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An Industry Perspective on University Research Relations. Marie Burnham External Research Motorola, SPS. marie.burnham@motorola.com. RESEARCH. Professors. NETWORKING. RELATIONSHIPS. Liaisons. STUDENTS. University/Industry Value:. I. SIA driven university research organizations:
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An Industry Perspective on University Research Relations Marie Burnham External Research Motorola, SPS marie.burnham@motorola.com
RESEARCH Professors NETWORKING RELATIONSHIPS Liaisons STUDENTS University/Industry Value: • I. SIA driven university research organizations: • SRC/MARCO • Motorola Intern Program • IP and us
SIA1977 SRC FCRP1982 1997 Tax, Trade & Technology Policy Research & Education SEMATECH1987 Development & Infrastructure U.S. Semiconductor Industry Consortia Partners
SIA/SRC/iSEMATECH/SISA/FCRP Membership * SRC Science Area Members ** SRC Affiliate Member ***SRC US Gov't Participant **** SRC Strategic Industry Partners ***** SRC Associate Member ****** SRC Adjunct Member **Coventor **ISE **Mission Research **PDF Solutions **SILVACO **Tessera, Inc **Testchip Technologies **Torrex **Ziptronix ***NIST ***NSF ****ISMT ****SEMI ****SIA * ****SISA *****MITRE Corporation ******Compaq Eastman Kodak UMC Charter *Axcelis *Cadence *Mentor Graphics *Shipley *Synopsys *Ultratech Stepper **Numerical Technologies *Axcelis *Cadence *Mentor Graphics *Shipley *Synopsys *Ultratech Stepper **Numerical Technologies SRC SIA ***DARPA ***DARPA SISA LSI Logic National LSI Logic National LSI Logic National Advanced Micro Devices Agere Systems Conexant Systems IBM Corporation Intel Corporation Motorola Texas Instruments Advanced Micro Devices Agere Systems Conexant Systems IBM Corporation Intel Corporation Motorola Texas Instruments Advanced Micro Devices Agere Systems Conexant Systems IBM Corporation Intel Corporation Motorola Texas Instruments Advanced Micro Devices Agere Systems Conexant Systems IBM Corporation Intel Corporation Motorola Texas Instruments Hewlett-Packard Hewlett-Packard 87 Others *Novellus *Novellus *Novellus FCRP ISMT Air Products Applied Materials KLA-Tencor SCP Global Tech. SpeedFam/IPEC Teradyne Veriflo Hyundai Infineon Technologies Phillips STMicroelectronics TSMC Micron Micron Micron Agilent Technologies Analog Devices Cypress Semiconductor Xilinx Agilent Technologies Analog Devices Cypress Semiconductor Xilinx Intersil Last Update: 10/5/2001
The a tax-free and not-for-profit arm of the SIA • MISSION: Helps solve North American semiconductor industry’s technical challenges with long-range (3-8yr) university research. • CHARTER: Manage the research done by graduate students for a consortia of 12 full and 23 partial membership companies and government agencies. • STRATEGY: Provide a framework to make decisions by the SRC management, and full-member company management (BoD, SACCs and TABs), and being responsive to the ITRS formed by the SIA. Lexicon The Numbers ( most are approximate ) • SIA : Semiconductor Industry Association • ITRS: International Technology Roadmap for Semiconductors • BoD: Board of Directors • ETAB: Executive Technical Advisory Board • SACC: Science Area Coordinating Committee • TAB: Technical Advisory Board • FCRP: Focus Center Research Program (for longer term research > 8yrs) • MARCO Microelectronics Advanced Research COrporation started 2 FCRPs in 1998: Interconnects and Design and Test • ISMT International Sematech • The SRC funded > $30M of fellowships, grants, contracts, and projects in 2001 • Motorola has hired almost 160 SRC advanced degree engineers/scientists from ‘89-present. • The Motorola SRC team is > 90 technologists. • 850 students supervised by 230 profs on 300 research tasks at 72 univ’s in US, Taiwan, Ca, and Germany
Motorola SRC Science Area Organization • BoD: Sherry Gillespie • ETAB: Marie Burnham, Cotton Hance Synthesis and Verification Carl Pixley Logic and Physical Design Pat McGuinnessPradipto Mukherjee Test and Testability Magdy Abadir Circuit Design Andrew Martin Systems Design Gordon McGregor Integrated Circuit Systems Sciences (ICSS) Chris Chun, Dave Cave Computer-Aided Design and Test Sciences (CADTS) Bill Read Interconnect Systems Cross-disciplinary Semiconductor Research (CSR) Material and Process Sciences (MPS) Clarence Tracy Nanostructures and Integration Sciences (NIS) Gari Harris Modeling and Simulation Environment, Safety and Health (ESH) Victor Vartanian, H-A Hwang Advanced Devices and Technologies (ADT) Bruce White, Rainer Thoma Patterning Lloyd Litt, Scott Hector Packaging and Interconnect Systems Darrel Frear, Andrew Mawer Factory Systems Shekar Krishnaswami Front End Processes (FEP) Clarence Tracy, Hsing Tseng Back End Processes (BEP) Brad Melnick, Peter Ventzek
