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Reflowlöten

Solder Module. Reflowlöten. Configuration Solder Module. Reflowlöten. Mini-Wave. Single. Twin. Z - variable. Y- variable. Flexible Configuration of the solder module Standard soldering tasks on single boards Working with different solder alloys

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Reflowlöten

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  1. Solder Module Reflowlöten

  2. Configuration Solder Module Reflowlöten Mini-Wave Single Twin Z - variable Y- variable • Flexible Configuration of the solder module • Standard soldering tasks on single boards • Working with different solder alloys • Simultaneous Processing of multiple-up boards • Working with different nozzle geometries

  3. Configuration - Single Solder Nozzle Reflowlöten • Constant solder flow over the complete nozzle surface – no preferred direction for solder to drain • Continuous heat transfer into the solder joint during the solder process • No orientation of the component to the solder nozzle required • No layout constraints for the orientation of the components • Suitable for a wide variety of solder alloys

  4. Configuration Solder Module Z - variable Reflowlöten Different nozzle geometries Variety of Alloys • Both solder bath can be raised, separately and individually, on the axis up to the required working height (z- direction) • Depiction of mode of operation with two identical nozzles but different alloys. • Depiction of mode of operation with two nozzles of different geometries and identical solder.

  5. Configuration Solder Module Y- variable Reflowlöten • The distance of solder bath 1 to solder bath 2 can be adjusted on the axis system in the y-direction. • Set-up for simultaneous soldering of two assemblies of a multi-up panel.

  6. Configuration Solder Module - Mini Dip Reflowlöten • Product specific layout of multiple solder nozzles in an area of appr. 60 x 80 mm • Very short soldering time (< 5s) enables short cycle times • Continuous transfer of thermal energy during soldering • Only small clearances to neighboring components required due to the use of wettable solder nozzles

  7. Design of Solder Bath Reflowlöten • Maintenance-free design with electro-magnetic solder pump • No mechanical movable part in the solder bath • Precise wave height due to continuous circulation of solder • Outstanding repeatability of solder process (no impeller) • No adjustment after servicing the solder bath

  8. Monitoring - Solder Bath Reflowlöten • Solder wave height is measured • Solder level in bath is monitored / Solder wire feeder option • Solder temperature is exactly controlled • N2 atmosphere assures stabile process conditions

  9. Configuration Solder Module – Multi-Wave Reflowlöten • Multiple nozzles for soldering the complete assembly, they are dedicated to a specific board layout • Solder process for the full assembly is of very short duration (< 5s) • Continuous thermal energy transfer during soldering • Small clearances to neighboring components required due to the use of wettable nozzles

  10. Solder Snap-Off with Wettable Nozzle Surfaces Reflowlöten F1= Wetting Force F2= Capillary Force F3= Gravity F4= Adhesive Forces • Solder snap-off, the point in the process when the solder breaks off from the solder joint, is positively assisted by the adhesive force F4, which is generated by the wettable surface of the nozzle. • This adhesive force, in conjunction with gravity F3, enables the solder to properly drain off from the solder joint after having formed it, and to eliminate bridging and shorts.

  11. Advantages when Soldering with Wettable Nozzles Reflowlöten Substantial saving in time and reduced thermal stress on the board material through perfect process management • To solder square PGA‘s, it is sufficient to program the four corner points of the component • Neither the board assembly nor the nozzle needs to be repositioned • The solder nozzle moves without pausing and solders the component without a run-out zone

  12. Solder Snap-Off with Wettable Nozzle Surfaces Reflowlöten Standard Snap-Off Controlled Snap-Off - forms convex solder joints - forms concave solder joints

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