80 likes | 235 Views
Proposal of “ Mobility Management for VoIP: Mobile IP, SIP or H.323 ? ”. 資工三 B90902113 李森傑 資工三 B90902043 吳純誼 資管碩二 R91725042 陳大鈞. Introduction(1/2). Mobility support for Internet access has evolved and client may required VoIP services with mobile device.
E N D
Proposal of“Mobility Management for VoIP: Mobile IP, SIP or H.323?” 資工三 B90902113 李森傑 資工三 B90902043 吳純誼 資管碩二 R91725042 陳大鈞
Introduction(1/2) • Mobility support for Internet access has evolved and client may required VoIP services with mobile device. • The most concern is the disruption time to process the handoff of an VoIP session.
Introduction(2/2) • We can use the off-the-shelf technology in network layer with mobile ip. • Or we can add some new approaches in SIP or H.323 in application layer. • The main goal is to compare these solutions and find which one is the simplest or the best.
Approaches(1/3) • Mobility can be realized in the network layer by using mobile IP. • Draft for seamless handoff has been proposed such as fast handoff.
Approaches(2/3) • Mobility can also be realized in the application layer by using SIP. • MN can informs the CN via a SIP Re-INVITE message with any address change. • Shadow registration[1] can improve the performance during handoff.
Approaches(3/3) • We can also use H.323 to achieve mobility in application layer. • MVOIP[4] can improve the performance during handoff.
Reference(1/2) • [1]TED TAEKYOUNG KWON AND MARIO GERLA, SAJAL DAS, SUBIR DAS, "MOBILITY MANAGEMENT FOR VOIP SERVICE:MOBILE IP VS. SIP," IEEE Wireless Communications, October 2002. • [2]Archan Misra, Subir Das, Anthony J McAuley, "Hierarchical Mobility Management for VoIP Traffic," IEEE Milicom, 2001. • [3]H. Schulzrinne, E. Wedlund, "Application Layer Mobility Support using SIP," ACM Mobile Computing and Communications Review, July 2000 .
Reference(2/2) • [4]G. Ayorkor Mills-Tettey, David Kotz , “Mobile Voice over IP (MVOIP): An Application-level Protocol for Call Hand-off in Real Time,”Performance, Computing, and Communications Conference, 2002. 21st IEEE.