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Hlađenje integriranih sklopova. Cooling of Integrated Circuits Using Droplet-Based Microfluidics. Cross section of an electrowetting actuato r. Top view of a PCB-based droplet cooling. Cross section view of a PCB-based droplet cooling system.
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Cooling of Integrated Circuits Using Droplet-Based Microfluidics
On-Chip Solid-State Cooling for Integrated Circuits Using Thin-Film Microrefrigerators
Conventional bulk BiTe thermoelectric module and (b) thin-filmsuperlattice SiGe/Si heterostructure integrated thermionic cooler fabricatedusing batch integrated circuit fabrication techniques
Scanning electron microscopy (SEM) picture of SiGe/Simicrorefrigerators integrated with thin-film heaters/sensors
Illustration of the model configuration. Uniform heat flux of10 W/cm is applied to the top surface of the silicon chip. Two hot spotsof 7070-m square exist at the center and at the corner of the chip( heat flux = 300 W/cm ). SiGe-based microrefrigerators are used toselectively remove hot spots.
Diagonal temperature profiles on the top surface of the silicon chip
Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits
Conceptual schematic of the proposed electroosmotic cooler.The cooler is comprised of three main components:electroosmotic pump,microchannel heat exchanger and heat rejecter.
Schematic of the experimental apparatus for characterization of themicrochannel heat exchanger
Measured dependence of the average chip temperature on the input power (vertical bars indicate temperature fluctuations). Ambient temperature andwater inlet temperature were held constant in all experiments.
Dependence of heat exchanger pressure drop on input power (verticalbars indicate pressure fluctuations). Ambienttemperature and water inlettemperature were held constant in all experiments.
Comparison between predictions and experimental data for the chiptemperature rise and heat exchanger pressure drop as functions of the inputpower.
Performance curves for the electroosmotic pump showing flow rateversus pumping pressure for different operating voltages
Schematic representation of the experimental set-up used forcharacterization of the closed-loop cooling system
System performance showing chip temperature rise and heat exchanger pressure drop for varying input powers. Pump voltage, fluid inlet temperatureand ambient temperature were constant. The insert shows the pump curve at 150 V.
Apparatus for cooling of integrated circuit chips with forced coolant jet