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Damage Considerations David Fritz. FEL Source Propagation Absorbed Energy Dose Damage Processes in Solids Damage Thresholds FLASH Results Summary. Comparison to Synchrotron Sources. Average heat load is not a concern but instantaneous energy deposition must be considered.
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Damage ConsiderationsDavid Fritz FEL Source Propagation Absorbed Energy Dose Damage Processes in Solids Damage Thresholds FLASH Results Summary
Comparison to Synchrotron Sources Average heat load is not a concern but instantaneous energy deposition must be considered
FEL Source Propagation A diffraction limited Gaussian source is assumed
Solid State Damage Processes • Thermal melting • Presure effects • Spallation • Shear • Ablation • Non-thermal melting • Multi-pulse fatigue effects • Thermomechanical stress • Chemical • Phase transition
Thermal Damage Thresholds Heat Capacity - Energy required to raise the temperature of one gram of a substance by 1° K. Enthalphy of Transformation (a.k.a. Latent Heat) – the amount of energy released or absorbed by a substance during a change of phase.
Thermal Damage Thresholds (2) Beryllium Silicon
Thermal Damage Thresholds (3) † Units of eV/atom * 8265 eV Photon Energy, 1.1 x 1012 ph/pulse
FLASH Results • 32.5 nm wavelength • 25 fs pulse duration • 5.5 μJ pulse energy • B4C, C, Si, SiC were exposed to focused FLASH FEL • Up to 2.2 J/cm2 • Threshold for surface damage is on the order of the fluence required for themal melting S. Hau-Riege et al., Applied Physics Letters 90, 173128 (2007).
Summary • Instantaneous energy deposition must be considered • High melting point, low-Z materials will be most resistent to damage • Thermal model predicts that some materials can be safely placed in the NEH and FEH beam at normal incidence • FLASH damage results are consistent with the thermal model