Other Consortia Govt. Agencies Industry SRC Participants SRC’s Role National Labs SRC Concurrently Managed Phases Research Institutions Universities Planning Phase Research Organizations Initiation Phase Performance & Evaluation Phase Tech Transfer Phase Relevantly Educated Scientific Workforce Advanced Enabling Technologies Increased Competitiveness for Industry
Research Selection andFunding Process • Member-driven creation of needs document • Request and submission of white papers • Member review and selection of proposals to seek • Request for proposals • Member review and selection of proposals to fund • Internal SRC Research Management Committee review • Only Excellent Proposals are funded • Three-year contract start (Typical) • Annual member reviews of progress • Submission of reports and “deliverables” by researchers
70 of 75 university researchers said SRC was sponsor of choice SRC is responsive (+) Detailed involvement of industry (+) Attention to the students (-) Funding amounts are too small (-) Administrative overhead is too larger (-) Want more liaison involvement 2001 SRC University Survey Results to date.
Summary Results of SRC ETAB Summer Study (june, 2001) New Research Areas (prioritized): • Optoelectronics: chip-to-chip, integration with electronics. • Embedded Software: must be research. • Ultra low power heterogeneous system integration. • Low cost, high throughput, maskless patterning for VLSI.
Reduced funding and less publically available INDUSTRIAL LABS DoD R&D Programs • Bell Labs • IBM Research • GE Research Semiconductor Research Timeline 98 01 04 07 10 13 $ • Industry • Largely company specific • Product emphasis • SEMATECH & SUPPLIERS • Largely tool specific • Industry manufacturing standards • manufacturing path to commercialization • SRC • Company specified research • Student emphasis • Emphasize technology transfer • Company funded Increasing Cost of Research • $175,000,000 • Focus Centers ($40-60M) • Nanoelectronics($85M of $.5B) • Litho ($40M) • Moletronics($10M) Development Applied Research Exploratory Research N N+1 N+2 N+3 N+4 Product Generation
Motorola’s Intern/Co-op Program The Motorola Intern/Co-op Program is a strategic college-recruiting tool. The goal of the program is to identify and attract critical talentfor regular full-time employment. Tera Martinez Regional University Relations Manager Tera.martinez@motorola.com (817) 245-2976 Pager: 1800SKYTEL2 PIN# 1332302
Motorola’s Intern/Co-op Program Give students real experience Internships and Co-ops are intended to give the student a way to gain experience in his/her field of study. It is also a tremendous opportunity for the student to work with cutting edge technology and to gain “real” work experience. Students can also see what classes and experiences will be needed to be successful in the industry they choose. Pre-evaluation The business has the opportunity to see how well the student works in a particular work environment. A manager will also be able to see how the student adapts to change and how quickly they pick up the new technology.
Motorola’s Intern/Co-op Program Bring in fresh perspectives Technology and innovation are dependent upon fresh ideas and creative minds. Some of these creative minds are currently on the campuses of the colleges and universities. The Intern/Co-op Program is a way to bring these creative minds into Motorola and benefit from their innovative thinking. Promote Motorola on campus Students that have a positive work experience promote Motorola’s image and products on campus.
Benefits of the Intern/ Co-op Program • To Company • Early exposure to women and underrepresented groups • Special projects for interns often have unexpected positive return • Has available students who might return for expanded assignments • Has opportunity to develop the intern for possible future employment • Has intern as an Mbassador to share experience with other students • Engineering Rotation Program
Benefits of the Intern/ Co-op Program • To Intern/Co-ops • Gains meaningful experience which enhances education development • Enhances ability to obtain future employment • Obtains experience and knowledge
Benchmarking Data Job Content remains the essential element among effective internship factors. Of those who have accept or will accept employment, the top three reasons they will join the company where they intern are: Job content; Cultural “fit”; and the Quality of management and staff. The corresponding reason students have or decline are: Job content, Cultural “fit”; and Compensation. Conclusions.
