSP Logic IC ROM (TBD) SRAM DCM All IC should be Radiation hardened IC (military-typical IC) Laboratory of RF Photonics

  15. Schematic Diagram Laboratory of RF Photonics

  16. Comparison of DSP (1) • DSP32 (AT&T), ADSP21020 (AD), and DSP SMJC67 (TI) Laboratory of RF Photonics

  17. Voltage Support (V) Power Dissipation (W) DSP32 (AT&T) +5 1.7 (MAX) 21020 (AD) +5 1.15 (typical) SMJC67x (TI) 1. 8/3.3 1.75~2.04 (Total Core & IO ) Comparison of DSP (2) • DSP32 (AT&T), ADSP21020 (AD), and DSP SMJC67 (TI) Laboratory of RF Photonics

  18. DSP Selection--- TI SMJC67x --- • TI DSP SMJC6701 is a very reliable but complex chip with many potential applications • we know very well about TI DSP chip series • complexity could be reduced • DCM with TI chip is easier for us • The DSP SMJC67x can be useful for us in future applications • We have enough support from TI • free (commercial) chip samples are available • supports on code composer studio, EVM and DSK • Currently, we are using TI DSP in research and development. Laboratory of RF Photonics

  19. Features of TI DSP SMJC67X TI-SMJC67X is chosen for the data compression core processor. This is chip is compliant with the standard MIL-PRF-38535. However, its survival life time under the radiative environment is still under evaluation. (a) 8 Arithmetic Unit (.L1 .S1 .M1 .D1 L2 S2 M2 D2) (b) HPI (Host Port Interface) : 16 bits. (c)32-bit glueless external memory interface supports SDRAM,SBSRAM and SRAM (d)Two Multi-channel Buffered Serial Ports(McBSPs) (e) Four data memory access (DMA)channels with bootloading capability (f)Flexible Phase-Locked-Loop (PLL) clock generator Laboratory of RF Photonics

  20. Power Management for TI DSP SMJC67x Comment: When using Ti dual supply voltage DSPs.the power system designer need not be concerned with controlling ramp rates or limiting voltage differences between the DSP core and I/O supplies. As long as the power-up and power-down operations are limited in duration, and the core-up-first, down-last sequence is followed as necessary to avoid bus contention, long term reliability will be maintained. Laboratory of RF Photonics

  21. Memory Map of TI DSP SMJC67x 64M x 8 External 0 4M x 8 External 1 2kx256 Int'l Prog On-chip Peripherals 64M x 8 External 2 64M x 8 External 3 64Kx8 Int'l Data Byte Address The Memory Map of DCM will be made as follows: (1) The memory space of MM: range 0 , 2 or 3 (may be modified according to MM) (2) The EEPROM (TBD)memory space: range1 Laboratory of RF Photonics

  22. Military Typical Logic IC. Military Typical ROM ,SRAM Military FIFO Memories. (TBD) Military Programmable Logic (PLD) (TBD) Chips are available from ASI or TI. FIFO or PLD can be prepared whenever required radiation hardness (military-typical) Other IC Chips to be used in DCM Required IC for DCM Laboratory of RF Photonics

  23. Available free Software Development (a) Range Coder: The range encoder is an entropy coder similar to the arithmetic coder or Huffman coder. Compared to an arithmetic coder the files are minimally larger (less than 0.01% in most cases) but the operation speed is nearly twice as fast. This range coder is distributed for free with GNU general public license. We tested this free public-domain software for several sample image files of sprite. Compression ratio ~ “1.42 - 4.67” (typical ~ 2.45) Laboratory of RF Photonics

  24. (a) sample 1, 512 x 80, 165 Grays (b) sample 2, 512 x 80, 237 Grays (c) sample 3, 512 x 80, 237 Grays Two sample Picture (d) sample 4, 237 x 172, 30 Grays (e) sample 4, 237 x 172, 30 Grays Simulation Result of the Range Coder: Laboratory of RF Photonics

  25. Available commercial software • Many companies have developed the software of data compression for DSP where image processors can also be included. • For TI DSP, these companies were called Third-Party of TI DSP. • Suitable source codes of data compression are available. Laboratory of RF Photonics

  26. TI DSP TMS320 Third-Party Program • A.T.E.M.E http://www.ateme.com/ (2) MultiDSP : http://users.aol.com/multidsp/index.htm Compression Laboratory of RF Photonics

  27. Summary: issues remained to be solved • Issues remained to be solved • interface between MM and DCM • interface between DPU and DCM • radiation hardness of TI DSP SMJC6701 • radiation testing • military chip and component ordering • we may not be able to order the military chip in Taiwan • time consuming if order from Taiwan • specification of MM and DPU (datasheets) • schedule (need to confirm/specify) • the date for interface testing and integration Laboratory of RF Photonics

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