Electrical Engineering Department Presenter: Robert MacKinnon Jr. Advisor: Prof. Mustafa Guvench

1. Design of a Test System and Packaging of SOI-MEMS Resonators for High Temperature Characterization Electrical Engineering Department Presenter:Robert MacKinnon Jr.Advisor:Prof. Mustafa Guvench Coauthor:Joshua Ward MEMS Test Setup: HP 54504A Digital Oscilloscope HP 5335A Universal Counter HP 4194A Spectrum Analyzer KI 213 Programmable Source MEMS wire bonding diagram Micro-Electro-Mechanical-Systems (MEMS) devices bring some of the miniaturization that was portrayed in the 1966 classic film “Fantastic Voyage” to reality. These tiny machines are being used as pumps, motors and sensors for a variety of different applications. USM Professor Mustafa Guvench has recently designed and fabricated a MEMS resonator for use in gas sensing and frequency control applications. Ordinarily these types of devices can be tested utilizing micro-manipulated electro-probing, however given the unique and varied environmental conditions of the potential applications; a new means of testing will need to be developed as part of chip research and development. The scope of this project is the packaging and testing of the resonator at high temperatures and under exposure to different gases and concentrations of gases. Once successful tested under these conditions, the MEMS resonators will provide a very inexpensive, reliable and miniature means of testing and monitoring atmospheric conditions. Potential uses may include many health and safety uses, as well as space exploration and defense applications. Wire bonding machine Virtual temperature controller SOI- MEMS chip, size 5 mm x 5 mm wire bonded to a 44-pin J-LDCC gold package Frequency Response of a SOI-MEMS Resonator Magnitude(yellow) & Phase(blue)