Early February Deadline for extension of summer intern/coop offers. April-June Summer interns/coops start Late June Extension of fall intern/coop offers August through September Processing of returning intern/coop and returning full-time new graduate offers Early November Deadline for extension of spring intern/coop offers Intern / Coop Program Timeline
Panel Session on IPISPD 2001 3/2/2001 Jeff Parkhurst Intel Corporation
Industry Researcher ... ... 3 4 2 2 1 1 0 Industry LEGAL arm 4 2-3 3 3 2 2 2 1 1 • Direct Industry/University Relationships that require different Intellectual Property Rights (IPR) Agreements: agreements take months • Centers or Large Collaborative Efforts • Endowed Chairs • Government/Industry ERCs • Sponsored Research Agreements • Industrial Consortia Memberships • Bilateral Research Agreements • Grants • Consulting Contracts • Student Internships Level of Difficulty ISPD IPR Panel 3April, 2001
IPR, the Semiconductor Industry, and Universities • Objective of university research for industrial researcher:1) research 2) students 3) relationship with professor(s). • Role of IPR to industrial researcher: protect the company. • Role of IPR to semiconductor companies: historically defensive, commercialize product not make money from IPR. • Semiconductor companies understand IPR relationships and how to do business with each other. • IPR relationship with universities is changing, infinite variety: • IPR policy and objectives changes with each university, each professor at each university, sometimes with students, technical topic, and research contract type. • Legal overhead becoming unmanageable. • Contamination of industrial IPR hampering relationships, research. ISPD IPR Panel 3April, 2001
Successful Negotiation: an Industry Point-of-View • The industrial and university researchers know how future IPR might be related to the research and what university background IPR might be relevant to the research - absolutely necessary for negotiation. • Industry notifies professor (and vice versa) when last proposal from industry is sent to university Technology Transfer. Professor checks on proposal 1-2 weeks later. • Industry researcher has easy access to industry contracts person or lawyer to assist with the process. • University researcher is interested in contractual issues, especially if the University is. • If professor, student, or university want the future IPR, then the professor must understand how to protect both the IPR and the industrial collaborator over time. ISPD IPR Panel 3April, 2001
Embedded System Design: Proposal Abstract Representation Implementation Platforms Architectural Platforms Specification Domains Refinement Verification Compilation/Synthesis/Configuration * Small aspects within GSRC Implementation Embedded System (HW/SW) Source:Ted Vucurevich Chief Architect Cadence Design Systems
DARPA University Optoelectronics Centers Entry of SRC and MARCO VLSI Today , Gigahertz Clocking (2000) Limits to CMOS, ~100Gahertz Clocking (2015?), Gigahertz Clocking (2000) Transition to Molecular & Quantum Devices, Densities to 1011 cm2, Clocking @ ?? Adapted from B. Leheny – 6/01
Engineering Down 40% Physics Down 20% Math Down 20% Academic R&D Sources By Discipline The Federal Government Must Balance Its Basic Research Portfolio to Support the ‘Hard Science-based’ Information Technology Engine That Produces the Annual Productivity Increases to Drive the U.S. Economy and Whose Performance, Cost and Size Drive Defense Capabilities.
Approaching a “Red Brick Wall”Challenges/Opportunities for Semiconductor R&D Year of Production: 1999 2002 2005 2008 2011 2014 DRAM Half-Pitch [nm]:180 130 100 70 50 35 Overlay Accuracy [nm]: 6545 35 25 20 15 MPU Gate Length [nm]: 140 85-90 65 45 30-32 20-22 CD Control [nm]:14 9 6 4 3 2 TOX (equivalent) [nm]: 1.9-2.51.5-1.91.0-1.5 0.8-1.2 0.6-0.8 0.5-0.6 Junction Depth [nm]: 42-7025-43 20-3316-26 11-19 8-13 Metal Cladding [nm]: 17 13100 0 0 Inter-Metal Dielectric K: 3.5-4.02.7-3.5 1.6-2.21.5 <1.5 <1.5
Tech Vectors Emerging Technology Sequence Quantum computing Defect Tolerant CNN Architecture molecular QCA 3D Integration Logic RSFQ QCA Molecular SET RTD-FET Magnetic RAM Phase Change Nano FG SET Mem Molecular Memory FD SOI Strained Si Non-classical CMOS Vertical TR FinFET Planar dbl gate From Ralph Cavin, SRC Time