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New Driver/Geometry for BeamCal. André Sailer LCD Weekly Meeting May 4, 2010. Old and New BeamCal. IP BeamCal cut through XZ plane, Only difference shape of absorber plates. New Geometry. Filled area between beam pipes with tungsten layers
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New Driver/Geometry for BeamCal André Sailer LCD Weekly Meeting May 4, 2010
Old and New BeamCal • IP BeamCal cut through XZ plane, • Only difference shape of absorber plates
New Geometry • Filled area between beam pipes with tungsten layers • All layers the same, rectangular cut out • 2nd Cylindrical cutout in Graphite (+PairMonitor) • PairMonitor Material now Silicon • Sensor geometry unchanged (“keyhole”)
New Feature • Changeable parameters • Inner & outer Radius, • number of layers • PairMonitor on/off • thickness of absorber • graphite thickness • beamcal position • Padsize
BeamCal Layer • One Layer consists of • Absorber 3.5 mm Tungsten • Sensor 0.3004 mm Diamond • Electric Metallization 0.0004 mm Gold • PCB 0.15 mm Kapton • Air gap 0.05 mm