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Plans for the next year A short report on HFT/PXL plans for post May 2012

Plans for the next year A short report on HFT/PXL plans for post May 2012. TPC – Time Projection Chamber (main tracking detector in STAR) HFT – Heavy Flavor Tracker SSD – Silicon Strip Detector r = 22 cm LBNL – Jim Thomas IST – Inner Silicon Tracker r = 14 cm MIT – Bernd Surrow

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Plans for the next year A short report on HFT/PXL plans for post May 2012

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  1. Plans for the next year A short report on HFT/PXL plans for post May 2012 TPC – Time Projection Chamber (main tracking detector in STAR) HFT – Heavy Flavor Tracker • SSD – Silicon Strip Detector • r = 22 cm • LBNL – Jim Thomas • IST – Inner Silicon Tracker • r = 14 cm • MIT – Bernd Surrow • PXL – Pixel Detector • r = 2.5, 8 cm • LBNL – Leo Greiner

  2. Outline • Existing HFT/PXL status and schedule • Engineering run tasks and status • Issues

  3. Existing PXL status and schedule • We are ~ 1 year into the construction project. • Many thanks to IPHC group for years of collaboration, support and help including during reviews. • Significant management overhead, reports, reviews, etc. • The RHIC engineering run was delayed until the end of February 2013. • The new IDS pieces and new beam pipe were installed over the summer. • The installation for the PXL prototype detector is scheduled for the end of February 2013. • The SSD and IST detectors are not scheduled to be installed until summer 2013. • The main task for 2012 / early 2013 is the construction and delivery of a three sector prototype detector by January of 2013. • The full detector will be installed in September 2013.

  4. PXL engineering run tasks • We have a deliverable of a working prototype detector (3-4 sectors) to be installed in early 2013. • Thus we need to produce first articles of all of the production stages for the final detector. • Tasks for 2012: • Production probe testing working for Ultimate sensors • Cable design complete with Cu conductors • New pre-production RDO (all boards) system working • Full firmware and software for data-taking • All mechanical designs complete and tested. • Mechanical structures fabricated. • Ladders => sectors fabricated + full scripted testing. • Metrology • Slow control system • Software for tracking using metrology data • Software for cosmic ray / beam testing tracking. • etc.

  5. Steps to Prototype Detector Sensor and mechanical only. RDO, slow control, etc. not shown. Test ladder cable design Fix cable design (width) Fabricate cables Fix mechanical design Fabricate mech pieces Probe test sensors Prototype detector planned to be fabricated with Ultimate 1 and Ultimate 2 sensors. Fabricate ladders In progress In progress Fabricate sectors In progress Testing and metrology Deliver to STAR, test and install

  6. Next Steps • Fabricate ladders from the 5 wafers of Ultimate-2 sensors. • Place order for production run of Ultimate-2 sensors – completed 1/17/2013 • Fabricate ~ 4 sectors from these ladders. • Metrology – first sector is in progress. • Finalize and produce MTBs. • Test detector. • Install at BNL and test. • All interfaces to the STAR experiment. • Goals for the engineering run can be found at http://rnc.lbl.gov/hft/hardware/docs/ultimate/PXL_engineering_run_testing.docx

  7. Cable Structure Preliminary Design: Hybrid Copper / Aluminum conductor flex cable There are two cable regions joined by wire bonds Outer ladders have a simple rectangular driver region PCB. Inner ladders have a complex driver region PCB that incorporates a kapton flex region to allow the ladder interface connector to be routed to the top of the sector.

  8. Production ladders

  9. Sector Production

  10. Production sectors Production sector on metrology stage

  11. Selected Issues • Probe testing – • The probe pins were making intermittent contact with the pads • We re-designed the probe card to have probes only on the digital side of the sensor and modified the probe pin mechanism to have greater travel range for the same contact force. • This has been tested and is now working well with the Ultimate-2 sensors. • Aluminum conductor cables – • CERN PCB shop is having trouble with the aluminum delaminating during processing. • They will be unable to deliver any cables for the engineering run. • The problem is understood but will require vapor deposition for the full aluminum thickness. This is more expensive and time consuming. • We are working with another vendor (Hughes) to develop an aluminum fabrication process. • Some progress has been made. Please see report at http://rnc.lbl.gov/hft/hardware/docs/ultimate/Hughes_al_cond_cable_progress_2012_12_14.docx

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